CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
About Us
Your Professional & Reliable Partner.
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ ...
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Year Established

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Million+
Employees

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Million+
Annual Sales
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM HIGH QUALITY
1. High-Quality Products: With over 20 years of experience, we offer best thermal interface materials(TIM). 2. Professional Guidance: ZIITEK team provides 1-to-1 service and technical guidance. 3. RoHS and Supplier Capability Assessment,company has strictly quality control system and professional test lab.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM DEVELOPMENT
1.Advanced Technology: Our team continuously explores emerging materials and advanced manufacturing processes. 2. Superior Product Design: Combine innovation with functionality to customize thermal interface materials to match your project. 3. Quality Assurance: All thermal interface materials with industry standards and undergo rigorous test.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM MANUFACTURING
1. Our factory was Inaugurated in 2006, spanning 10,000 square meters square meters 2. Our employing more than 1,000 people. 3. Advanced automatic machines, strictly process control system. Catering to both domestic and international markets, Ziitek offers customized services.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM 100% SERVICE
1. Online-service : 12 hours , Inquiry reply within fastest. 2. Working time: 8:00am - 5:30pm, Monday to Friday (UTC+8). 3. After-service: Even our products have passed strict inspection, if you find the parts can not work well, we will help you to deal with it and give you satisfactory solution.

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Thermal Management of High-Power Electronic Devices: The Advantages of Using Ziitek High Thermal Conductivity Adhesive
Thermal Management of High-Power Electronic Devices: The Advantages of Using Ziitek High Thermal Conductivity Adhesive   With the rapid development of electronic devices towards higher integration and higher power density, the heat dissipation performance has directly determined the operational stability and service life of the devices. Especially in applications such as new energy vehicles, 5G communication, and high-performance computing equipment, traditional heat dissipation materials and solutions have been unable to meet the strict thermal conduction requirements. However, high thermal conductive gels, with their excellent gap-filling performance and ultra-low interface thermal resistance among other core characteristics, have gradually become the preferred solution for the thermal management of electronic devices. Ziitek high thermal conductivity gel is a fluid-based two-component thermal interface material. Compared with traditional thermal pads and silicone pastes, it has several significant advantages:   1. Excellent gap filling performance It has inherent high flow characteristics, which can fully adhere to the micro-convex and concave structures of the device surface and fill tiny gaps, significantly reducing the interface contact thermal resistance and effectively improving the overall heat dissipation efficiency.   2. High thermal conductivity and lower thermal resistance It can seamlessly and tightly adhere to the heat-generating components and heat sinks, allowing for faster and more balanced heat conduction, and is suitable for the heat dissipation requirements of high-power and high-heat electronic devices. 3. Compatible with automated mass production It is compatible with fully automatic dispensing equipment, enabling quantitative and accurate coating, suitable for large-scale production on assembly lines, which can not only improve production efficiency but also save labor and material costs.   4. Flexible assembly and easy installation It does not require cutting and shaping according to specifications, can be adapted to irregular and non-standard heat dissipation structures, is compatible with multiple types of equipment assembly, and has strong application adaptability.   At present, Ziitek's high thermal conductivity gel has been widely applied in numerous fields such as computer hardware, 5G communication base stations, vehicle electronics, semiconductor devices, heat dissipation modules, and thermal shock reduction equipment. In the entire cooling system, the high thermal conductivity gel can work in synergy with components such as the heat sink and heat spreader, comprehensively optimizing the thermal management effect of the entire machine. With the continuous iteration of electronic technology and the continuous expansion of application scenarios, the high thermal conductivity gel will undoubtedly occupy a more central position in the thermal management system of electronic devices.
Ziitek thermal and absorbing wave material: Empowering stable operation of electronic devices
Ziitek thermal and absorbing wave material: Empowering stable operation of electronic devices   In the current era where electronic devices are evolving towards miniaturization and high performance, heat dissipation and electromagnetic compatibility have become the key factors limiting product quality. Ziitek Electronics, as a national high-tech enterprise, has developed and produced heat dissipation and electromagnetic shielding materials. Through an integrated solution, these products safeguard various industry equipment. The Ziitek thermal conductive and absorbing material is made from a high-molecular silicone base, with the addition of ceramic powder, soft magnetic particles and other additives. It possesses excellent thermal conductivity and absorbing wave properties, enabling low interface thermal resistance under low pressure, facilitating heat transfer between the heating and cooling areas. It also absorbs electromagnetic noise and can perform multiple functions such as insulation, vibration reduction, and sealing. It meets the design requirements for miniaturization and ultra-thinness of equipment. The product is soft, lightweight, and easy to process and cut. It can be customized in various sizes and shapes according to needs, and is halogen-free, lead-free, in compliance with RoHs regulations, flame-retardant, and resistant to high temperatures. It has a wide working temperature range and combines environmental protection and safety advantages. Relying on its strong R&D capabilities and production support, Ziitek has established a professional R&D team and a complete testing laboratory, equipped with imported production and testing equipment, to ensure the stability and reliability of product performance. It has multiple core products such as the TIF900 series. The thermal conductivity ranges from 1.0W/mK to 4.0W/mK, and can meet the center frequency requirements of 2GHz to 12GHz. These materials are widely used in commercial communications, millimeter-wave applications, industrial electronics, instrument measurement, etc. They solve the problems of equipment heat dissipation and electromagnetic interference in all aspects, from 5G base stations, routers to automotive electronics, drones, aerospace, radar systems, etc. With a long-term commitment to the industry, Ziitek adheres to the philosophy of "Technology First, Customer Success". Not only does it offer high-quality thermal conductive and absorbing materials, but it can also tailor exclusive solutions for customers, using its strength to promote the high-quality development of the electronics industry.
Ziitek Technology Will Showcase COMPUTEX 2026 Taipei International Computer Exhibition.
Ziitek Technology Will Showcase COMPUTEX 2026 Taipei International Computer Exhibition. Ziitek Technology, a global leader in thermal management solutions with over 20 years of industry experience, will make a grand appearance at COMPUTEX International Computer Exhibition (booth: A0217) in Taipei, showcasing its high-quality solutions for the thermal management industry of data centers, and cooperate with global industry partners to explore opportunities for innovation and development of artificial intelligence electronics industry.     Since its establishment in 2006, ZIITEK Technology has been dedicated to the research and large-scale production of thermal interface materials. With long-term technological accumulation and continuous product iterations, the company's self-developed thermal management solutions have been widely applied in the fields of communication, new energy vehicles, aerospace and military, power, medical care, and consumer electronics. Thanks to their stable and reliable product performance, the company has received high recognition from global customers. At this exhibition, the enterprise will fully showcase its entire series of core thermal interface materials, fully demonstrating its core technical advantages in efficient heat conduction, material integration, and customized heat dissipation design.   In response to the stringent heat dissipation requirements of high-power and high-density electronic devices, ZIITEK Technology has independently developed carbon fiber thermal conductive materials, which are suitable for 5G equipment, high-end chips, AI servers, and power control units and other core devices. This product further improves the company's integrated technical system from basic materials, heat dissipation components to the overall heat dissipation system. It can efficiently solve the heat dissipation problems of high-end equipment and provide solid technical support for the green and efficient operation of data centers.

2026

05/28

Embarking on a New Journey Toward a Brighter Future | Groundbreaking Ceremony Successfully Held for Phase II of KUNSHAN ZIITEK’s Manufacturing Project
Embarking on a New Journey Toward a Brighter Future | Groundbreaking Ceremony Successfully Held for Phase II of KUNSHAN ZIITEK’s Manufacturing Project Good morning, distinguished leaders, guests, and friends,   Today, during this vibrant season of growth and renewal, we are delighted to gather here for the groundbreaking ceremony of Phase II of KUNSHAN ZIITEK’s manufacturing project. On behalf of Ziitek, I would like to extend our warmest welcome and sincere appreciation to all the leaders, partners, and friends joining us today.   We would especially like to thank the government authorities and officials of Lujia Town for their continuous support and guidance throughout this project. My heartfelt thanks also go to all Ziitek team members who have contributed to the preparation of this important event.   The launch of this project marks a significant milestone in Ziitek’s development journey. With a total investment of RMB 100 million and covering approximately 20 acres, the expanded facility will provide around 18,000 square meters of manufacturing space.   Upon completion, the new base will integrate R&D, manufacturing, and sales operations, further strengthening our capabilities in intelligent manufacturing and lean production. This project represents an important step forward in supporting Ziitek’s long-term growth and innovation strategy.     Today’s groundbreaking is not only the start of a construction project, but also a reflection of our commitment to sustainable development, operational excellence, and social responsibility.   Throughout the construction process, we will prioritize workplace safety, quality standards, and environmental protection. At the same time, the project will create more employment opportunities and contribute positively to local economic development.   To our construction partners, we look forward to working together with the highest standards of safety and quality to build a reliable and outstanding facility.   To all members of the Ziitek management team, close collaboration and dedication will be essential as we move forward. With determination, professionalism, and teamwork, we are confident that this project will be completed successfully and become a strong foundation for Ziitek’s future growth.   For more than 20 years, Ziitek has remained committed to innovation and excellence in thermal management materials. Today marks another important step toward our future, and we look forward to creating even greater value together with our customers, partners, and employees around the world.   Finally, thank you once again for your presence and support. We wish everyone good health, happiness, and continued success. Thank you.    

2026

05/21

Ziitek Technology will showcase 20 years of Thermal Innovation at 2026 Global data center Innovative development and application of liquid cooling Technical exhibition
Ziitek Technology will showcase 20 years of Thermal Innovation at 2026 Global data center Innovative development and application of liquid cooling Technical exhibition   Ziitek Technology, a global leader in thermal management solutions with over 20 years of industry experience, will make a grand appearance at the 5th Global Data Center Liquid Cooling Innovation Development and Application Technology Conference in 2026, showcasing its cutting-edge technologies and innovative achievements in the thermal management field to demonstrate its leading position in the industry. During the conference, Ziitek Technology will bring its core products and solutions to the B100 booth at the Shanghai Exhibition Center from May 18th to 20th, presenting a full range of innovative achievements from advanced thermal interface materials (TIM) to high-performance liquid cooling systems, providing new ideas and practical references for the global data center thermal management field. Since its establishment in 2006, Ziitek Technology has been deeply engaged in the research and development and manufacturing of thermal interface materials. With continuous technological iteration and innovation, its thermal management solutions have been widely applied in multiple core fields such as consumer electronics, telecommunications, industrial automation, electric vehicles, and high-density servers, earning high recognition and trust from global customers. At this conference, Ziitek will comprehensively display its full range of core thermal interface materials, fully demonstrating its profound accumulation and outstanding professional capabilities in thermal conductivity efficiency, material integration technology, and customized cooling design. In response to the growing heat dissipation demands of high-power and high-density equipment worldwide, Ziitek Technology has launched a modular liquid cooling system specifically designed for next-generation data centers, advanced servers, and power control units. The release of this series of products further highlights Ziitek's end-to-end full-stack thermal management solution capabilities, from materials to systems, from components to complete cooling modules, effectively addressing the world's most stringent heat dissipation challenges and providing strong support for the green, low-carbon, and efficient operation of data centers. To deepen interaction and communication with on-site visitors, a professional service team composed of experienced R&D engineers and technical advisors will provide one-on-one real-time technical consultation services, helping industry professionals accurately solve specific thermal design problems, obtain customized component selection and system architecture guidance, and achieve precise matching of technical needs and solutions. In addition to professional technical displays and consultations, Ziitek has also carefully designed the "Join the Cooling Warriors, Defeat the Heat Boss" theme interactive experience activity, which combines fun and knowledge. In the activity, professional wrestlers will join hands with participants to become "thermal energy warriors", symbolically fighting against the "heat boss" representing excessive heat, vividly highlighting the core role of advanced thermal energy technology in modern systems, allowing visitors to deeply understand the importance of thermal management technology in an entertaining and interactive way. A spokesperson for Ziitek said, "The 5th Global Data Center Liquid Cooling Innovation Development and Application Technology Conference is of milestone significance for Ziitek. It is not only an important platform for us to showcase our development achievements but also marks our successful transformation from a TIM technology innovator to a global supplier of comprehensive thermal management solutions. In the future, we will continue to focus on technological innovation, providing more competitive products and services to help global customers address various heat dissipation challenges."   Exhibition Details Event: Global data center Innovative development and application of liquid cooling Technical exhibition 2026 Date: May 18-20, 2025 Booth: No.2345 Longyang Road, Pudong New Area, Shanghai, China Website: www.ziitek.com.vn

2026

05/12