CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
About Us
Your Professional & Reliable Partner.
Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, ...
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Year Established

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Million+
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Million+
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China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM HIGH QUALITY
1. High-Quality Products: With over 19 years of experience, we offer best thermal interface materials(TIM). 2. Professional Guidance: ZIITEK team provides 1-to-1 service and technical guidance. 3. RoHS and Supplier Capability Assessment,company has strictly quality control system and professional test lab.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM DEVELOPMENT
1.Advanced Technology: Our team continuously explores emerging materials and advanced manufacturing processes. 2. Superior Product Design: Combine innovation with functionality to customize thermal interface materials to match your project. 3. Quality Assurance: All thermal interface materials with industry standards and undergo rigorous test.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM MANUFACTURING
1. Our factory was Inaugurated in 2006, spanning 10,000 square meters square meters 2. Our employing more than 1,000 people. 3. Advanced automatic machines, strictly process control system. Catering to both domestic and international markets, Ziitek offers customized services.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM 100% SERVICE
1. Online-service : 12 hours , Inquiry reply within fastest. 2. Working time: 8:00am - 5:30pm, Monday to Friday (UTC+8). 3. After-service: Even our products have passed strict inspection, if you find the parts can not work well, we will help you to deal with it and give you satisfactory solution.

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With the rapid increase in AI computing power, how can thermal graphite sheets break the "high-temperature shackles" of tablet computers?
With the rapid increase in AI computing power, how can thermal graphite sheets break the "high-temperature shackles" of tablet computers?   Against the backdrop of AI computing power surging and chip power consumption exceeding the kilowatt level, thermal conductive graphite sheets are emerging as the core solution to the heat dissipation challenges of tablet computers through material innovation and structural optimization. From the perspective of material properties, the various thermal conductivity characteristics of thermal conductive graphite sheets are well-suited to the heat dissipation requirements of AI chips. They can quickly and horizontally spread the heat generated by heat sources such as GPUs and CPUs throughout the entire heat dissipation module, preventing local overheating and the resulting frequency reduction and lag. Thermal graphite sheets are high-performance and cost-effective thermal interface materials. They are soft, flexible, lightweight, and have excellent EMI shielding performance. Their superior thermal conductivity can effectively solve common problems of thermal interface materials and ensure that the structural integrity is not lost during application. Moreover, they have a high thermal conductivity to help release and dissipate the generated heat or heat sources such as CPUs.   Product features of thermal conductive graphite sheets: Good thermal conductivity: 2.0W—1700W/mk High forming temperature, stable and reliable performance, no aging problem. Good flexibility, easy to die-cut and process, easy to install and use. Soft and flexible, thin and light in texture, with high EMI shielding effectiveness. Compliant with the EU RoHS Directive and meets the requirements for the absence of harmful substances such as halogens. As AI computing power surges at a rate of tenfold each year, heat dissipation is no longer a "background supporting role", but has become a crucial battlefield that determines the success or failure of technology implementation. With its material properties, technological iterations, and market validation, thermal graphite sheets are moving from consumer electronics to data centers, shifting from passive cooling to active thermal management, and have become indispensable "temperature guardians" in the AI era.
"Invisible Heat-dissipating Guardian" in Mobile Phone: Artificial Graphite Sheet
"Invisible Heat-dissipating Guardian" in Mobile Phone: Artificial Graphite Sheet   Playing two popular hand games, the mobile phone is as hot as a "small stove"; After a long video call, my back is too hot to hold ... Cell phone fever has become a high-frequency problem for contemporary people. When the mobile phone processor, battery and other components continue to "have a high fever", not only the performance will be greatly reduced, but also the service life may be affected. It is the artificial graphite sheet called "invisible heat dissipation guardian" that silently fights against high temperature inside the mobile phone. Artificial graphite flake is not natural graphite, but is made by high molecular polymer (such as polyimide film) through high temperature carbonization and graphitization. Under the microscope, it presents a unique lamellar structure, and the carbon atoms are arranged in a hexagonal lattice. This special microstructure gives it amazing thermal conductivity. Although the thickness is only 0.05-0.3mm, its in-plane thermal conductivity can reach 1500-1800 W/MK, far exceeding that of metallic aluminum (237 W/MK), which is called "heat dissipation black technology".   The heat conduction inside the mobile phone is a battle against time. When the processor, 5G chip and other components work, the artificial graphite sheet will quickly absorb heat like a "heat sponge", and then use its two-dimensional thermal conductivity to evenly spread the heat to the mobile phone case. Taking Snapdragon 8 Gen3 processor as an example, the core temperature can be reduced by 8-10℃ in the game scene with artificial graphite chips, which effectively avoids the jam caused by overheating. In the precise internal space of mobile phones, artificial graphite sheets are almost everywhere. As a "big heat generator", the processor is usually covered with multiple layers of graphite sheets, which work together with vapor chamber to quickly export the core heat; When the battery is charged quickly, it is easy to generate heat accumulation, and the graphite sheet can disperse heat in time to prolong the cycle life of the battery. Even the "small heat sources" such as 5G antenna and camera module are wrapped with graphite sheets to ensure the uniform temperature of the whole machine.   Compared with traditional heat dissipation materials, artificial graphite sheet has incomparable advantages. Its thin and light features make mobile phone designers love it-the thickness of ——0.1mm hardly takes up space, but it can achieve efficient heat dissipation; Flexibility allows it to perfectly fit complex structures such as curved screens and special-shaped motherboards; Coupled with controllable cost and strong mass production, more than 90% of flagship mobile phones now list it as standard. However, as the performance of mobile phones continues to soar, artificial graphite sheets are also facing new challenges. In the face of the upcoming 2K 144Hz high-power components such as screens and AI chips, it is difficult to meet the heat dissipation requirements only by graphite sheets. The industry is exploring to combine it with graphene, VC vapor chamber and other materials to break through the bottleneck through a multi-layer composite cooling scheme. From 4G to 5G, from ordinary chips to AI computing units, artificial graphite sheets have always been the backbone of mobile phone heat dissipation. In the future, with the popularity of folding screens and wearable devices, this "invisible heat guard" will continue to evolve to protect our smart life. The next time the mobile phone is hot, imagine that this material as thin as cicada's wings is fighting fiercely with high temperature inside.
From CPU to IGBT: Thermal Conductive Paste Selection and Thermal Management Optimization Guide
From CPU to IGBT: Thermal Conductive Paste Selection and Thermal Management Optimization Guide   With the continuous increase in the power density of electronic devices, effective thermal management has become a key factor in ensuring the reliability and performance of the system. From the central processing unit (CPU) of personal computers to IGBTs in the power electronics field, if the heat generated by electronic components during operation cannot be promptly dissipated, the temperature will rise sharply, which will affect the performance of the equipment, shorten its service life, and even cause malfunctions.   Thermal conductive silicone is a common type of thermal interface material, which is widely used in the cooling systems of various electronic devices due to its excellent thermal conductivity, convenient application, and cost advantages. However, in response to the diverse requirements of different application scenarios, how to scientifically select and use thermal conductive silicone to achieve good thermal management results remains a practical challenge for engineers. Thermal conductive silicone is a paste-like composite material composed of an organic silicon matrix and a conductive filler. Its working principle is to fill the microscopic gaps between the heat sink and the heating element, remove the air between the interfaces, and establish an effective heat conduction channel. The key performance indicators of thermal conductive silicone include thermal conductivity (typically ranging from 1.2 to 25 W/m·K), thermal resistance (significantly affected by thickness and contact area), operating temperature range (-40°C to 200°C), dielectric strength (important for insulation applications), and rheological properties such as viscosity and thixotropy. Additionally, the stability of performance over long-term use, including resistance to aging, drying, and pump-out ability, is also a factor to consider in practical applications. Thermal conductive silicone is a key material for thermal management in electronic devices. The correct selection and application of this material have a significant impact on the performance and reliability of the devices. In the future, as the power density of electronic devices continues to increase and the application scenarios become more diverse, the technology of thermal conductive silicone will develop towards higher thermal conductivity, better stability, and greater intelligence.

2025

08/18

The helpful companion of the heat dissipation module - thermal conductive silicone sheet
The helpful companion of the heat dissipation module - thermal conductive silicone sheet The heat dissipation module is a module unit used for heat dissipation in systems, devices, and equipment. Using a heat dissipation module for cooling is one of the limited heat dissipation methods for most compact electronic products at present, and it is also the main heat dissipation method. In heat dissipation modules, similar products such as thermal conductive silicone sheets are mostly used to assist in heat dissipation, and the combination of the two achieves a better heat dissipation effect.   First of all, the thermal conductivity range of the thermal silicone sheet is very wide, ranging from 1.2 W/mk to 25 W/mk. Generally, as long as the temperature difference required by the product can be achieved, it is sufficient. If the thermal conductivity requirement is not very high, then a low thermal conductivity silicone sheet can be used. Because these silicone sheets have good cost performance, reasonable prices, stable performance and good thermal conductivity. Because the thermal conductive silicone sheet is very soft and has good compressibility, the compression ratio of the thermal conductive silicone sheet is over 20% (depending on the specific product hardness), so when choosing the thickness of the thermal conductive silicone sheet, the compression ratio issue must be taken into consideration. This will enable the thermal conductive silicone sheet to fit better between the heat source and the heat sink, significantly increasing the effective contact area and thereby improving the heat conduction effect.   Note: When choosing a heat dissipation module, using a heat-conducting silicone film is not about having the highest thermal conductivity. Instead, it depends on specific circumstances to select the appropriate product. Also, it's not that the more expensive it is, the better it is. Choosing the right one or the suitable one is what makes it good.  

2025

08/11

The "savior" of computer CPU's heat dissipation performance-thermal conductive gel
The "savior" of computer CPU's heat dissipation performance-thermal conductive gel   When the computer is running, the CPU runs at a high speed like a "brain", which generates a lot of heat. If the heat can't be released in time, the CPU temperature will soar, which will directly lead to a sudden drop in the running speed of the computer, frequent jamming, even a crash, blue screen and other conditions, and even shorten the service life of the hardware in serious cases.For gamer, video editors and other people who need computers to run with high load for a long time, the heat dissipation problem is a "roadblock" that affects the work and entertainment experience. Therefore, heat dissipation is very important for CPU, and thermal conductive gel plays an indispensable role in it. How does it play its role? Thermal conductive Gel, also often called thermal conductive gap filler materials, is a kind of high thermal conductive material specially developed to solve the problem of heat conduction, which plays a key role in the field of heat dissipation of electronic equipment. It is mainly made of silicone grease, which has good insulation and chemical stability and can provide stable structural support for thermal conductive gel. Metal oxides (such as alumina, zinc oxide, etc.) and some special heat conducting materials (such as silver powder, ceramic particles, etc.) are also added as heat conducting fillers. These thermal conductive fillers are the key to improve the thermal conductivity of thermal conductive gel. They are like efficient heat transfer messengers, which can quickly capture and transfer heat.   Compared with ordinary thermal conductive materials, the thermal conductivity of thermal conductive gel is much higher. This means that it can transfer the heat generated by the CPU to the radiator at a faster speed. For overclocking players who pursue extreme performance, and users who need the computer to run under high load for a long time (such as those who do large-scale 3D modeling and rendering work), this efficient heat conduction ability is very important and can effectively avoid the performance bottleneck caused by overheating.   Compared with thermal conductive pad, thermal conductive gel has wider applicability. Regardless of the shape and size of the CPU, it can be perfectly adapted. The daubing installation process is simple and easy to understand, and even novices can get started quickly. Moreover, when it needs to be replaced in the future, it is more convenient to clean up the residue, and it will not be as difficult to handle as some materials. Among the materials to improve heat dissipation performance, the price of thermal conductive gel is relatively close to the people. For users who want to improve the heat dissipation of computers and don't want to invest too much budget in this area, it is undoubtedly an ideal choice with high cost performance. Spending a little money can get obvious performance improvement, which is favored by the majority of users.   To sum up, thermal gel plays an important role in the heat dissipation of computer CPU, which provides strong support for improving computer performance with its excellent thermal conductivity, flexible ease of use and high cost performance. For users who want to improve the heat dissipation of computers, they may try to use thermal gel, which may bring unexpected results. With the continuous development of science and technology, the future heat dissipation materials will move towards a more efficient, safer and more convenient direction, and the thermal conductive gel is also expected to show greater potential in the technological upgrading and continue to contribute to computer heat dissipation.  

2025

07/28