CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
About Us
Your Professional & Reliable Partner.
Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, ...
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Million+
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Million+
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China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM HIGH QUALITY
1. High-Quality Products: With over 19 years of experience, we offer best thermal interface materials(TIM). 2. Professional Guidance: ZIITEK team provides 1-to-1 service and technical guidance. 3. RoHS and Supplier Capability Assessment,company has strictly quality control system and professional test lab.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM DEVELOPMENT
1.Advanced Technology: Our team continuously explores emerging materials and advanced manufacturing processes. 2. Superior Product Design: Combine innovation with functionality to customize thermal interface materials to match your project. 3. Quality Assurance: All thermal interface materials with industry standards and undergo rigorous test.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM MANUFACTURING
1. Our factory was Inaugurated in 2006, spanning 10,000 square meters square meters 2. Our employing more than 1,000 people. 3. Advanced automatic machines, strictly process control system. Catering to both domestic and international markets, Ziitek offers customized services.
China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM 100% SERVICE
1. Online-service : 12 hours , Inquiry reply within fastest. 2. Working time: 8:00am - 5:30pm, Monday to Friday (UTC+8). 3. After-service: Even our products have passed strict inspection, if you find the parts can not work well, we will help you to deal with it and give you satisfactory solution.

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The "savior" for the heat dissipation of AI chips, Ziitek carbon fiber Thermal conducting pad has a heat conductivity coefficient of up to 25w/m.k and a thermal resistance as low as 0.05 ℃.cm²/w.
The "savior" for the heat dissipation of AI chips, Ziitek carbon fiber Thermal conducting pad has a heat conductivity coefficient of up to 25w/m.k and a thermal resistance as low as 0.05 ℃.cm²/w.   In the era of rapid technological development, AI chips, as the core "brain" of the artificial intelligence field, are driving changes in various industries at an astonishing speed. However, as the computing power of AI chips continues to increase, the heat they generate has become a challenging problem that needs to be addressed urgently. At this point, Ziitek carbon fiber heat dissipation gaskets stand out with their outstanding performance and have become a powerful assistant for the heat dissipation of AI chips. The "heat crisis" of AI chips   During the operation of AI chips, due to the need for processing and handling massive amounts of data, the internal transistors and other components of the chips will continuously operate at high speed, thereby generating a large amount of heat. According to research, for every 10℃ increase in chip temperature, its reliability may decrease by approximately 50%. Therefore, efficient heat dissipation is crucial for maintaining the stable and efficient operation of AI chips.   Ziitek carbon fiber thermal pad "makes its debut"   Ziitek, as an enterprise that has been deeply engaged in the materials field for many years, focuses on the research, development, manufacturing and sales of innovative functional materials such as thermal interface materials and EMC materials. It has achieved remarkable results in cooling solutions and has obtained a number of patents and honors. The company's carbon fiber thermal pad is specifically designed to solve the heat dissipation problems of high-power chips. Excellent thermal conductivity performance   The Ziitek TS-TIR700-25 is an efficient carbon fiber heat transfer gasket, combining high thermal conductivity carbon fibers with high molecular silicone materials.It precisely distributes the heat transfer pathways through advanced technology, achieving excellent thermal conductivity performance, effectively reducing interface thermal resistance and enhancing heat dissipation efficiency. It features ultra-thinness, light weight, and mechanical flexibility, and is suitable for 5G equipment, high-performance chips, and other high heat flux applications.   Demonstrate one's capabilities through application   The AI chip of Company H is mainly applied in low-power fields such as edge computing products and mobile devices. In edge computing scenarios like security monitoring, autonomous driving, and intelligent manufacturing, this chip can provide powerful real-time inference capabilities, enabling it to quickly analyze and process collected images, videos, and other data, and achieving artificial intelligence functions such as target recognition and behavior analysis.   Application Features:   Thermal conductivity: 25 W/mK Extremely low thermal resistance Operates under low pressure Non-insulating material No surface stickiness Product thickness: 0.3mm - 5.0mm Thermal resistance ≤ 0.05 (℃in2/W) Compression rate ≥ 25% (50 psi)   Future Outlook   With the continuous development of AI technology, the performance of AI chips will keep improving, and the demand for heat dissipation will also increase. Ziitek will continue to invest in research and development, constantly optimize the performance of carbon fiber heat transfer pads, and provide higher-quality and more efficient heat dissipation solutions for AI chips. At the same time, Ziitek will expand its product application fields, shining in more industries such as ICT communication, data centers, and new energy vehicles, and helping to upgrade and develop the technologies of various industries.  
The preferred solution for IGBT thermal management: Ziitek TIS thermal conductive and insulating silica gel sheet, a one-stop solution for thermal conductivity and insulation.
The preferred solution for IGBT thermal management: Ziitek TIS thermal conductive and insulating silica gel sheet, a one-stop solution for thermal conductivity and insulation. In the thermal management system of IGBT modules, Ziitek thermal conductive silicone sheets are a key material that combines heat dissipation and electrical safety. The selection of this material directly affects the operational stability of the module. The ideal thermal conductive insulating material should not only have high thermal conductivity and reliable insulation, but also meet the requirements of high temperature resistance, weather resistance, tear resistance, etc., to be suitable for harsh working conditions such as industrial grade and automotive grade. TIS thermal insulation pad, with its mature formula and precise manufacturing process, achieves an integrated breakthrough in thermal conductivity, insulation, and reliability, providing a mature solution for the long-term stable operation of IGBT. Core advantages: Dual excellence in heat conduction and insulation, with comprehensive performance 1. High heat conduction, rapid heat dissipation Adopting high-performance thermal conductive fillers and precise forming processes, it has an excellent thermal conductivity coefficient, which can quickly conduct the working heat of IGBT to the heat dissipation structure, significantly improving the heat dissipation efficiency and reducing the temperature rise of the device. 2. Reliable insulation, ensuring electrical safety It has excellent electrical insulation strength, achieving effective electrical isolation between the IGBT module and the heat sink. This prevents short circuits, leakage, breakdown and other safety risks from the very beginning, enhancing system safety. 3. High temperature resistance and weather resistance, strong adaptability to working conditions It has good heat resistance and weather resistance, maintaining stable performance in harsh environments such as high temperatures, high humidity, and temperature cycling. It does not age, crack, and extends the service life of the IGBT module and the entire system.
Three high-performance thermal conductive materials, providing a solid support for the thermal management of energy storage batteries
Three high-performance thermal conductive materials, providing a solid support for the thermal management of energy storage batteries   The energy storage battery pack, as the core component of the energy storage system, its performance and high reliability are the key factors ensuring the smooth operation of the energy storage system. During the daily operation of the energy storage batteries, thermal management undoubtedly holds a crucial position. With the significant improvement in the power handling capacity of batteries, the power density of lithium batteries has also increased accordingly. In this context, implementing a high thermal management strategy plays a vital role in extending the battery's service life and ensuring long-term stable operation. 1、Thermal Conductive Gel: Accurately Conducts Heat, Protects Battery Modules Heat conductive gel is a high-performance heat-conducting material specially designed for use between battery modules and liquid cooling plates. With its excellent heat-conducting properties, low compression stress, and the convenience of supporting automated dispensing, it significantly improves heat transfer efficiency, effectively preventing the occurrence of local overheating, and building a solid defense line to extend the battery's lifespan. 2、Silicone Foamed Rubber: Heat Insulation and Noise Reduction, Enhancing Battery Efficiency Silicone foamed rubber, as a multifunctional heat-conducting material, not only effectively prevents direct contact between the electrolyte and the battery casing, reducing the disorderly transfer of heat within the battery, thereby improving the overall efficiency of the battery; at the same time, its excellent sound insulation and noise reduction capabilities can significantly reduce the noise interference during the operation of the energy storage battery, providing a strong guarantee for the stable operation of the battery.   3、Thermal conductive potting compound: Sealing and Protecting, Safeguarding Battery Safety Thermal sealing compound plays a crucial role in the sealing process of battery packs. It can form a dense and sturdy protective film, effectively blocking the invasion of harmful factors such as moisture and contaminants from the outside, thereby significantly enhancing the sealing and safety of the battery. This protective film is like a sturdy armor for the battery, allowing it to maintain good performance and stability even in harsh working conditions.   These three high-performance thermal-conducting materials each play an irreplaceable role, jointly providing a comprehensive and effective solution for the thermal management of energy storage batteries, ensuring the continuous, stable and high-performance operation of the energy storage system.

2026

03/18

New Era of SD Card Cooling: TIC800G Heat Conductive Phase Change Material, Ensuring No Frequency Drop During High-Speed Continuous Shooting
New Era of SD Card Cooling: TIC800G Heat Conductive Phase Change Material, Ensuring No Frequency Drop During High-Speed Continuous Shooting   For every photographer who strives for high quality, whether it's capturing the fleeting moments of wild animals with continuous shooting, or recording 4K/8K high-bitrate videos for a long duration, the camera is their trusted companion. However, have you ever experienced the embarrassing situation where the camera suddenly alerts "Device overheating, about to shut down"? When you blame it on the camera body, perhaps you have overlooked a crucial heat source - the SD card in your hand.   Today, we would like to introduce to you a "heat dissipation guardian" hidden within the SD card - Ziitek TIC800G thermal phase change material. It is quietly enhancing the reliability standards of high-performance storage. With the continuous improvement of resolution and burst shooting speed, data is pouring into the SD card at a rate of several gigabytes per second. These intense read and write operations will generate an astonishing amount of heat for the main control chip and storage units of the SD card.If overheated, it will directly lead to:   1. Triggered frequency reduction: To protect the hardware, the SD card will automatically reduce its read and write speeds, resulting in lag during continuous shooting and interruption of video recording. 2. Data error risk: High temperature is the enemy of the stability of electronic components, potentially increasing the probability of data write errors or loss. 3. Lifespan reduction: Long-term operation under high temperature will accelerate the aging of internal components in the SD card, affecting its service life. The TIC800G thermal conductive phase-change material is different from traditional heat sinks. It is a high-performance thermal conductive material based on phase-change technology. Its "phase change" property is precisely the secret to its heat dissipation:   1. Solid adhesion: At room temperature, it is like a soft solid pad that closely adheres to the heat-generating chip surface of the SD card. 2. Heat absorption phase change: When the chip temperature rises to a specific critical point, the material absorbs a large amount of heat and transforms from a solid state to a semi-fluid state. This process absorbs much more heat than the simple temperature rise of ordinary materials. 3. Uniform heat conduction: During the phase change, it can quickly spread the heat from the hot area to the entire material surface, and then dissipate it through the SD card casing or metal frame. 4. Cooling restoration: When the reading and writing tasks are completed and the chip temperature drops, TIC800G releases the stored heat and returns to the solid state, waiting for the next cycle. In summary, it is like a reusable "heat energy buffer pad", continuously absorbing and releasing heat, firmly controlling the chip temperature within the safe range.   So, why is TIC800G the "perfect match" for SD cards? 1. Precise temperature control, continuous performance: By effectively controlling the temperature of the chip, it can prevent SD cards from reducing their frequency due to overheating, ensuring a stable and smooth reading and writing experience during long periods of high-load shooting. 2. Ultra-thin and flexible, seamless integration: TIC800G can be made into ultra-thin sheets, easily fitting into the compact space inside SD cards without occupying additional volume, and meeting the heat dissipation requirements of small electronic devices. 3. Interface filling, high thermal conductivity: Its soft nature can fully fill the air gaps between the chip and the casing (air is a poor conductor of heat), establishing a "high heat conduction bridge", improving the overall heat dissipation efficiency. 4. Reliable and durable, safeguarding data security: By keeping SD cards working at an appropriate temperature, it not only enhances the stability for immediate use but also delays the aging of flash memory chips and the main control chip from a long-term perspective, adding a solid safeguard for your valuable data assets.

2026

03/04