Quality Thermal Pad & Thermal Grease Manufacturer

Solving the "thermal anxiety" of AI data center: Three high thermal conductivity materials of Ziitek are the cooling stability of CPU/GPU   When AI big model and VR/AR are running wildly, the CPU and GPU in the data center are experiencing "high temperature baking test"-they are both the core of computing power and the number one heat source. Once the heat dissipation can't keep up, not only will the stability of the equipment be discounted, but the energy consumption and operation and maintenance costs will also rise. The key to solve this heat dissipation dilemma lies in a detail that is easily overlooked: the thermal interface material. So, where does the "heat anxiety" of the data center come from?   1. High thermal conductivity interface material: detailed explanation of the performance of three "cooling tools"   Heat-conducting silica gel sheet: a "flexible heat-conducting sheet" suitable for complex scenes. Core performance: The thermal conductivity is usually 1.0~13W/(m? K), with excellent flexibility and insulation, the product has a fire protection grade of UL94-V0, with self-adhesive property without additional adhesive, which can be customized according to the gap thickness of equipment; Application scenario: the very strict joint area between CPU/GPU radiator and motherboard and the gap filling of storage device module-it can adapt components with different heights at the same time to avoid equipment damage caused by hard contact; Advantages of AI scene: Facing the dense component layout in AI server, it can flexibly fill irregular gaps, taking into account heat conduction efficiency and equipment protection.   2. Thermal conductive phase change material: an "intelligent thermal conductive layer" adapted with temperature. Core performance: it is solid at room temperature (easy to transport and install), and it will change into semi-liquid when the temperature reaches 50~60℃, which closely adheres to the surface of chip and heat sink; Application scenario: the core heat dissipation surface of high-performance CPU/GPU-it can fill nano-scale micro-cracks after phase change, greatly reducing the interface thermal resistance; Advantages of AI scene: During the training of AI large model, the chip will be in a high-load and high-temperature state for a long time, and the phase change material can keep close contact continuously, avoiding the thermal conductivity fault of traditional solid materials due to thermal expansion and cold contraction. 3. Thermal conductive gel: the core performance of "heat flow accelerator" that breaks through the upper limit of thermal conductivity. The thermal conductivity directly exceeds 8.0W/(m? K) It has the fluidity of heat-conducting gel, and its temperature resistance ranges from-45℃ to 200℃. Even if the local temperature changes sharply due to the fluctuation of refrigeration system or long-term high load of equipment in the data center, it can maintain stable heat-conducting performance. Moreover, the products have passed UL94 V-0 flame retardant certification and RoHS environmental protection standards, which can not only ensure heat dissipation, but also avoid potential safety hazards at high temperature, and meet the needs of long-term stable operation of data centers. Applicable scenarios: AI accelerator cards, high-power GPU and other "high-heat-density core devices"; Advantages of AI scene: In the cluster of large computing power, the power consumption of a single chip continues to rise, and the gel with high thermal conductivity can quickly export the concentrated heat to avoid the frequency reduction of computing power caused by local overheating of the chip. The combined use of these materials is equivalent to installing a "layered effective cooling channel" for the core equipment of the data center-it can not only accurately match the cooling requirements of different devices, but also reduce the energy consumption of fans and air conditioners, and indirectly reduce the operating cost of the data center.

Artificial heat-conducting graphite sheet: Lightweight and flexible, unlocking new possibilities for cooling curved devices   In the wave of innovation in electronic device forms, curved design and folding shapes have become the mainstream trends in consumer electronics, vehicle terminals, and wearable devices. However, the irregularity of the curved structure and the space limitations within the devices have left traditional heat dissipation materials in a predicament of "difficult adaptation and poor heat dissipation" - rigid heat dissipation plates cannot fit the curved surface, heavy materials occupy internal space, and thin materials are unable to meet the requirements for effective heat dissipation.   The emergence of artificial heat-conducting graphite sheets, with their core advantage of being "thin, lightweight and flexible", has effectively solved the heat dissipation problems of curved devices, becoming a key support for the innovation of terminal products. "Thin and flexible" is the core highlight that makes it suitable for curved devices. The thickness of the membrane can be customized in multiple specifications. The thin and lightweight feature almost does not occupy the internal space of the device, perfectly aligning with the design concept of "lightweighting and ultra-thinness" for curved and foldable devices. It also has excellent flexibility and bending performance, which can be freely fitted according to the curvature and contour of curved devices. Whether it is the curved edge of a curved-screen phone, the hinge area of a foldable laptop, or the curved display of a vehicle dashboard or wearable devices, it can closely cover the heat dissipation surface, achieving efficient and effective heat dissipation without any dead zones. This effectively solves the industry problem of traditional heat dissipation materials being "strongly rigid and poorly compatible".   In addition to its core adaptability advantage, the manually heated graphite sheet also has the characteristics of easy processing and wide adaptability. It supports precise die-cutting according to the size, shape and heat dissipation requirements of different devices, and can be customized with special specifications such as irregular shapes and holes, to meet the personalized heat dissipation needs of various curved surface devices. From curved screen mobile phones to foldable terminals, from curved central control units for vehicles to smart wearable devices, artificial heat-conducting graphite sheets have become the preferred solution for heat dissipation in curved devices due to their core characteristics of "high thermal conductivity, ultra-thinness, strong flexibility, and easy adaptability". It not only breaks the form limitations of traditional heat dissipation materials, but also helps terminal products achieve dual breakthroughs in design innovation and performance improvement, allowing curved devices to not only have stunning appearance designs but also maintain stable and smooth usage experiences.  

The heat dissipation savior is here! TIC800G thermal conductive phase change material - why is it the "invisible armor" of photographer's SD cards?     Why do high-speed SD cards become "hot potatoes"? With the increase in resolution and shooting speed, data pours into the SD card at a rate of every second. This intense read-write operation causes the main control chip and storage units of the SD card to generate an astonishing amount of heat. If overheating occurs, it will directly lead to: 1. Triggering frequency reduction: To protect the hardware, the SD card will automatically reduce its read and write speeds, resulting in lagging in continuous shooting and interruption of video recording. 2. Data error risk: High temperatures are the enemy of the stability of electronic components, which may increase the risk of data write errors or loss. 3. Lifespan reduction: Prolonged operation under high temperatures will accelerate the aging of the internal components of the SD card.     So why is the TIC800G thermal conductive phase-change material such a perfect match for SD cards?   1. Accurate temperature control, continuous performance boost: By effectively regulating the temperature of the chip, it can prevent the SD card from reducing its speed due to overheating. This means that when you are recording high-definition videos for a long time or performing high-speed continuous shooting, you can enjoy a more stable and uninterrupted performance output. 2. Ultra-thin and flexible, without occupying space: The TIC800G thermal phase-change material can be made into very thin sheets, which can be easily inserted into the compact space inside the SD card without requiring any changes to the existing design. It is an ideal solution for addressing the heat dissipation problem of small electronic devices. 3. Interface filling, effective heat conduction: Its soft nature can effectively fill the air gap between the chip and the housing (air is a poor conductor of heat), establishing an effective "heat conduction bridge", significantly enhancing the overall heat dissipation efficiency. 4. Reliable and durable, safeguarding data security: By keeping the SD card operating at a certain temperature, it not only enhances the     stability for immediate use, but also protects the flash memory chips and the main control chip in the long term, prolonging the product's service life. This provides an insurance for your valuable data assets.   The invisible guardianship, the visible stability, unlocking the unknown potential In today's era of rapid development in photography technology, stability and reliability have become a higher pursuit beyond mere parameters. The TIC800G thermal conductive phase change material, this "cooling guardian" working silently within the SD card, is precisely an embodiment of this pursuit. Although it is not visible externally, it is of vital importance and serves as a solid support to ensure that every professional creator does not miss any wonderful shots at critical moments.