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New Era of SD Card Cooling: TIC800G Heat Conductive Phase Change Material, Ensuring No Frequency Drop During High-Speed Continuous Shooting   For every photographer who strives for high quality, whether it's capturing the fleeting moments of wild animals with continuous shooting, or recording 4K/8K high-bitrate videos for a long duration, the camera is their trusted companion. However, have you ever experienced the embarrassing situation where the camera suddenly alerts "Device overheating, about to shut down"? When you blame it on the camera body, perhaps you have overlooked a crucial heat source - the SD card in your hand.   Today, we would like to introduce to you a "heat dissipation guardian" hidden within the SD card - Ziitek TIC800G thermal phase change material. It is quietly enhancing the reliability standards of high-performance storage. With the continuous improvement of resolution and burst shooting speed, data is pouring into the SD card at a rate of several gigabytes per second. These intense read and write operations will generate an astonishing amount of heat for the main control chip and storage units of the SD card.If overheated, it will directly lead to:   1. Triggered frequency reduction: To protect the hardware, the SD card will automatically reduce its read and write speeds, resulting in lag during continuous shooting and interruption of video recording. 2. Data error risk: High temperature is the enemy of the stability of electronic components, potentially increasing the probability of data write errors or loss. 3. Lifespan reduction: Long-term operation under high temperature will accelerate the aging of internal components in the SD card, affecting its service life. The TIC800G thermal conductive phase-change material is different from traditional heat sinks. It is a high-performance thermal conductive material based on phase-change technology. Its "phase change" property is precisely the secret to its heat dissipation:   1. Solid adhesion: At room temperature, it is like a soft solid pad that closely adheres to the heat-generating chip surface of the SD card. 2. Heat absorption phase change: When the chip temperature rises to a specific critical point, the material absorbs a large amount of heat and transforms from a solid state to a semi-fluid state. This process absorbs much more heat than the simple temperature rise of ordinary materials. 3. Uniform heat conduction: During the phase change, it can quickly spread the heat from the hot area to the entire material surface, and then dissipate it through the SD card casing or metal frame. 4. Cooling restoration: When the reading and writing tasks are completed and the chip temperature drops, TIC800G releases the stored heat and returns to the solid state, waiting for the next cycle. In summary, it is like a reusable "heat energy buffer pad", continuously absorbing and releasing heat, firmly controlling the chip temperature within the safe range.   So, why is TIC800G the "perfect match" for SD cards? 1. Precise temperature control, continuous performance: By effectively controlling the temperature of the chip, it can prevent SD cards from reducing their frequency due to overheating, ensuring a stable and smooth reading and writing experience during long periods of high-load shooting. 2. Ultra-thin and flexible, seamless integration: TIC800G can be made into ultra-thin sheets, easily fitting into the compact space inside SD cards without occupying additional volume, and meeting the heat dissipation requirements of small electronic devices. 3. Interface filling, high thermal conductivity: Its soft nature can fully fill the air gaps between the chip and the casing (air is a poor conductor of heat), establishing a "high heat conduction bridge", improving the overall heat dissipation efficiency. 4. Reliable and durable, safeguarding data security: By keeping SD cards working at an appropriate temperature, it not only enhances the stability for immediate use but also delays the aging of flash memory chips and the main control chip from a long-term perspective, adding a solid safeguard for your valuable data assets.

The annual conference and celebration of the Ziitek Group in 2025 was successfully held.

Ziitek’s Top Ten Products of 2025 At Ziitek Technology, we continue to lead the way in advanced thermal management. Our comprehensive portfolio of thermal interface materials and next-generation cooling solutions is designed to deliver exceptional performance and reliability for your components and devices. From aluminium heat sinks to vapour chambers—and every TIM in between—we provide solutions engineered for the demands of modern electronics.   As we count down to Chinese New Year , we’ll be unveiling our Top 10 Products of 2025. Each week, we’ll share details of our most popular products across our You-tube, Facebook and X channels, building up to the grand reveal of our number one product of the year.   Stay tuned as we celebrate the innovations that shaped 2025!   10、TIF700HZ Our countdown has officially begun. TIF700HZ is the 10th product on our sales report list. It is one of our new series of products. this economical gap pad remains a firm customer favourite despite its softness (45 Shore 00!) and offers 7.0W/mK conductivity ，It can fill the gaps between heating devices and heat sinks or metal bases. Its flexibility and elasticity enable it to cover very uneven surfaces. Its outstanding performance allows heat to be conducted from the heating device or the entire printed circuit board to the metal casing or diffusion plate, thereby improving the efficiency and lifespan of the heating electronic components.   For more information about this high-performance composite cooling pad, please click here: TIF700HZ ultra soft Thermal Pad. 9、TIF500-40-11US Another product ranked ninth is our ultra-soft hot pad series, which can help engineers and manufacturers simplify the assembly process, reduce rework and quality inspection time, and extend the service life of products-without affecting the thermal design margin at all. Its thermal conductivity is reaching 4.0W /MK.   For more information about this high-performance composite cooling pad, please click here: TIF500-40-11US cooling pad. 8、TIF800QE Holding its place at number 8th is our TIF800QE High thermal conductivity Thermal Pad, This high thermal conductivity gap pad is still the customer's favorite, although it is very soft (35 Shore 00! ) and provides a conductivity of 13W/MK.Thanks to its tacky surfaces, it conforms well to uneven surfaces, helping maintain low thermal impedance in cost-sensitive designs without compromising on performance.   Find out more about this ever popular pad here: TIF800QE High thermal conductivity Thermal Pad   7、TIG780-30 Ranked seventh on the list is our thermal conductive paste.This high-stability silicone-based grease has a thermal conductivity of 3.0W/mK, excellent wetting characteristics, and long-term reliability. It's ideal for applications where a very thin, uniform TIM layer is needed, for example: in IC-to-heatsink interfaces, CPUs, or tightly packed power modules.   Find out more about this best seller here: TIG780-30 Thermal Paste   6、TIR300 In at six is TIR300 Synthetic Graphite which brings its ultra-thin, lightweight, highly oriented graphite polymer film to the spotlight. As per our 2025 review, this material has in-plane conductivity up to 1,700W/mK, making it significantly better than copper in the XY axis. Its flexibility, low resistance, and great EMI shielding make it a go-to choice for spreading heat in highly compact designs where space and efficiency are at a premium.   Find out more about what makes this thermal graphite here: TIR300 Synthetic Graphite 5、TIA800FG For our number of fifth place is TIA800FG Thermal Tape, is a double-sided thermal interface tape which provides exceptional bonding properties between electronic components and heat sinks, eliminating the need for mechanical fasteners. TIA800FG can be offered in various formats such as sheets, rolls and die cut parts depending on the application and are proven reliability under various mechanical, thermal, and environmental stresses. widely used in LED, M/B, P/S, Heat Sink, etc., which can replace hot melt adhesive, screws, fasteners and other fixing methods.   Find out more about this product profile here: TIA800FG 4、TIF500-50-11U For our number four place is TIF500-50-11U Ultra Soft Thermal Pad, a high-performance silicone-based gap filler. It features 5.0W/mK thermal conductivity, a Shore 00 hardness of 27, and an impressive dielectric breakdown voltage of 5500V/mm. With its natural tack and availability in standard sheets or die-cut parts, it’s perfect for high-reliability applications where electrical insulation and conformability matter, like in power electronics or compact modules such as our M2.SSD range.   Find out more about this popular pad here: TIF500-50-11U Ultra Soft Thermal Pad 3、TIG780-52 In third place is TIG780-52 Silicone Thermal grease ,With a thermal conductivity of 5.2 W/mK, this one-part, fully cured compound delivers low impedance and outstanding reliability under extreme conditions such as thermal cycling, vibrations, and shock. Itssilicone formulation also minimises pump-out and degradation, making it ideal for long-life, mission-critical systems and silicone sensitive applications such as optoelectronics.   Find out more about this Silicone Thermal grease here: TIG780-52 Silicone Thermal grease     2、TIF100-30-05E The ninth-ranked product is the TIF100-30-05E ultra-soft Thermal pad, a high-performance silicone-based gap filler. It features 3.0W/mK thermal conductivity, a Shore 00 hardness of 35, and an impressive dielectric breakdown voltage of 5500V/mm. With its natural tack and availability in standard sheets or die-cut parts, it’s perfect for high-reliability applications where electrical insulation and conformability matter, like in power electronics or compact modules.   Find out more about this popular pad here: TIF100-30-05E Ultra Soft Thermal Pad      1、TIF700RES Topping our sales prodcuts list in 2025, the top item is the TIF700RES ultra-soft low-compression force thermal pad, which is our best-selling heat dissipation pad product. It combines 8.5W/mK conductivity with a low Shore 00 hardness of 10, giving you high thermal performance with excellent compliance and electrical isolation. Its dielectric breakdown voltage of >5500V/mm and wide operating temperature range of –45 °C to +200 °C make it a reliable choice across a broad spectrum of applications, from aerospace and EVs to AI, VR, and beyond, This best-selling silicone based gap pads is self-adhesive and does not require additional surface adhesives.   Find out more about our chart topping number one best seller for 2025 here: TIF700RES Ultra Soft Thermal Pad