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Embarking on a New Journey Toward a Brighter Future | Groundbreaking Ceremony Successfully Held for Phase II of KUNSHAN ZIITEK’s Manufacturing Project Good morning, distinguished leaders, guests, and friends,   Today, during this vibrant season of growth and renewal, we are delighted to gather here for the groundbreaking ceremony of Phase II of KUNSHAN ZIITEK’s manufacturing project. On behalf of Ziitek, I would like to extend our warmest welcome and sincere appreciation to all the leaders, partners, and friends joining us today.   We would especially like to thank the government authorities and officials of Lujia Town for their continuous support and guidance throughout this project. My heartfelt thanks also go to all Ziitek team members who have contributed to the preparation of this important event.   The launch of this project marks a significant milestone in Ziitek’s development journey. With a total investment of RMB 100 million and covering approximately 20 acres, the expanded facility will provide around 18,000 square meters of manufacturing space.   Upon completion, the new base will integrate R&D, manufacturing, and sales operations, further strengthening our capabilities in intelligent manufacturing and lean production. This project represents an important step forward in supporting Ziitek’s long-term growth and innovation strategy.     Today’s groundbreaking is not only the start of a construction project, but also a reflection of our commitment to sustainable development, operational excellence, and social responsibility.   Throughout the construction process, we will prioritize workplace safety, quality standards, and environmental protection. At the same time, the project will create more employment opportunities and contribute positively to local economic development.   To our construction partners, we look forward to working together with the highest standards of safety and quality to build a reliable and outstanding facility.   To all members of the Ziitek management team, close collaboration and dedication will be essential as we move forward. With determination, professionalism, and teamwork, we are confident that this project will be completed successfully and become a strong foundation for Ziitek’s future growth.   For more than 20 years, Ziitek has remained committed to innovation and excellence in thermal management materials. Today marks another important step toward our future, and we look forward to creating even greater value together with our customers, partners, and employees around the world.   Finally, thank you once again for your presence and support. We wish everyone good health, happiness, and continued success. Thank you.    

Ziitek Technology will showcase 20 years of Thermal Innovation at 2026 Global data center Innovative development and application of liquid cooling Technical exhibition   Ziitek Technology, a global leader in thermal management solutions with over 20 years of industry experience, will make a grand appearance at the 5th Global Data Center Liquid Cooling Innovation Development and Application Technology Conference in 2026, showcasing its cutting-edge technologies and innovative achievements in the thermal management field to demonstrate its leading position in the industry. During the conference, Ziitek Technology will bring its core products and solutions to the B100 booth at the Shanghai Exhibition Center from May 18th to 20th, presenting a full range of innovative achievements from advanced thermal interface materials (TIM) to high-performance liquid cooling systems, providing new ideas and practical references for the global data center thermal management field. Since its establishment in 2006, Ziitek Technology has been deeply engaged in the research and development and manufacturing of thermal interface materials. With continuous technological iteration and innovation, its thermal management solutions have been widely applied in multiple core fields such as consumer electronics, telecommunications, industrial automation, electric vehicles, and high-density servers, earning high recognition and trust from global customers. At this conference, Ziitek will comprehensively display its full range of core thermal interface materials, fully demonstrating its profound accumulation and outstanding professional capabilities in thermal conductivity efficiency, material integration technology, and customized cooling design. In response to the growing heat dissipation demands of high-power and high-density equipment worldwide, Ziitek Technology has launched a modular liquid cooling system specifically designed for next-generation data centers, advanced servers, and power control units. The release of this series of products further highlights Ziitek's end-to-end full-stack thermal management solution capabilities, from materials to systems, from components to complete cooling modules, effectively addressing the world's most stringent heat dissipation challenges and providing strong support for the green, low-carbon, and efficient operation of data centers. To deepen interaction and communication with on-site visitors, a professional service team composed of experienced R&D engineers and technical advisors will provide one-on-one real-time technical consultation services, helping industry professionals accurately solve specific thermal design problems, obtain customized component selection and system architecture guidance, and achieve precise matching of technical needs and solutions. In addition to professional technical displays and consultations, Ziitek has also carefully designed the "Join the Cooling Warriors, Defeat the Heat Boss" theme interactive experience activity, which combines fun and knowledge. In the activity, professional wrestlers will join hands with participants to become "thermal energy warriors", symbolically fighting against the "heat boss" representing excessive heat, vividly highlighting the core role of advanced thermal energy technology in modern systems, allowing visitors to deeply understand the importance of thermal management technology in an entertaining and interactive way. A spokesperson for Ziitek said, "The 5th Global Data Center Liquid Cooling Innovation Development and Application Technology Conference is of milestone significance for Ziitek. It is not only an important platform for us to showcase our development achievements but also marks our successful transformation from a TIM technology innovator to a global supplier of comprehensive thermal management solutions. In the future, we will continue to focus on technological innovation, providing more competitive products and services to help global customers address various heat dissipation challenges."   Exhibition Details Event: Global data center Innovative development and application of liquid cooling Technical exhibition 2026 Date: May 18-20, 2025 Booth: No.2345 Longyang Road, Pudong New Area, Shanghai, China Website: www.ziitek.com.vn

25W/mK high-performance heat conduction! Ziitek TS-TIR700-25, unlocking a new solution for cooling high-heat flux devices   Today, with 5G, high-performance chips, optoelectronics and wearable devices continuously evolving towards higher integration, greater power, and miniaturization, the accumulation of internal heat in devices has become the core bottleneck restricting performance, lifespan and stability. Traditional thermal conductive materials either have insufficient heat conduction or have high interface thermal resistance, making it difficult to meet the requirements of demanding scenarios. The TS-TIR®700-25 series carbon fiber thermal pads launched by Ziitek Technology, with a stable thermal conductivity of 25W/mK, provide an efficient thermal management solution for high heat flux applications. This gasket is made of a high thermal conductivity carbon fiber and high molecular silicone composite system. Through precise manufacturing techniques, it constructs a directional heat-conducting pathway, significantly reducing the interface thermal resistance and enabling rapid and uniform heat conduction. This effectively prevents local overheating at the source and significantly improves the heat dissipation efficiency and equipment reliability.   25W/mK high thermal conductivity, with maximum heat dissipation efficiency； According to the ASTM D5470 standard test results, the thermal conductivity is stable at 25W/mK, far superior to conventional silicone gasket pads. It quickly discharges the heat from core heat sources such as chips and power devices, ensuring that the equipment operates at full capacity without overheating.   Low thermal resistance + low voltage compatibility, providing a more precise fit； With extremely low interface thermal resistance, it can well fill microscopic gaps under low voltage, adapting to precision components and compact structures, without damaging the elements or increasing assembly stress. It is stable and reliable for long-term use.   Ultra-thin and flexible, suitable for various thickness scenarios； The thickness ranges from 0.3 to 5.0mm. The standard thickness includes 0.3/0.5/1.0/1.5/2.0/2.5/3.0mm. It is lightweight, flexible, and can be die-cut for customization. It can easily adapt to narrow spaces and complex structures.   Wide temperature range and durability, safety and compliance； Operating temperature: -40℃~200℃, flame retardant grade reaches UL94 V-0, complies with RoHS requirements. It maintains stable performance and ensures safety in both high and low temperature, as well as long-term operation environments.   Non-viscous and easy to assemble, non-insulated design； The surface is non-sticky, making assembly and maintenance more convenient; non-insulated feature, suitable for professional thermal management scenarios with specific requirements for conductivity and heat conduction.   The application scenarios cover a wide range of high heat flux fields； 5G communication equipment: base stations, radio frequency units, small base stations, etc. - high-power components, stable heat dissipation ensures continuous signal transmission without interruption.   High-performance chips: CPU, GPU, AI acceleration cores and server cores, powerful temperature control, releasing computing power without frequency reduction. Optoelectronic industry: Optical modules, laser devices, high-definition display drivers, suppressing temperature rise, extending the lifespan of optoelectronic components. Wearable devices: Smart watches, VR/AR, health monitoring terminals, lightweight without a burdening feeling, long-lasting calmness and greater comfort. General high-heat scenarios: Between chips and heat dissipation modules, power devices, industrial control and other high-density heat dissipation demand scenarios.   For electronic devices, heat dissipation is key to competitiveness. The Ziitek TS-TIR®700-25, with its 25W/mK high thermal conductivity, low thermal resistance, lightweight, flexible and robustness across a wide temperature range, has become the preferred thermal interface material in 5G, high-performance chips, optoelectronics, wearable devices and other fields, helping products maintain stable output under harsh conditions.   Whether it's the development of new products or the upgrade of existing solutions, this carbon fiber heat transfer gasket can help you bridge the "last mile" of heat dissipation with high cost-effectiveness and high compatibility, making the equipment cooler, more durable and more powerful.