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ZIITEK Thermally Conductive Plastics: Driving Innovation in Thermal Management Through Lightweight Design and Efficient Heat Dissipation   With the rapid development of AI servers, new energy vehicles, 5G communications, LED lighting, industrial automation, consumer electronics, and other high-performance electronic products, power density continues to increase. As a result, thermal management has become a critical factor affecting product performance, reliability, and service life.   Traditional thermal management structures typically use aluminum or copper because of their excellent thermal conductivity. However, as electronic products become lighter, smaller, more integrated, and structurally complex, conventional metal heat-dissipation solutions may face limitations in weight, electrical insulation, and manufacturing flexibility.   ZIITEK TCP®️ Thermally Conductive Engineering Plastics provide an alternative material solution by combining the processing advantages of engineering plastics with thermal conductivity. By incorporating specially selected thermally conductive fillers into polymer matrices, ZIITEK thermally conductive plastics can provide heat dissipation while maintaining the advantages of injection molding and lightweight design.   1. What Are Thermally Conductive Plastics?   Thermally conductive plastics are engineering plastics designed to provide enhanced heat-transfer capability. Conventional plastics generally have low thermal conductivity. Thermally conductive plastics improve heat transfer by incorporating thermally conductive fillers into polymer systems such as PP, PA, PBT, and PPS.   ZIITEK TCP®️ thermally conductive plastic products offer typical thermal conductivity levels ranging from approximately 0.7 to 5.0 W/m·K, allowing engineers to select suitable materials according to thermal requirements, operating temperatures, product structures, and processing conditions. 2. Why Are Thermally Conductive Plastics Attracting Increasing Attention?   Compared with traditional metal thermal structures, thermally conductive plastics offer several advantages. ① Lightweight Design Weight reduction is an increasingly important requirement in automotive electronics, new energy vehicles, portable electronics, and other applications. Certain ZIITEK thermally conductive plastics can be used as alternatives to conventional aluminum thermal structures in suitable applications, helping reduce overall component weight. ② Injection Molding Capability Thermally conductive plastics can be processed using established injection molding technologies. Heat-dissipation structures, mounting holes, clips, reinforcing ribs, and housings can potentially be integrated into a single molded component, reducing secondary machining and assembly processes. ③ Electrical Insulation Unlike conventional metal heat sinks, engineering plastics can provide electrical insulation while also offering thermal conductivity. This makes thermally conductive plastics particularly attractive for applications where heat dissipation and electrical isolation are both required. ④ High Design Flexibility Injection molding allows engineers to create complex curves, thin-wall structures, clips, mounting features, and integrated components. This provides greater freedom for product miniaturization and structural optimization. ⑤ Product Miniaturization For electronic products with limited internal space, thermal functions can potentially be integrated directly into housings or structural components, helping optimize the overall product architecture. 3. Major Application Areas for ZIITEK Thermally Conductive Plastics   ① LED Lighting LED lighting is one of the representative application areas for thermally conductive plastics. LED chips generate heat during operation. If heat is not effectively dissipated, excessive temperature can affect optical performance, stability, and service life. ZIITEK thermally conductive plastics can be considered for: LED lamp cups LED housings LED heat-dissipation structures LED spotlights LED panel lights LED backlight modules Lighting structural components ZIITEK TCP200 series products have been developed for applications including LED lighting and LCD/LED TV backlight thermal structures. ② Automotive Electronics   The rapid development of electric and intelligent vehicles has significantly increased the number of electronic components installed in vehicles. Automotive electronics require reliable thermal management, lightweight design, electrical insulation, and resistance to demanding operating environments. Potential applications include: Automotive LED lighting Automotive sensors ECU housings and structural components Power electronics Motor-related electronic components Electronic connectors and surrounding structures Power module structural components Different polymer systems can be selected according to operating temperature, chemical resistance, mechanical requirements, and processing conditions. ③ New Energy Vehicle Power Electronics Electric vehicles rely on numerous power electronic systems, including onboard chargers (OBC), DC-DC converters, inverters, and other electronic control systems. These components generate significant heat during operation. Thermally conductive plastics can provide a new design option by combining: Structural Function + Thermal Management + Electrical Insulation + Lightweight Design This integrated approach can help engineers develop lighter and more compact power electronic systems. ④ 5G Communication Equipment   5G base stations, communication power supplies, networking equipment, and communication modules often operate continuously and therefore require effective thermal management. Thermally conductive plastics can potentially be used in: Communication equipment housings Heat-dissipation structures Power module structures Antenna-related components Communication power supplies Compact communication devices Injection molding also allows manufacturers to develop compact and highly integrated structural designs. ⑤ Power Supplies and Adapters   Power adapters, industrial power supplies, and power modules generate heat during operation. Thermally conductive plastics can be considered for: Power supply housings Thermal housings Power device structures Transformer-related structures Power module brackets For products requiring a combination of thermal conductivity, electrical insulation, lightweight design, and structural integration, thermally conductive plastics can provide an attractive alternative. ⑥ Consumer Electronics   Consumer electronics continue to evolve toward thinner, lighter, smaller, and higher-performance designs. Potential applications for thermally conductive plastics include: Televisions Monitors Routers Set-top boxes Smart home devices Gaming equipment Compact electronic devices LED display components In addition to thermal management, injection molding provides greater freedom for appearance and internal structural design. ⑦ Industrial Control and Power Electronics   Industrial control equipment is often required to operate continuously and reliably. Components such as MOSFETs, IGBTs, transformers, and power devices generate heat during operation. ZIITEK thermally conductive plastics can be considered for: Industrial controllers Power modules Control power supplies Motor controllers Variable-frequency drives Industrial electronic equipment PCBA-related thermal structures For selected low- and medium-power thermal management applications, thermally conductive plastics can provide an alternative to conventional metal structures. ⑧ AI Servers and High-Performance Computing   AI servers, GPU servers, and high-performance computing systems are experiencing rapidly increasing power density. Thermal management has therefore become an important consideration in server design. Thermally conductive plastics may be suitable for certain structural thermal components, airflow structures, auxiliary heat-dissipation components, and electrical insulation structures. For high-heat-flux components such as CPUs and GPUs, thermally conductive plastics are generally used as part of a broader thermal management system together with thermal pads, thermal gels, thermal greases, phase-change materials, or other TIM solutions. 4. How Can Thermally Conductive Plastics Help Reduce Product Weight?   Traditional aluminum thermal structures offer excellent thermal conductivity but can increase component weight and require multiple manufacturing processes. One of the major advantages of thermally conductive plastics is their ability to form complex structures through injection molding. Traditional Approach: Aluminum → Extrusion/Die Casting → CNC Machining → Surface Treatment → Assembly Thermally Conductive Plastic Approach: Thermally Conductive Plastic Pellets → Injection Molding → Assembly Through structural optimization, multiple components can potentially be integrated into a single molded part, reducing machining and assembly requirements. 5. Combining Thermal Management with Electrical Insulation   In electronic product design, thermal management and electrical insulation often need to be considered simultaneously. Metal heat sinks provide excellent thermal conductivity but are electrically conductive. Additional insulation films, sheets, or isolation structures may therefore be required in certain designs. Thermally conductive engineering plastics can provide thermal conductivity while maintaining the inherent electrical insulation characteristics of polymer materials. For example, ZIITEK TCP200-25-06A provides a thermal conductivity of 2.5 W/m·K, together with electrical insulation and flame-retardant performance suitable for selected electronic applications. 6. ZIITEK TCP®️ Thermally Conductive Plastic Series   ZIITEK provides thermally conductive plastics based on different polymer systems for different application requirements.   TCP100 Series Based primarily on PP resin systems, TCP100 products are suitable for applications requiring a balance of cost, lightweight design, and moderate operating temperatures. Typical applications include: Consumer electronics LED lighting Low-power power supplies Indoor lighting structures TCP200 Series Based on engineering polymer systems such as PA/PBT, the TCP200 series provides higher thermal performance and improved temperature resistance. Selected TCP200 products can provide thermal conductivity levels of up to 5.0 W/m·K, making them suitable for applications such as industrial LED lighting, automotive electronics, and communication equipment.   TCP300PS Series Based on PPS resin systems, TCP300PS products are designed for applications requiring higher temperature resistance and chemical resistance. Potential applications include: New energy vehicle electronics High-temperature electronic components Motor connectors Engine-compartment electronic components High-temperature and chemically demanding environments 7. From Metal Heat Sinks to Thermally Conductive Plastics   As electronic products continue to evolve toward lightweight, high integration, intelligent design, and high reliability, thermal management materials are also evolving from conventional heat sinks toward integrated material-and-structure solutions. Thermally conductive plastics are not intended to replace every aluminum or copper heat sink. Instead, they provide an alternative solution for applications where the thermal load, operating temperature, product structure, airflow, and manufacturing requirements are suitable. For products requiring a combination of: Lightweight Design + Thermal Conductivity + Electrical Insulation + Complex Geometry + Injection Molding thermally conductive plastics can provide significant design value. 8. Why Choose ZIITEK Thermally Conductive Plastics?   ZIITEK has been focused on thermal management materials and solutions for electronic, automotive, energy, communication, and industrial applications. ZIITEK TCP®️ thermally conductive engineering plastics offer: Integrated thermal and structural functions Injection molding capability Complex structural design flexibility Lightweight advantages Electrical insulation capability Multiple polymer systems Multiple thermal conductivity grades Solutions for LED, automotive electronics, communication, power, and industrial applications ZIITEK thermally conductive plastic products cover multiple grades, with thermal conductivity levels ranging from approximately 0.7 to 5.0 W/m·K, enabling engineers to select materials according to operating temperature, thermal requirements, product geometry, and manufacturing processes. 9. Conclusion: Making Plastics More Than Structural Materials   The future of thermal management will increasingly focus on the integration of materials, structures, and thermal functions. ZIITEK TCP®️ thermally conductive plastics combine the advantages of engineering plastics—including lightweight design, injection molding, electrical insulation, and structural flexibility—with thermal management capabilities.From LED lighting and automotive electronics to new energy systems, power supplies, 5G communications, industrial electronics, and emerging computing applications, thermally conductive plastics are becoming an important alternative to conventional metal thermal structures.When a product requires more than heat dissipation—when it also requires lightweight design, electrical insulation, complex geometry, and efficient manufacturing—ZIITEK thermally conductive plastics provide engineers with a flexible and innovative thermal management material solution.

Ziitek's TIG®7835L liquid metal thermal conductive material empowers AI servers with ultra-high computing power cooling capabilities   1. When computing power surges but heat dissipation becomes a bottleneck, liquid metal becomes the core solution to break through the problem . The rapid development of the artificial intelligence industry has led to the continuous increase in power consumption of high-performance processors, AI acceleration chips, and GPUs. The integration density of chips continues to rise, and the heat flux density is increasing exponentially. Traditional thermal conductive pastes and thermal pads have limited thermal conductivity and are prone to drying out and rising thermal resistance when operating at full load for a long time, directly causing the equipment to overheat and reduce computing power, shortening the lifespan of the server, and becoming a key bottleneck for the efficient operation of data centers.   Ziitek has been deeply engaged in the field of thermal management materials for many years. It independently developed TIG®7835L gallium-based liquid metal thermal conductive material, relying on mature alloying and patented packaging technology, to create an efficient bottom-level heat dissipation solution specifically for AI servers and high-power computing equipment, perfectly meeting the continuous full-load operation requirements of high-power chips. 2. Core performance of TIG®7835L, matching the strict conditions of AI servers   TIG®7835L is a silver-white gallium alloy liquid material that remains in a liquid state without the need for high-temperature heating. Its core thermal conductivity can reach 35.0W/m·K, far exceeding the thermal conductivity of conventional thermal conductive media. The material's viscosity is lower than 10mPa·s, with excellent fluidity, which can completely fill the tiny concave and convex contact surfaces between the chip and the heat sink, minimizing interface thermal resistance and quickly conducting the concentrated heat from the AI chip.   The product's chemical stability is outstanding, with low volatility and extremely low loss. The working temperature range covers -40℃ to 250℃, capable of coping with complex environments such as continuous full-load operation of servers and temperature fluctuations in the data center. The raw materials are safe and non-toxic, fully meeting RoHS environmental standards; the density, specific heat capacity, and resistivity of the material have undergone standardized testing, with no significant degradation in long-term use performance, significantly reducing the maintenance cost of the equipment.   To address the common concerns of leakage and short-circuit risks, Ziitek has paired it with the patented CN224218815U packaging structure, using Z-FOAM® special micro-porous foam frame sealing. The foam quickly rebounds under pressure and can withstand long-term compression loads, not only locking the liquid metal to prevent leakage but also providing a buffering and noise reduction effect, optimizing the operating environment of the server as a whole.   3. Suitable for multiple scenarios of computing power equipment, standardized use is more convenient   In addition to core AI servers, AI chips, and high-performance GPUs, TIG®7835L can also be widely used in graphics processing chips, laptops, LED devices, industrial liquid cooling heat dissipation modules, and other products, suitable for diversified high-power heat dissipation scenarios. The product is available in 1ml, 30ml, and 50ml syringe specifications, catering to both R&D prototyping and large-scale mass production delivery.   The complete operation procedures include: ensuring the contact surface is clean and dry before application, leaving it to stand at room temperature for 4 hours before application; the liquid metal is conductive and needs to be isolated from the circuit board to avoid short circuits; the material will corrode aluminum parts, so they need to be pre-treated with anode protection, and the edges are surrounded and fixed with the matching foam to prevent diffusion. The material should be used up within 3 days after opening and stored in a low-temperature, dry environment to maintain its complete performance.   4. Ziitek's global technical services, solving computing power heat dissipation problems in one step   As a professional thermal management material brand, Ziitek has established a global local service system. In China, it has set up an exclusive technical service hotline, and in Canada, Vietnam, Taiwan of China, and other regions, it has configured service channels to quickly respond to customized heat dissipation requirements of server manufacturers and provide full-process support for material selection, process guidance, and heat dissipation scheme optimization. In response to the escalating heat dissipation demands in the era of AI computing power, Ziitek has continuously refined its liquid metal new material technology. With the stable and reliable thermal conductivity performance of TIG®7835L and the safe and controllable packaging structure, it has laid a solid foundation for heat dissipation for data center AI servers, helping the industry achieve long-term and stable output of computing power.