quality Thermal Pad & Thermal Grease manufacturer

Effective cooling, limitless computing power | Ziitek sincerely invites you to attend the three major industry events in Shenzhen   Dear Partner: Hello!   VIETNAM ZIITEK TECHNOLOGY COMPANY LIMITD sincerely invites you to attend the three industry trade fairs to be held from June 10th to 12th, 2026 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). Our booth location: Hall 14, Booth 14H87 (Halls 14 and 16).   ▪ Shenzhen International AI Computing Power Industry Exhibition ▪ The 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition ▪ The 16th Shenzhen International Heat Conductive and Heat Dissipation Materials and Equipment Exhibition (CIME 2026)     During the three exhibitions, the total exhibition area exceeded 40,000 square meters, gathering over 500 leading enterprises in the industry. It is expected to attract 30,000+ professional visitors. Simultaneously, 30 high-end technical forums will be held. As a highly influential event in the thermal management industry in South China, it comprehensively covers three major tracks: AI computing power, liquid cooling heat dissipation, and thermal conductive materials.   Choose Ziitek and unlock professional thermal management solutions   With a 20-year history in the field of electronic heat dissipation materials, Ziitek adheres to the development mission of "finding the best solution for every degree of heat". The core technical team comes from the Chinese Academy of Sciences and leading semiconductor enterprises, holding over 40 invention patents. Their products have all passed international authoritative certifications such as UL, RoHS, and REACH. We focus on high-performance thermal interface materials, customized liquid cooling solutions, and AI chip-level thermal management services. We have served over 200 data centers, computing clusters, and consumer electronics enterprises, helping customers improve equipment efficiency by 15% to 30%, and laying a solid foundation for the stable operation of high-load equipment.   Three major new products make their debut at the event   ✅ High thermal conductivity thermal pad—— Thermal conductivity reaches 16W/mK, suitable for AI servers and high-power chips, providing efficient and long-lasting heat dissipation。   ✅ Carbon fiber thermal pad ——Thermal conductivity exceeds 25W/mK, featuring lightweight and high strength, suitable for demanding scenarios such as new energy vehicles and aerospace   ✅ High thermal conductive gel | Thermal conductivity is 15W/mK, with excellent fluidity, capable of adapting to irregular gaps, suitable for 5G base stations and high-density consumer electronics Throughout the exhibition, a professional technical team is on-site to provide services, offering one-on-one free customized thermal management solutions to address various industry challenges such as computing power heat dissipation and liquid cooling selection.     Exhibition Details     ♦ Exhibition Date: June 10th - 12th, 2026 ♦ Exhibition Venue: Shenzhen International Convention and Exhibition Center (Bao'an New Hall), Hall 14 & 16 ♦ Booth Number: 14H87 Scan the code immediately to make an appointment. You will enjoy priority reception and an exclusive exquisite gift! We are looking forward to meeting you in person and exploring new opportunities in the field of cooling and computing power together!   VIETNAM ZIITEK TECHNOLOGY COMPANY LIMITD   Sincerely invites    

Ziitek Technology Will Showcase COMPUTEX 2026 Taipei International Computer Exhibition. Ziitek Technology, a global leader in thermal management solutions with over 20 years of industry experience, will make a grand appearance at COMPUTEX International Computer Exhibition (booth: A0217) in Taipei, showcasing its high-quality solutions for the thermal management industry of data centers, and cooperate with global industry partners to explore opportunities for innovation and development of artificial intelligence electronics industry.     Since its establishment in 2006, ZIITEK Technology has been dedicated to the research and large-scale production of thermal interface materials. With long-term technological accumulation and continuous product iterations, the company's self-developed thermal management solutions have been widely applied in the fields of communication, new energy vehicles, aerospace and military, power, medical care, and consumer electronics. Thanks to their stable and reliable product performance, the company has received high recognition from global customers. At this exhibition, the enterprise will fully showcase its entire series of core thermal interface materials, fully demonstrating its core technical advantages in efficient heat conduction, material integration, and customized heat dissipation design.   In response to the stringent heat dissipation requirements of high-power and high-density electronic devices, ZIITEK Technology has independently developed carbon fiber thermal conductive materials, which are suitable for 5G equipment, high-end chips, AI servers, and power control units and other core devices. This product further improves the company's integrated technical system from basic materials, heat dissipation components to the overall heat dissipation system. It can efficiently solve the heat dissipation problems of high-end equipment and provide solid technical support for the green and efficient operation of data centers.

Embarking on a New Journey Toward a Brighter Future | Groundbreaking Ceremony Successfully Held for Phase II of KUNSHAN ZIITEK’s Manufacturing Project Good morning, distinguished leaders, guests, and friends,   Today, during this vibrant season of growth and renewal, we are delighted to gather here for the groundbreaking ceremony of Phase II of KUNSHAN ZIITEK’s manufacturing project. On behalf of Ziitek, I would like to extend our warmest welcome and sincere appreciation to all the leaders, partners, and friends joining us today.   We would especially like to thank the government authorities and officials of Lujia Town for their continuous support and guidance throughout this project. My heartfelt thanks also go to all Ziitek team members who have contributed to the preparation of this important event.   The launch of this project marks a significant milestone in Ziitek’s development journey. With a total investment of RMB 100 million and covering approximately 20 acres, the expanded facility will provide around 18,000 square meters of manufacturing space.   Upon completion, the new base will integrate R&D, manufacturing, and sales operations, further strengthening our capabilities in intelligent manufacturing and lean production. This project represents an important step forward in supporting Ziitek’s long-term growth and innovation strategy.     Today’s groundbreaking is not only the start of a construction project, but also a reflection of our commitment to sustainable development, operational excellence, and social responsibility.   Throughout the construction process, we will prioritize workplace safety, quality standards, and environmental protection. At the same time, the project will create more employment opportunities and contribute positively to local economic development.   To our construction partners, we look forward to working together with the highest standards of safety and quality to build a reliable and outstanding facility.   To all members of the Ziitek management team, close collaboration and dedication will be essential as we move forward. With determination, professionalism, and teamwork, we are confident that this project will be completed successfully and become a strong foundation for Ziitek’s future growth.   For more than 20 years, Ziitek has remained committed to innovation and excellence in thermal management materials. Today marks another important step toward our future, and we look forward to creating even greater value together with our customers, partners, and employees around the world.   Finally, thank you once again for your presence and support. We wish everyone good health, happiness, and continued success. Thank you.