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Liquid cooling immersion cooling new benchmark  Ziitek Technology's TIF100C series immersion thermal pad, meeting the long-term requirements for AI & GPU liquid cooling barriers   With AI computing power, new energy vehicles, and high-performance servers all entering the era of liquid cooling / immersion cooling for heat dissipation, traditional thermal interface materials often encounter problems such as insufficient heat conduction, poor adhesion, weak insulation, and cumbersome installation. Mako Electronics has newly launched the TIF®100C series of immersion-specific thermal silicone pads, featuring 8.0W/m·K high thermal conductivity, ultra-high compression flexibility, self-adhesive without glue, V-0 flame retardancy, etc. These hard-core performance characteristics make it an efficient thermal insulation solution for high-power devices and liquid cooling / metal bases. Ⅰ.make sure you understand: liquid cooling with cold plates vs immersion cooling are completely different concepts.   1. Cold plate liquid cooling (indirect cooling - progressive mainstream) ✅Principle: The cold plate is closely attached to the GPU/CPU, and the coolant circulates in a closed channel, only cooling the core chips. ✅Features: Minimal changes, strong compatibility, easy deployment. Preferred for existing data centers. ✅Limitations: Memory and power supplies still rely on air cooling, which may result in local hotspots. The upper limit for high-density scenarios is limited. 2. Immersion Liquid Cooling (Direct Cooling - High Density) ✅Principle: The entire machine is immersed in an insulating coolant, achieving full-area, non-overlapping heat exchange. The heat dissipation ✅efficiency is 20-30 times higher than that of air cooling. ✅Features: No fan, low noise, stable temperature control, PUE can be as low as 1.05. Suitable for high-density cluster cabinets with power exceeding 100kW. ✅Key Challenges: The compatibility of the coolant directly determines the lifespan, stability and heat dissipation efficiency of the thermal pad. II. The critical point of immersion liquid cooling: The heat-conducting pad cannot withstand the liquid, and all efforts will be in vain.、 In the immersion environment, the heat-conducting pad is constantly immersed in media such as PAO and fluorinated liquids. Ordinary materials will experience phenomena such as swelling, cracking, powder shedding, a sharp decline in heat conductivity, interface failure, GPU overheating and frequency reduction, soaring operation costs, and skyrocketing failure rates. This is why immersion liquid cooling requires the use of dedicated compatible heat-conducting materials.   III. Ziitek TIF100C Immersion Heat Conductive Sheet, Immersion Liquid Cooling Solution: Stable, Powerful, Long-lasting   Core breakthrough: Highly compatible with the entire series of thermal pads, deeply adapted to PAO4, various immersion oils, fluorinated liquids and other mainstream immersion media. Long-term immersion does not cause swelling or attenuation, and the performance is stable. It has been verified in multiple customer immersion scenarios and is compatible with TIF100C and other series of thermal sheet products. ✅Product features: Excellent thermal conductivity. Self-adhesive, no need for additional surface adhesives. High compressibility, soft and elastic, providing multiple thickness options. Good chemical stability. IV. Key Application Scenarios | Full Coverage High-Power Immersion/Liquid Cooling Field   ✅ AI servers / HPC high-performance computing Between GPU/CPU/accelerator cards and liquid cooling plates, low thermal resistance, high insulation, high reliability, supporting full computing power continuous output ✅ New energy vehicles (vehicle-grade) Motor controllers, OBC, DC-DC, battery pack thermal management, insulation flame retardancy, buffering vibration resistance, corrosion resistance to coolant ✅ Network communication / 5G / optical modules High-power power amplifiers, switching chips, base station equipment, immersion / liquid cooling cooling, stable low latency, long lifespan ✅ Industrial control / power supply / energy storage High-power power supply modules, inverters, energy storage converters, high-voltage insulation, fire safety, long-term stability ✅ Immersion-type liquid cooling chassis Data centers, supercomputers, special cooling equipment, perfectly adapting to immersion work without polluting the coolant   In the era of liquid cooling immersion, heat dissipation not only needs to be "fast", but also must be stable, safe, and easy to assemble. The Ziitek TIF®100C series, with its five core advantages of 8.0W high thermal conductivity, ultra-high compression, self-adhesive without glue, V-0 flame retardant, and high insulation, has become the preferred choice for immersion cooling in high-power scenarios such as AI, new energy, servers, and industrial equipment.

Three high-performance thermal conductive materials, providing a solid support for the thermal management of energy storage batteries   The energy storage battery pack, as the core component of the energy storage system, its performance and high reliability are the key factors ensuring the smooth operation of the energy storage system. During the daily operation of the energy storage batteries, thermal management undoubtedly holds a crucial position. With the significant improvement in the power handling capacity of batteries, the power density of lithium batteries has also increased accordingly. In this context, implementing a high thermal management strategy plays a vital role in extending the battery's service life and ensuring long-term stable operation. 1、Thermal Conductive Gel: Accurately Conducts Heat, Protects Battery Modules Heat conductive gel is a high-performance heat-conducting material specially designed for use between battery modules and liquid cooling plates. With its excellent heat-conducting properties, low compression stress, and the convenience of supporting automated dispensing, it significantly improves heat transfer efficiency, effectively preventing the occurrence of local overheating, and building a solid defense line to extend the battery's lifespan. 2、Silicone Foamed Rubber: Heat Insulation and Noise Reduction, Enhancing Battery Efficiency Silicone foamed rubber, as a multifunctional heat-conducting material, not only effectively prevents direct contact between the electrolyte and the battery casing, reducing the disorderly transfer of heat within the battery, thereby improving the overall efficiency of the battery; at the same time, its excellent sound insulation and noise reduction capabilities can significantly reduce the noise interference during the operation of the energy storage battery, providing a strong guarantee for the stable operation of the battery.   3、Thermal conductive potting compound： Sealing and Protecting, Safeguarding Battery Safety Thermal sealing compound plays a crucial role in the sealing process of battery packs. It can form a dense and sturdy protective film, effectively blocking the invasion of harmful factors such as moisture and contaminants from the outside, thereby significantly enhancing the sealing and safety of the battery. This protective film is like a sturdy armor for the battery, allowing it to maintain good performance and stability even in harsh working conditions.   These three high-performance thermal-conducting materials each play an irreplaceable role, jointly providing a comprehensive and effective solution for the thermal management of energy storage batteries, ensuring the continuous, stable and high-performance operation of the energy storage system.

New Era of SD Card Cooling: TIC800G Heat Conductive Phase Change Material, Ensuring No Frequency Drop During High-Speed Continuous Shooting   For every photographer who strives for high quality, whether it's capturing the fleeting moments of wild animals with continuous shooting, or recording 4K/8K high-bitrate videos for a long duration, the camera is their trusted companion. However, have you ever experienced the embarrassing situation where the camera suddenly alerts "Device overheating, about to shut down"? When you blame it on the camera body, perhaps you have overlooked a crucial heat source - the SD card in your hand.   Today, we would like to introduce to you a "heat dissipation guardian" hidden within the SD card - Ziitek TIC800G thermal phase change material. It is quietly enhancing the reliability standards of high-performance storage. With the continuous improvement of resolution and burst shooting speed, data is pouring into the SD card at a rate of several gigabytes per second. These intense read and write operations will generate an astonishing amount of heat for the main control chip and storage units of the SD card.If overheated, it will directly lead to:   1. Triggered frequency reduction: To protect the hardware, the SD card will automatically reduce its read and write speeds, resulting in lag during continuous shooting and interruption of video recording. 2. Data error risk: High temperature is the enemy of the stability of electronic components, potentially increasing the probability of data write errors or loss. 3. Lifespan reduction: Long-term operation under high temperature will accelerate the aging of internal components in the SD card, affecting its service life. The TIC800G thermal conductive phase-change material is different from traditional heat sinks. It is a high-performance thermal conductive material based on phase-change technology. Its "phase change" property is precisely the secret to its heat dissipation:   1. Solid adhesion: At room temperature, it is like a soft solid pad that closely adheres to the heat-generating chip surface of the SD card. 2. Heat absorption phase change: When the chip temperature rises to a specific critical point, the material absorbs a large amount of heat and transforms from a solid state to a semi-fluid state. This process absorbs much more heat than the simple temperature rise of ordinary materials. 3. Uniform heat conduction: During the phase change, it can quickly spread the heat from the hot area to the entire material surface, and then dissipate it through the SD card casing or metal frame. 4. Cooling restoration: When the reading and writing tasks are completed and the chip temperature drops, TIC800G releases the stored heat and returns to the solid state, waiting for the next cycle. In summary, it is like a reusable "heat energy buffer pad", continuously absorbing and releasing heat, firmly controlling the chip temperature within the safe range.   So, why is TIC800G the "perfect match" for SD cards? 1. Precise temperature control, continuous performance: By effectively controlling the temperature of the chip, it can prevent SD cards from reducing their frequency due to overheating, ensuring a stable and smooth reading and writing experience during long periods of high-load shooting. 2. Ultra-thin and flexible, seamless integration: TIC800G can be made into ultra-thin sheets, easily fitting into the compact space inside SD cards without occupying additional volume, and meeting the heat dissipation requirements of small electronic devices. 3. Interface filling, high thermal conductivity: Its soft nature can fully fill the air gaps between the chip and the casing (air is a poor conductor of heat), establishing a "high heat conduction bridge", improving the overall heat dissipation efficiency. 4. Reliable and durable, safeguarding data security: By keeping SD cards working at an appropriate temperature, it not only enhances the stability for immediate use but also delays the aging of flash memory chips and the main control chip from a long-term perspective, adding a solid safeguard for your valuable data assets.