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The application of TIF thermal pad in GPU: Innovation and challenge of heat dissipation technology   With its excellent thermal conductivity, TIF thermal pad has become an innovator in the field of GPU heat dissipation. It can closely fit the tiny gap between the GPU chip and the heat sink, effectively eliminate the thermal barrier of air, and build a smooth heat conduction path. With a thermal conductivity of 1.25 to 25W/(m·K), depending on the material formulation and manufacturing process, TIF thermal pad can quickly conduct the heat generated by the GPU to the radiator, significantly reducing the operating temperature of the GPU. There are often problems with uneven surfaces or small gaps between the GPU chip and the heat sink, which affects the efficiency of heat conduction. The TIF thermal conductive silicone sheet is soft and elastic, which can give full play to its stress buffer function and effectively avoid the risk of hardware damage caused by local stress concentration. At the same time, it can be tightly fitted on the surface of the GPU to form a seamless heat transfer layer, reducing thermal resistance and improving heat transfer efficiency.     The TIF thermal conductive silicone sheet also has good electrical insulation performance, which can build a solid electrical barrier between the GPU chip and the heat sink to ensure the stable operation and safe use of the device. Assembly flexibility and adaptability TIF thermal pad are easy to process and cut, and can adapt to the needs of different shapes and thicknesses. It is especially suitable for the internal design of equipment with complex structure or limited space, and provides more possibilities for the optimization of GPU cooling schemes. Whether it is a desktop, laptop or server application scenario, TIF therma pad can be easily handled to ensure the unimpeded heat transfer. Despite the softness and compressibility of TIF thermal pad, it is still a challenge to ensure a tight fit between them and the GPU surface in practical applications. Small gaps or bubbles can affect the efficiency of heat transfer, so professional tools and methods need to be used during the installation process to ensure a suitable fit. Different GPU models and heat dissipation requirements have different performance requirements on thermal conductive silicone sheets. Therefore, when choosing a TIF thermal conductive silicone chip, it is necessary to measure its size and thickness according to the specific performance and heat dissipation requirements of the GPU to ensure a tight fit and heat transfer between the GPU surface and the heat sink. TIF thermal conductive silicone sheet may be affected by aging, pollution and other factors during use and reduce performance. Therefore, it needs to be maintained and replaced regularly to ensure its long-term stable operation. At the same time, the material quality and manufacturing process of thermal conductive silica gel sheet also directly affect its service life and reliability, and it is necessary to choose reputable suppliers and products. In short, the application of TIF thermal conductive silicone sheet in GPU heat dissipation not only solves the heat dissipation problem caused by high-performance computing, but also provides solid technical support for users and professional applications in pursuit of performance experience. With the continuous progress of GPU technology and the increasing demand for heat dissipation, TIF thermal pad will continue to play an innovative role in heat dissipation technology. At the same time, facing the challenges in practical applications, it is necessary to continuously optimize the performance of thermal conductive silicone sheets, select the right products, and strengthen maintenance and replacement work to ensure the stable operation and extend the service life of the GPU.

Welcome to visit ZIITEK booth at 2025 MWC Shanghai！！   ZIITEK Booth: N2. A83 Date: 18th to 20th June 2025 Add.: SNIEC Shanghai  

Thermal conductive silicone sheet: Empowering the automotive chassis control system and solving the heat dissipation dilemma   Driven by the waves of automotive electrification and intelligence, the chassis control system, as the core hub of the vehicle, is facing performance challenges. The integration degree of core components such as high-precision sensors, domain controllers, and electric actuators is constantly increasing, while complex working conditions such as high temperature, vibration, and humidity have become invisible shackles restricting the stability of the system. Thermal conductive silicone sheets, with their outstanding thermal management capabilities and reliability, have become a key solution to break through the heat dissipation bottleneck, safeguarding the safety and efficiency of the chassis control system. Thermal conductive silicone sheet: Reshaping the boundaries of thermal management with technology   1.Effective heat conduction, breaking through the heat flow bottleneck: By using high thermal conductivity silicone base material and combining with nano-scale filler technology, a low thermal resistance connection between the heating element and the heat sink is achieved. Experimental data show that under the same working conditions, the use of thermal conductive silicone sheets can reduce the junction temperature of the chip by 15-20℃, significantly delaying the risk of thermal failure.   2. Flexible adaptation to cope with complex working conditions: Anti-vibration design: The hardness of 30-80 Shore A is adjustable. It absorbs mechanical vibration energy and avoids contact surface cracking caused by thermal stress. Weather resistance breakthrough: Wide temperature range operation from -40℃ to 200℃, resistant to salt spray and oil erosion, ensuring long-term reliability. Insulation protection: Volume resistivity ≥1.0 × 10¹² Ω·cm, effectively isolating high-voltage components and enhancing the electromagnetic compatibility of the system. Product features of thermal conductive silicone sheets 1. Good thermal conductivity: 1.2W - 25W/mK 2. Fire resistance rating: UL94-V0 3. Multiple thickness options are available: 0.25mm-12.0mm 4. Hardness: 5 to 85shoreoo 5. High compressibility, soft and elastic, suitable for low-pressure application environments 6. Self-adhesive without the need for additional surface adhesives   Application Scenarios: Full-chain empowerment from traditional to intelligent   1. Electric power steering System (EPS) : Reduces temperature fluctuations in the motor drive module and enhances steering response accuracy. 2. Electronic Stability Program (ESP) : Ensures the stable operation of the hydraulic control unit under adverse working conditions and shortens the braking response time. 3. By-wire chassis: It provides a continuous low-temperature environment for redundant computing units to ensure the achievement of functional safety levels. 4. Air suspension control system: Optimize the heat dissipation of the solenoid valve group to extend the frequency and lifespan of suspension adjustment. From traditional fuel vehicles to smart electric vehicles, the heat dissipation requirements of chassis control systems have always evolved in tandem with technological innovations. Thermal conductive silicone sheets have been elevated from supporting roles to key technical carriers. Choosing a professional-level heat conduction solution is choosing the reliability and sustainability of future travel. When every bit of heat can be accurately dissipated, the "footwork" of the car can be more stable, providing users with a safe, effective and long-lasting driving experience.