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Invisible "radiator" of electronic equipment: magical application of heat conduction pad   The common problems, such as the sudden jamming of the mobile phone when playing games, the fan spinning wildly when the laptop is running software, and the disconnection of the router after working for a long time, mostly stem from the "fever crisis" of electronic equipment. Electronic components will continue to generate heat when working. If the heat cannot be discharged in time, it will not only reduce the performance of the equipment, but also shorten the service life and even cause safety hazards. In many heat dissipation schemes, the seemingly inconspicuous thermal pad is the key role to solve this problem. What is a thermal pad? Thermal pad is a kind of polymer composite material with silica gel as the core substrate and mixed with high thermal conductivity fillers such as metal oxides (such as alumina) and carbon materials (such as graphene). It is soft in texture, can be cut at will, and can be attached to the surface according to the shape of electronic components. It is not as hard and rigid as a metal heat sink, and it does not need complicated application of liquid thermal paste.   It seems that the electronic components are closely attached to the radiator, but there is actually a tiny gap, and the air in the gap has extremely poor thermal conductivity (only one thousandth of that of metal), which will form a "thermal barrier". The core function of the thermal pad is to fill these gaps, remove air, minimize the thermal resistance, and let the heat generated by the components be quickly transferred to the radiator, and then discharged through fans, cooling holes and other means to achieve efficient heat transfer.   Specific application of thermal pad in different electronic components; (1) Computer field CPU and graphics card are the "big fever families" of computers, especially the high-performance graphics cards of game books or desktops, and the working temperature can soar above 80℃. Between these components and the heat dissipation module, the heat conduction pad can closely adhere to the uneven surface, and cooperate with the heat pipe to quickly conduct away the heat, so as to avoid CPU frequency degradation due to overheating and graphics card jamming due to high temperature, and ensure the continuous high-performance operation of the equipment. ​   (2) Communication equipment Communication equipment such as base stations and routers need to work 24 hours a day, and internal signal processing chips and power modules will continue to generate heat. If the temperature is too high, the signal may be interrupted. The heat-conducting pad is installed between these heating elements and the equipment shell (or built-in heat sink), which can stably export heat without additional power supply and ensure the smooth and stable communication signal. ​   (3) Automotive electronics Battery management system (BMS) and on-board computer of new energy vehicles are extremely sensitive to temperature. Too high or too low temperature will affect battery life and driving safety. By virtue of its resistance to high and low temperature (-40℃~200℃), the thermal pad can fit the battery pack and the heat dissipation plate, adjust the temperature in real time, and be insulated and nonconductive, thus avoiding the risk of short circuit. ​   (4) Consumer electronic products Smart phones and tablets are too small to accommodate large heat sinks. Sticking thin thermal pads on the surfaces of processors, power amplifiers and other components can quickly transfer heat to the fuselage shell, reduce the phenomenon of "local burning", make users more comfortable to hold, and avoid the aging of components due to high temperature. ​   (5) LED lighting Although the LED lamp saves energy, the light source chip will still generate heat when it works. If the heat accumulates, it will lead to the dimming of the light and shorten the service life. The heat conducting pad is sandwiched between the LED light source and the heat dissipation substrate, which can efficiently conduct heat, keep the LED lamp stable in brightness, and prolong its service life by more than 30%. Compared with other heat dissipation materials, the thermal pad has outstanding advantages: first, it has strong insulation to avoid short circuit of components; Second, it has good flexibility and adapts to complex surfaces; Third, the installation is convenient, and it can be pasted after cutting without professional tools; Fourth, it is stable for a long time, not prone to aging and deformation, and can continue to play a heat dissipation role without frequent replacement. ​   When selecting, focus on three core indicators: First, thermal conductivity (unit: w/(MK)), the higher the value, the better the thermal conductivity, just choose 1-3 w/(MK) for ordinary equipment and 5 w/(MK) or above for high-performance equipment; Second, the thickness, according to the gap between the component and the radiator, is generally 0.5-5mm, too thick will increase the thermal resistance; The third is the working temperature range, which ensures the matching with the working environment of the equipment. For example, the automobile electronics needs to choose high and low temperature resistant models. ​   From daily mobile phones and computers to industrial communication base stations and automobile electronics, the thermal pad acts as an "invisible guardian" to ensure the stable operation of electronic equipment. With the development of technologies such as 5G and new energy vehicles, the requirements for heat dissipation will be higher, and the future thermal pads will be upgraded in the direction of higher thermal conductivity, lighter and more environmentally friendly, which will continue to "cool down" the development of the electronics industry.

Glory Escort: Ziitek Thermal Conductive Materials Assist Shanghai Terjin Unmanned Aerial Vehicle, Safeguarding Low-Flying Safety on the Victory Day of the "September 3rd Military Parade"   On the morning of September 3, 2025, a grand ceremony was held in Beijing to commemorate the 80th anniversary of the victory of the Chinese People's Resistance Against Japanese Aggression and the World Anti-Fascist War. Above Tiananmen Square, fighter jets were soaring, and on the ground, a continuous stream of vehicles was moving. A grand military parade was held. This military parade was of great significance. Many new types of equipment were showcased, among which unmanned and anti-unmanned equipment, as key components of new quality combat capabilities, demonstrated the leapfrog development of China's national defense science and technology.   Behind this highly anticipated and historic event, there was countless hours of meticulous preparation and strict protection. The hundreds of sets of unmanned aerial vehicle detection and defense equipment dispatched by Shanghai Special Forces served as the "invisible shield" for ensuring low-altitude safety at the scene. Once again, they did not disappoint and successfully completed the security mission, ensuring the safety of the military parade. The unmanned aerial vehicle (UAV) jammer/interference device of Shanghai Terjin is the core component of the low-altitude defense system. During the execution of tasks, the internal high-power radio frequency chips (RF Chips) and digital signal processors (DSP/FPGA) and other core components will generate a large amount of heat. Especially when operating continuously in complex outdoor environments throughout the day, the heat dissipation poses a severe challenge:   Performance attenuation risk: Heat accumulation leads to an increase in the chip's junction temperature, causing "thermal throttling", resulting in a shorter shielding distance and slower response of the equipment, directly affecting the security effectiveness. Equipment reliability risk: Long-term operation under high temperatures will accelerate the aging of electronic components and even cause system downtime. In the context of major event support, any minor malfunction is unacceptable. Environmental adaptability requirements: The equipment must be able to withstand outdoor exposure to sunlight, rain, and changes in temperature throughout the day, and the heat dissipation materials must possess excellent long-term stability and weather resistance. Therefore, an efficient, stable and reliable cooling solution is the physical foundation that ensures Shanghai Tekin equipment is always in a good working condition and can successfully complete tasks without any problems.   In response to the high power, high integration and high reliability requirements of the Shanghai Terjin unmanned aerial vehicle shielding device, Ziitek Electronics has provided a professional thermal conductive material application solution to ensure the "cool" operation of the equipment. Between the high-power RF chip and the heat dissipation housing, there is a TIF thermal conductive silicone sheet.   1. By filling the gap between the chip and the metal shielding shell or the heat dissipation base plate with Mako thermal conductive silicone sheet, it is possible to effectively fill the air gap, establish a high heat conduction channel, and quickly transfer the heat generated by the chip to the device casing and release it into the external air. Excellent thermal conductivity: Offers a range of thermal conductivities: 1.2 - 25 W/m·K for selection, meeting the requirements of different heat flux densities. 2. Insulation and shock resistance: The material itself has excellent electrical insulation properties, which can protect the chip. At the same time, it is soft and has a buffering effect, making it suitable for vibrations and shocks in vehicle-mounted and outdoor mobile environments. 3. Easy installation: It can be pre-formed and has inherent micro-adhesiveness, making it convenient for quick installation and maintenance, and suitable for large-scale production. Between the central processor and the compact heat sink, TIG thermal conductive silicone grease   1. For CPU/FPGA chips with extremely limited space and high thermal conductivity requirements, MegaCool thermal conductive silicone grease should be adopted. It can completely fill the microscopic unevenness on the surface of the chip and the heat sink, achieving a low contact thermal resistance and realizing efficient heat dissipation. Excellent thermal conductivity: Offers a range of thermal conductivities: 1.5 - 5.6 W/m·K for selection. 2. Ultra-low thermal resistance: The high-purity filler formula ensures excellent thermal conductivity, effectively reducing the temperature of the core chip. 3. High-temperature stability: Resistant to high temperatures, non-curing, non-dripping. Its performance remains unchanged even under long-term high-temperature operation, ensuring the equipment operates stably and continuously. The success of every national event is the result of the joint efforts of enterprises along the entire industrial chain. Shanghai Terjin, with its outstanding technical strength, ensures the safety of low-altitude airspace in the country. Meanwhile, Ziitek, with its excellent thermal conductivity material technology, quietly safeguards the stable operation of Shanghai Terjin's unmanned aerial vehicle equipment.   Ziitek Electronic Materials Technology is honored to be able to contribute to the security work for the 9.3 Victory Day military parade in this way. Together with Shanghai Terjin and all national enterprises, we deeply cherish our sense of patriotism, fulfill the social responsibility of contributing to the country through the industry, and jointly build a solid low-altitude security defense line.

Glory Escort: Ziitek Thermal Conductive Materials Assist Shanghai Terjin Unmanned Aerial Vehicle, Safeguarding Low-Flying Safety on the Victory Day of the "September 3rd Military Parade"   On the morning of September 3, 2025, a grand ceremony was held in Beijing to commemorate the 80th anniversary of the victory of the Chinese People's Resistance Against Japanese Aggression and the World Anti-Fascist War. Above Tiananmen Square, fighter jets were soaring, and on the ground, a continuous stream of vehicles was moving. A grand military parade was held. This military parade was of great significance. Many new types of equipment were showcased, among which unmanned and anti-unmanned equipment, as key components of new quality combat capabilities, demonstrated the leapfrog development of China's national defense science and technology.   Behind this highly anticipated and historic event, there was countless hours of meticulous preparation and strict protection. The hundreds of sets of unmanned aerial vehicle detection and defense equipment dispatched by Shanghai Special Forces served as the "invisible shield" for ensuring low-altitude safety at the scene. Once again, they did not disappoint and successfully completed the security mission, ensuring the safety of the military parade. The unmanned aerial vehicle (UAV) jammer/interference device of Shanghai Terjin is the core component of the low-altitude defense system. During the execution of tasks, the internal high-power radio frequency chips (RF Chips) and digital signal processors (DSP/FPGA) and other core components will generate a large amount of heat. Especially when operating continuously in complex outdoor environments throughout the day, the heat dissipation poses a severe challenge:   Performance attenuation risk: Heat accumulation leads to an increase in the chip's junction temperature, causing "thermal throttling", resulting in a shorter shielding distance and slower response of the equipment, directly affecting the security effectiveness. Equipment reliability risk: Long-term operation under high temperatures will accelerate the aging of electronic components and even cause system downtime. In the context of major event support, any minor malfunction is unacceptable. Environmental adaptability requirements: The equipment must be able to withstand outdoor exposure to sunlight, rain, and changes in temperature throughout the day, and the heat dissipation materials must possess excellent long-term stability and weather resistance. Therefore, an efficient, stable and reliable cooling solution is the physical foundation that ensures Shanghai Tekin equipment is always in a good working condition and can successfully complete tasks without any problems.   In response to the high power, high integration and high reliability requirements of the Shanghai Terjin unmanned aerial vehicle shielding device, Ziitek Electronics has provided a professional thermal conductive material application solution to ensure the "cool" operation of the equipment. Between the high-power RF chip and the heat dissipation housing, there is a TIF thermal conductive silicone sheet.   1. By filling the gap between the chip and the metal shielding shell or the heat dissipation base plate with Mako thermal conductive silicone sheet, it is possible to effectively fill the air gap, establish a high heat conduction channel, and quickly transfer the heat generated by the chip to the device casing and release it into the external air. Excellent thermal conductivity: Offers a range of thermal conductivities: 1.2 - 25 W/m·K for selection, meeting the requirements of different heat flux densities. 2. Insulation and shock resistance: The material itself has excellent electrical insulation properties, which can protect the chip. At the same time, it is soft and has a buffering effect, making it suitable for vibrations and shocks in vehicle-mounted and outdoor mobile environments. 3. Easy installation: It can be pre-formed and has inherent micro-adhesiveness, making it convenient for quick installation and maintenance, and suitable for large-scale production. Between the central processor and the compact heat sink, TIG thermal conductive silicone grease   1. For CPU/FPGA chips with extremely limited space and high thermal conductivity requirements, MegaCool thermal conductive silicone grease should be adopted. It can completely fill the microscopic unevenness on the surface of the chip and the heat sink, achieving a low contact thermal resistance and realizing efficient heat dissipation. Excellent thermal conductivity: Offers a range of thermal conductivities: 1.5 - 5.6 W/m·K for selection. 2. Ultra-low thermal resistance: The high-purity filler formula ensures excellent thermal conductivity, effectively reducing the temperature of the core chip. 3. High-temperature stability: Resistant to high temperatures, non-curing, non-dripping. Its performance remains unchanged even under long-term high-temperature operation, ensuring the equipment operates stably and continuously. The success of every national event is the result of the joint efforts of enterprises along the entire industrial chain. Shanghai Terjin, with its outstanding technical strength, ensures the safety of low-altitude airspace in the country. Meanwhile, Ziitek, with its excellent thermal conductivity material technology, quietly safeguards the stable operation of Shanghai Terjin's unmanned aerial vehicle equipment.   Ziitek Electronic Materials Technology is honored to be able to contribute to the security work for the 9.3 Victory Day military parade in this way. Together with Shanghai Terjin and all national enterprises, we deeply cherish our sense of patriotism, fulfill the social responsibility of contributing to the country through the industry, and jointly build a solid low-altitude security defense line.