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Ziitek Technology will showcase 20 years of Thermal Innovation at 2026 Global data center Innovative development and application of liquid cooling Technical exhibition   Ziitek Technology, a global leader in thermal management solutions with over 20 years of industry experience, will make a grand appearance at the 5th Global Data Center Liquid Cooling Innovation Development and Application Technology Conference in 2026, showcasing its cutting-edge technologies and innovative achievements in the thermal management field to demonstrate its leading position in the industry. During the conference, Ziitek Technology will bring its core products and solutions to the B100 booth at the Shanghai Exhibition Center from May 18th to 20th, presenting a full range of innovative achievements from advanced thermal interface materials (TIM) to high-performance liquid cooling systems, providing new ideas and practical references for the global data center thermal management field. Since its establishment in 2006, Ziitek Technology has been deeply engaged in the research and development and manufacturing of thermal interface materials. With continuous technological iteration and innovation, its thermal management solutions have been widely applied in multiple core fields such as consumer electronics, telecommunications, industrial automation, electric vehicles, and high-density servers, earning high recognition and trust from global customers. At this conference, Ziitek will comprehensively display its full range of core thermal interface materials, fully demonstrating its profound accumulation and outstanding professional capabilities in thermal conductivity efficiency, material integration technology, and customized cooling design. In response to the growing heat dissipation demands of high-power and high-density equipment worldwide, Ziitek Technology has launched a modular liquid cooling system specifically designed for next-generation data centers, advanced servers, and power control units. The release of this series of products further highlights Ziitek's end-to-end full-stack thermal management solution capabilities, from materials to systems, from components to complete cooling modules, effectively addressing the world's most stringent heat dissipation challenges and providing strong support for the green, low-carbon, and efficient operation of data centers. To deepen interaction and communication with on-site visitors, a professional service team composed of experienced R&D engineers and technical advisors will provide one-on-one real-time technical consultation services, helping industry professionals accurately solve specific thermal design problems, obtain customized component selection and system architecture guidance, and achieve precise matching of technical needs and solutions. In addition to professional technical displays and consultations, Ziitek has also carefully designed the "Join the Cooling Warriors, Defeat the Heat Boss" theme interactive experience activity, which combines fun and knowledge. In the activity, professional wrestlers will join hands with participants to become "thermal energy warriors", symbolically fighting against the "heat boss" representing excessive heat, vividly highlighting the core role of advanced thermal energy technology in modern systems, allowing visitors to deeply understand the importance of thermal management technology in an entertaining and interactive way. A spokesperson for Ziitek said, "The 5th Global Data Center Liquid Cooling Innovation Development and Application Technology Conference is of milestone significance for Ziitek. It is not only an important platform for us to showcase our development achievements but also marks our successful transformation from a TIM technology innovator to a global supplier of comprehensive thermal management solutions. In the future, we will continue to focus on technological innovation, providing more competitive products and services to help global customers address various heat dissipation challenges."   Exhibition Details Event: Global data center Innovative development and application of liquid cooling Technical exhibition 2026 Date: May 18-20, 2025 Booth: No.2345 Longyang Road, Pudong New Area, Shanghai, China Website: www.ziitek.com.vn

25W/mK high-performance heat conduction! Ziitek TS-TIR700-25, unlocking a new solution for cooling high-heat flux devices   Today, with 5G, high-performance chips, optoelectronics and wearable devices continuously evolving towards higher integration, greater power, and miniaturization, the accumulation of internal heat in devices has become the core bottleneck restricting performance, lifespan and stability. Traditional thermal conductive materials either have insufficient heat conduction or have high interface thermal resistance, making it difficult to meet the requirements of demanding scenarios. The TS-TIR®700-25 series carbon fiber thermal pads launched by Ziitek Technology, with a stable thermal conductivity of 25W/mK, provide an efficient thermal management solution for high heat flux applications. This gasket is made of a high thermal conductivity carbon fiber and high molecular silicone composite system. Through precise manufacturing techniques, it constructs a directional heat-conducting pathway, significantly reducing the interface thermal resistance and enabling rapid and uniform heat conduction. This effectively prevents local overheating at the source and significantly improves the heat dissipation efficiency and equipment reliability.   25W/mK high thermal conductivity, with maximum heat dissipation efficiency； According to the ASTM D5470 standard test results, the thermal conductivity is stable at 25W/mK, far superior to conventional silicone gasket pads. It quickly discharges the heat from core heat sources such as chips and power devices, ensuring that the equipment operates at full capacity without overheating.   Low thermal resistance + low voltage compatibility, providing a more precise fit； With extremely low interface thermal resistance, it can well fill microscopic gaps under low voltage, adapting to precision components and compact structures, without damaging the elements or increasing assembly stress. It is stable and reliable for long-term use.   Ultra-thin and flexible, suitable for various thickness scenarios； The thickness ranges from 0.3 to 5.0mm. The standard thickness includes 0.3/0.5/1.0/1.5/2.0/2.5/3.0mm. It is lightweight, flexible, and can be die-cut for customization. It can easily adapt to narrow spaces and complex structures.   Wide temperature range and durability, safety and compliance； Operating temperature: -40℃~200℃, flame retardant grade reaches UL94 V-0, complies with RoHS requirements. It maintains stable performance and ensures safety in both high and low temperature, as well as long-term operation environments.   Non-viscous and easy to assemble, non-insulated design； The surface is non-sticky, making assembly and maintenance more convenient; non-insulated feature, suitable for professional thermal management scenarios with specific requirements for conductivity and heat conduction.   The application scenarios cover a wide range of high heat flux fields； 5G communication equipment: base stations, radio frequency units, small base stations, etc. - high-power components, stable heat dissipation ensures continuous signal transmission without interruption.   High-performance chips: CPU, GPU, AI acceleration cores and server cores, powerful temperature control, releasing computing power without frequency reduction. Optoelectronic industry: Optical modules, laser devices, high-definition display drivers, suppressing temperature rise, extending the lifespan of optoelectronic components. Wearable devices: Smart watches, VR/AR, health monitoring terminals, lightweight without a burdening feeling, long-lasting calmness and greater comfort. General high-heat scenarios: Between chips and heat dissipation modules, power devices, industrial control and other high-density heat dissipation demand scenarios.   For electronic devices, heat dissipation is key to competitiveness. The Ziitek TS-TIR®700-25, with its 25W/mK high thermal conductivity, low thermal resistance, lightweight, flexible and robustness across a wide temperature range, has become the preferred thermal interface material in 5G, high-performance chips, optoelectronics, wearable devices and other fields, helping products maintain stable output under harsh conditions.   Whether it's the development of new products or the upgrade of existing solutions, this carbon fiber heat transfer gasket can help you bridge the "last mile" of heat dissipation with high cost-effectiveness and high compatibility, making the equipment cooler, more durable and more powerful.

Liquid cooling immersion cooling new benchmark  Ziitek Technology's TIF100C series immersion thermal pad, meeting the long-term requirements for AI & GPU liquid cooling barriers   With AI computing power, new energy vehicles, and high-performance servers all entering the era of liquid cooling / immersion cooling for heat dissipation, traditional thermal interface materials often encounter problems such as insufficient heat conduction, poor adhesion, weak insulation, and cumbersome installation. Mako Electronics has newly launched the TIF®100C series of immersion-specific thermal silicone pads, featuring 8.0W/m·K high thermal conductivity, ultra-high compression flexibility, self-adhesive without glue, V-0 flame retardancy, etc. These hard-core performance characteristics make it an efficient thermal insulation solution for high-power devices and liquid cooling / metal bases. Ⅰ.make sure you understand: liquid cooling with cold plates vs immersion cooling are completely different concepts.   1. Cold plate liquid cooling (indirect cooling - progressive mainstream) ✅Principle: The cold plate is closely attached to the GPU/CPU, and the coolant circulates in a closed channel, only cooling the core chips. ✅Features: Minimal changes, strong compatibility, easy deployment. Preferred for existing data centers. ✅Limitations: Memory and power supplies still rely on air cooling, which may result in local hotspots. The upper limit for high-density scenarios is limited. 2. Immersion Liquid Cooling (Direct Cooling - High Density) ✅Principle: The entire machine is immersed in an insulating coolant, achieving full-area, non-overlapping heat exchange. The heat dissipation ✅efficiency is 20-30 times higher than that of air cooling. ✅Features: No fan, low noise, stable temperature control, PUE can be as low as 1.05. Suitable for high-density cluster cabinets with power exceeding 100kW. ✅Key Challenges: The compatibility of the coolant directly determines the lifespan, stability and heat dissipation efficiency of the thermal pad. II. The critical point of immersion liquid cooling: The heat-conducting pad cannot withstand the liquid, and all efforts will be in vain.、 In the immersion environment, the heat-conducting pad is constantly immersed in media such as PAO and fluorinated liquids. Ordinary materials will experience phenomena such as swelling, cracking, powder shedding, a sharp decline in heat conductivity, interface failure, GPU overheating and frequency reduction, soaring operation costs, and skyrocketing failure rates. This is why immersion liquid cooling requires the use of dedicated compatible heat-conducting materials.   III. Ziitek TIF100C Immersion Heat Conductive Sheet, Immersion Liquid Cooling Solution: Stable, Powerful, Long-lasting   Core breakthrough: Highly compatible with the entire series of thermal pads, deeply adapted to PAO4, various immersion oils, fluorinated liquids and other mainstream immersion media. Long-term immersion does not cause swelling or attenuation, and the performance is stable. It has been verified in multiple customer immersion scenarios and is compatible with TIF100C and other series of thermal sheet products. ✅Product features: Excellent thermal conductivity. Self-adhesive, no need for additional surface adhesives. High compressibility, soft and elastic, providing multiple thickness options. Good chemical stability. IV. Key Application Scenarios | Full Coverage High-Power Immersion/Liquid Cooling Field   ✅ AI servers / HPC high-performance computing Between GPU/CPU/accelerator cards and liquid cooling plates, low thermal resistance, high insulation, high reliability, supporting full computing power continuous output ✅ New energy vehicles (vehicle-grade) Motor controllers, OBC, DC-DC, battery pack thermal management, insulation flame retardancy, buffering vibration resistance, corrosion resistance to coolant ✅ Network communication / 5G / optical modules High-power power amplifiers, switching chips, base station equipment, immersion / liquid cooling cooling, stable low latency, long lifespan ✅ Industrial control / power supply / energy storage High-power power supply modules, inverters, energy storage converters, high-voltage insulation, fire safety, long-term stability ✅ Immersion-type liquid cooling chassis Data centers, supercomputers, special cooling equipment, perfectly adapting to immersion work without polluting the coolant   In the era of liquid cooling immersion, heat dissipation not only needs to be "fast", but also must be stable, safe, and easy to assemble. The Ziitek TIF®100C series, with its five core advantages of 8.0W high thermal conductivity, ultra-high compression, self-adhesive without glue, V-0 flame retardant, and high insulation, has become the preferred choice for immersion cooling in high-power scenarios such as AI, new energy, servers, and industrial equipment.