CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
About Us
Your Professional & Reliable Partner.
Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, ...
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Year Established

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Million+
Employees

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Million+
Annual Sales
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM HIGH QUALITY
1. High-Quality Products: With over 19 years of experience, we offer best thermal interface materials(TIM). 2. Professional Guidance: ZIITEK team provides 1-to-1 service and technical guidance. 3. RoHS and Supplier Capability Assessment,company has strictly quality control system and professional test lab.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM DEVELOPMENT
1.Advanced Technology: Our team continuously explores emerging materials and advanced manufacturing processes. 2. Superior Product Design: Combine innovation with functionality to customize thermal interface materials to match your project. 3. Quality Assurance: All thermal interface materials with industry standards and undergo rigorous test.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM MANUFACTURING
1. Our factory was Inaugurated in 2006, spanning 10,000 square meters square meters 2. Our employing more than 1,000 people. 3. Advanced automatic machines, strictly process control system. Catering to both domestic and international markets, Ziitek offers customized services.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM 100% SERVICE
1. Online-service : 12 hours , Inquiry reply within fastest. 2. Working time: 8:00am - 5:30pm, Monday to Friday (UTC+8). 3. After-service: Even our products have passed strict inspection, if you find the parts can not work well, we will help you to deal with it and give you satisfactory solution.

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GPU Heat Dissipation Core: Full Analysis of Ziitek's Three Commonly Used Thermal Interface Materials (TIM)
GPU Heat Dissipation Core: Full Analysis of Ziitek's Three Commonly Used Thermal Interface Materials (TIM)   The full utilization of GPU performance cannot be achieved without the support of a thermal management system. The thermal interface material (Thermal Interface Material, abbreviated as TIM), as the key core in the thermal conduction path, although hidden within the device, directly determines the heat dissipation efficiency and the long-term stability of the equipment. Ziitek will systematically analyze the three types of thermal interface materials commonly used in GPU heat dissipation scenarios, and explore their core advantages and typical applications, providing reference for relevant selection and design. I. Thermal Conductive Silicone Film: The Main Choice for General Adaptation The thermal conductive silicone film is one of the widely used TIM types in current GPU modules and server graphics cards for thermal management. It is made of organic silicone rubber as the base material, with conductive fillers such as aluminum oxide, boron nitride, and magnesium oxide added, and it possesses excellent flexibility, compressibility, and excellent electrical insulation properties. It can meet the requirements of most common cooling scenarios. Core advantages: - Excellent compressibility, capable of flexibly adapting to different assembly clearances and tolerance ranges, enhancing interface adhesion; - High electrical insulation level, allowing direct attachment to electronic components, ensuring safe and reliable use and reducing the risk of short circuits; - Supports automated assembly processes, suitable for mass production, improving manufacturing efficiency; - Strong long-term stability, unlikely to experience failure issues such as overflow or cracking under normal conditions, with a long service life.   Typical applications: GPU core module, graphics memory (VRAM) cooling, power inductor heat dissipation, server GPU array cluster, auxiliary cooling for regular desktop graphics cards. II. Thermal Conductive Paste: A High Heat Conductivity Medium for High-Power Scenarios Thermal conductive paste (also known as thermal paste) is a paste-like thermal conductive medium. With excellent wetting properties and interface infiltration capabilities, it can tightly fill the microscopic gaps between components and heat sinks, achieving low contact thermal resistance and being the core choice for short-term heat dissipation of high-power GPUs. Core Advantages - Outstanding thermal conductivity, suitable for the heat dissipation requirements of high-power GPUs; - Can be applied as an ultra-thin coating, with low thermal resistance, improving heat transfer efficiency and reducing heat accumulation; - Excellent short-term high-temperature stability, capable of stably handling heat dissipation conditions such as GPU full-load operation.   Typical Applications High-performance desktop GPU cores, AI acceleration cards, GPU systems with liquid cooling architectures, professional graphics workstation graphics cards.   III. Thermal Conductive Adhesive: A New All-Round Material for High-End Scenarios Thermal conductive adhesive is a new type of TIM material that has rapidly gained popularity in the high-end thermal management field in recent years. It combines the high thermal conductivity of thermal conductive paste with the structural stability of thermal conductive silicone sheets. It exists in a semi-solid state and possesses core characteristics such as being able to be dispensed, self-healing, having low volatility, and low stress. It is suitable for the complex heat dissipation requirements of high GPUs. Core Advantages - Excellent fluidity, capable of automatically filling irregular or complex interface gaps without the need for manual pre-treatment; - Strong long-term reliability, not prone to cracking, pumping out, or volatilization under harsh conditions such as high temperatures and vibrations; - Supports automated dispensing processes, suitable for intelligent manufacturing lines, improving production accuracy and efficiency; - Stable low thermal resistance performance, capable of long-term adaptation to continuous high-temperature conditions, meeting the continuous heat dissipation requirements of high GPUs.   Typical Applications Data center GPU server modules, vehicle-mounted GPU computing platforms, industrial AI computing devices, and GPU cooling systems for autonomous driving systems. With the rapid development of AI computing platforms and autonomous driving technologies, the application scenarios of high-power GPUs continue to expand, and the requirements for thermal management are also constantly upgrading. As the core component of the cooling system, thermal interface materials are evolving towards higher thermal conductivity, lower thermal resistance, better environmental adaptability, and longer service life. Reasonable selection and accurate matching of scenarios are necessary to fully unleash the performance of GPUs and lay a solid foundation for thermal management in various computing applications.    
Thermal Conductive Potting Compound Using Guide: Accurate operation procedure & Key precautions
Thermal Conductive Potting Compound Using Guide: Accurate operation procedure & Key precautions 1. Preparations: Establishing a solid base for encapsulation Thermal conductive encapsulation adhesive is prone to material stratification when stored for a long time. Before use, it is necessary to thoroughly mix the adhesive using a manual or mechanical mixer to ensure uniformity without sedimentation or stratification. At the same time, the working environment must be kept clean and dry. Dust, impurities, and moisture in the working area should be removed to prevent contaminants from mixing into the adhesive and affecting the sealing and bonding performance.   2. Mixing and Injection: Precise control of details The accurate proportion of each component is the key to ensuring the stability of the adhesive performance. According to the requirements of the product specification, the weighing error must be strictly controlled. After mixing the components in proportion, use a dedicated mixing tool to stir at a uniform speed until the mixture has a uniform color, no obvious color difference, and no particle sensation. During injection, either mechanical injection or manual pouring can be used to evenly cover the key areas of electronic components and circuit boards. Pay attention to the edges and gaps to ensure no omissions and no air bubbles. If necessary, apply a moderate amount of pressure to assist in eliminating air bubbles, further enhancing the sealing density.   3. Curing Process: Ensuring performance Curing is the final process for forming the protective performance of the thermal conductive encapsulation adhesive. Depending on the type of adhesive (such as room temperature curing or heating curing), strictly follow the set curing temperature and time as specified in the product manual. When heating curing, use a constant temperature device to accurately control the temperature to avoid excessive temperature damage to the adhesive molecular structure or insufficient curing due to low temperature. At the same time, ensure sufficient curing time and prohibit premature removal of the mold or immediate use to ensure complete cross-linking and curing of the adhesive, achieving excellent thermal conductivity, insulation, and protective performance.   To avoid sealing defects and ensure product reliability, the following key points need to be paid attention to during use: 1)Strictly control the shelf life: Before use, check the product's shelf life and strictly prohibit the use of expired adhesive. Avoid problems such as poor curing and adhesive failure due to performance degradation. 2)Standardize storage conditions: Store in a cool, dry, and sealed environment, away from direct sunlight and high-temperature heat sources, to prevent material stratification and deterioration of the adhesive. 3) Accurately measure the curing agent: The dosage of the curing agent directly determines the curing speed and the performance of the cured product. It is necessary to weigh it strictly according to the proportion specified in the manual to avoid overuse or underuse, ensuring a sufficient and stable curing reaction. 4) Ensure thorough mixing: During mixing, control the speed and duration to ensure uniform mixing of all components, avoiding incomplete curing and uneven performance due to uneven mixing in some areas. 5) Maintain a stable curing environment: During the curing process, keep the temperature constant to avoid temperature fluctuations that cause uneven curing; if it is a light-colored cured product, choose an environment with low ultraviolet exposure or take shading measures to prevent yellowing and aging of the color. In conclusion, strictly following the standard usage procedures and precautions for thermal conductive encapsulation adhesives can effectively avoid common problems such as bubbles, poor curing, and performance degradation, providing comprehensive insulation, moisture-proofing, thermal conductivity, and protection for electronic components. This not only enhances the overall reliability of electronic products but also extends their service life and ensures long-term stable operation.
Ziitek’s Top Ten Products of 2025
Ziitek’s Top Ten Products of 2025 At Ziitek Technology, we continue to lead the way in advanced thermal management. Our comprehensive portfolio of thermal interface materials and next-generation cooling solutions is designed to deliver exceptional performance and reliability for your components and devices. From aluminium heat sinks to vapour chambers—and every TIM in between—we provide solutions engineered for the demands of modern electronics.   As we count down to Chinese New Year , we’ll be unveiling our Top 10 Products of 2025. Each week, we’ll share details of our most popular products across our You-tube, Facebook and X channels, building up to the grand reveal of our number one product of the year.   Stay tuned as we celebrate the innovations that shaped 2025!   10、TIF700HZ Our countdown has officially begun. TIF700HZ is the 10th product on our sales report list. It is one of our new series of products. this economical gap pad remains a firm customer favourite despite its softness (45 Shore 00!) and offers 7.0W/mK conductivity ,It can fill the gaps between heating devices and heat sinks or metal bases. Its flexibility and elasticity enable it to cover very uneven surfaces. Its outstanding performance allows heat to be conducted from the heating device or the entire printed circuit board to the metal casing or diffusion plate, thereby improving the efficiency and lifespan of the heating electronic components.   For more information about this high-performance composite cooling pad, please click here: TIF700HZ ultra soft Thermal Pad. 9、TIF500-40-11US Another product ranked ninth is our ultra-soft hot pad series, which can help engineers and manufacturers simplify the assembly process, reduce rework and quality inspection time, and extend the service life of products-without affecting the thermal design margin at all. Its thermal conductivity is reaching 4.0W /MK.   For more information about this high-performance composite cooling pad, please click here: TIF500-40-11US cooling pad. 8、TIF800QE Holding its place at number 8th is our TIF800QE High thermal conductivity Thermal Pad, This high thermal conductivity gap pad is still the customer's favorite, although it is very soft (35 Shore 00! ) and provides a conductivity of 13W/MK.Thanks to its tacky surfaces, it conforms well to uneven surfaces, helping maintain low thermal impedance in cost-sensitive designs without compromising on performance.   Find out more about this ever popular pad here: TIF800QE High thermal conductivity Thermal Pad   7、TIG780-30 Ranked seventh on the list is our thermal conductive paste.This high-stability silicone-based grease has a thermal conductivity of 3.0W/mK, excellent wetting characteristics, and long-term reliability. It's ideal for applications where a very thin, uniform TIM layer is needed, for example: in IC-to-heatsink interfaces, CPUs, or tightly packed power modules.   Find out more about this best seller here: TIG780-30 Thermal Paste   6、TIR300 In at six is TIR300 Synthetic Graphite which brings its ultra-thin, lightweight, highly oriented graphite polymer film to the spotlight. As per our 2025 review, this material has in-plane conductivity up to 1,700W/mK, making it significantly better than copper in the XY axis. Its flexibility, low resistance, and great EMI shielding make it a go-to choice for spreading heat in highly compact designs where space and efficiency are at a premium.   Find out more about what makes this thermal graphite here: TIR300 Synthetic Graphite 5、TIA800FG For our number of fifth place is TIA800FG Thermal Tape, is a double-sided thermal interface tape which provides exceptional bonding properties between electronic components and heat sinks, eliminating the need for mechanical fasteners. TIA800FG can be offered in various formats such as sheets, rolls and die cut parts depending on the application and are proven reliability under various mechanical, thermal, and environmental stresses. widely used in LED, M/B, P/S, Heat Sink, etc., which can replace hot melt adhesive, screws, fasteners and other fixing methods.   Find out more about this product profile here: TIA800FG 4、TIF500-50-11U For our number four place is TIF500-50-11U Ultra Soft Thermal Pad, a high-performance silicone-based gap filler. It features 5.0W/mK thermal conductivity, a Shore 00 hardness of 27, and an impressive dielectric breakdown voltage of 5500V/mm. With its natural tack and availability in standard sheets or die-cut parts, it’s perfect for high-reliability applications where electrical insulation and conformability matter, like in power electronics or compact modules such as our M2.SSD range.   Find out more about this popular pad here: TIF500-50-11U Ultra Soft Thermal Pad 3、TIG780-52 In third place is TIG780-52 Silicone Thermal grease ,With a thermal conductivity of 5.2 W/mK, this one-part, fully cured compound delivers low impedance and outstanding reliability under extreme conditions such as thermal cycling, vibrations, and shock. Itssilicone formulation also minimises pump-out and degradation, making it ideal for long-life, mission-critical systems and silicone sensitive applications such as optoelectronics.   Find out more about this Silicone Thermal grease here: TIG780-52 Silicone Thermal grease     2、TIF100-30-05E The ninth-ranked product is the TIF100-30-05E ultra-soft Thermal pad, a high-performance silicone-based gap filler. It features 3.0W/mK thermal conductivity, a Shore 00 hardness of 35, and an impressive dielectric breakdown voltage of 5500V/mm. With its natural tack and availability in standard sheets or die-cut parts, it’s perfect for high-reliability applications where electrical insulation and conformability matter, like in power electronics or compact modules.   Find out more about this popular pad here: TIF100-30-05E Ultra Soft Thermal Pad      1、TIF700RES Topping our sales prodcuts list in 2025, the top item is the TIF700RES ultra-soft low-compression force thermal pad, which is our best-selling heat dissipation pad product. It combines 8.5W/mK conductivity with a low Shore 00 hardness of 10, giving you high thermal performance with excellent compliance and electrical isolation. Its dielectric breakdown voltage of >5500V/mm and wide operating temperature range of –45 °C to +200 °C make it a reliable choice across a broad spectrum of applications, from aerospace and EVs to AI, VR, and beyond, This best-selling silicone based gap pads is self-adhesive and does not require additional surface adhesives.   Find out more about our chart topping number one best seller for 2025 here: TIF700RES Ultra Soft Thermal Pad    

2026

01/23

Ziitek starts a new journey with running and condenses the future with strength.
Ziitek starts a new journey with running and condenses the future with strength.   Time flies and the struggle never stops. In 2025, Ziitek team kept walking, and deeply cultivated the field of heat conducting materials with concentration and enthusiasm; In 2026, we are ready to start and meet new challenges with a running attitude. Between crossing and moving forward, we use a morning run to wake up the vitality, and use a tug-of-war competition to unite and go to the next wonderful journey together! Running ---Welcome the light and start a new journey. In the early morning of January 2, 2026, when the first ray of sunshine shone on the earth, the Ziitek team had been assembled. As soon as the bell rang, everyone began to run. We bid farewell to 2025 in the running and bid farewell to yesterday's struggle with sweat. We are running into 2026, embracing the sun and welcoming the hope of the New Year. The scenery passes by along the way, and the hearts are full of enthusiasm, which is a vivid portrayal of Ziitek team's "focus on moving forward".   Let's twist into a rope and show off together After running in the morning, the tug-of-war field is in full swing! One rope, one heart, one strength-R&D, production, quality, engineering and sales teams hold on to the long rope, and it is not only strength but also trust that supports each other. In the shouting, winning or losing is not important. At this moment, we really realize that the team is our most solid "thermal conducting material", which transmits energy and condenses warmth.   Go forward to a new future together 20 years of concentration, the initial heart does not change. From heat-conducting materials to team spirit, Ziitek always believes that the real "thermal conduction" is the resonance between people and the link between heart and heart. This activity is not only a physical exercise, but also a tempering of team spirit. Let's take the temperature of walking side by side, with more enthusiasm and high-spirited attitude, and invest in the journey of the new year! In 2026, Ziitek team’s are ready: In the process of moving forward, save enough new power. Pass warmth in collaboration, Go to a more exciting future hand in hand! Morning running and tug-of-war activities are just the starting point. In 2026, more team activities and cultural construction will be launched one after another. Pay attention to Ziitek, join us, run out of acceleration and spell out new heights!

2026

01/07