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Thermal silicone sheet: The "invisible guardian" for effective heat dissipation of switching power supply   In the heart of electronic devices, the switching power supply quietly supports the stable conversion of energy. However, as power density increases and the size becomes increasingly compact, the problem of heat dissipation has become the core challenge restricting the performance and lifespan of the power supply. In this silent battle of heat dissipation, the thermal conductive silicone sheet acts as a "invisible guardian", building a solid barrier for the effective operation of the switching power supply.   Inside the switching power supply, components such as MOSFETs, transformers, and inductors continuously generate heat during the high-frequency switching process. Traditional cooling methods are often limited in efficiency due to uneven surfaces and gaps, for example: 1. High thermal resistance: The tiny air gap between the component and the heat sink has a high thermal resistance, hindering heat conduction. 2. Local hotspots: Uneven heat distribution leads to excessively high temperatures in certain components, accelerating aging and failure. 3. Vibration damage: Mechanical stress and vibration may damage the components, shortening the lifespan of the power supply.   Ziitek Thermal Conductive Silicone Sheet can meet the heat dissipation requirements of power switch modules. The thermal conductive silicone sheet is a particularly soft and highly compressible interface gap filler pad, featuring good flexibility, high temperature resistance, long-term stability, high dielectric strength, and excellent tear resistance. It has passed UL and ROHS certifications. This thermal conductive silicone sheet can closely adhere to the interface between the surface of the switching power chip and the heat dissipation substrate, reducing contact thermal resistance to improve heat dissipation efficiency. Its material properties determine its excellent filling effect, especially when a certain degree of compression is adopted, it can result in smaller thermal resistance and better heat dissipation performance. Moreover, the use of the thermal conductive silicone sheet is very convenient, does not easily wear out, and is convenient for the installation of the heat dissipation module. Therefore, due to its unique material properties, the thermal conductive silicone sheet becomes the "invisible guardian" that solves the heat dissipation problem.   Thermal silicone sheet product features: 1. Excellent thermal conductivity: 1.2W - 25W/mK 2. Fire resistance rating: UL94-V0 3. Available in various thicknesses: 0.25mm - 12.0mm 4. Hardness: 5 - 85 Shore 5. High compressibility, soft and elastic, suitable for low-pressure application environments 6. Self-adhesive without the need for additional surface adhesives   Conclusion: The thermal conductive silicone sheet operates in an "invisible" manner, covering every detail of the heat dissipation design for the switching power supply. It is not only the "executor" of effective heat dissipation, but also the "guardian" of the stability and lifespan of the power supply. On the path of electronic devices striving for performance and reliability, the thermal conductive silicone sheet will continue to safeguard each energy conversion of the switching power supply with the power of technology.  

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New standard for AI chip cooling: An effective thermal management solution using thermal conductive silicone grease Today, with the rapid development of artificial intelligence (AI) technology, AI chips, as the core hardware, have seen continuous improvements in performance and increasingly faster computing speeds. However, at the same time, the heat generated by the chips during operation is also increasing day by day. Excessive temperature not only affects the performance of the chips but may also shorten their lifespan or even cause damage. Therefore, effective cooling technology is crucial for the stable operation of AI chips. Among various cooling materials and solutions, conductive silicone grease is gradually becoming the new standard for cooling AI chips, providing an effective solution to the thermal management problem of AI chips. Thermal conductive silicone grease is a thermally conductive organic silicone paste-like compound made from organic silicone rubber as the main raw material, with materials that have excellent heat resistance and thermal conductivity added. Its main function is to fill the tiny gaps between the chip and the heat sink. From a microscopic perspective, the contact surface between the chip and the heat sink has a large number of tiny depressions and gaps, and the air remaining in these gaps has a very low thermal conductivity of approximately 0.024 W/mk, seriously hindering the heat transfer. However, the thermal conductivity of thermal conductive silicone grease is usually in the range of 1.0 - 5.2 W/mk. It can fill these gaps and form a continuous heat conduction path, increasing the contact area to over 95%, effectively replacing air as a heat conduction medium, significantly reducing the interface thermal resistance, and thus quickly transferring the heat generated by the chip to the heat sink, achieving effective heat dissipation. The characteristics of TIG thermal conductive silicone grease: Thermal conductivity: 1.0 W - 5.2 W/mk Excellent low thermal resistance Non-toxic, environmentally friendly and safe, meeting RoHS standards Excellent long-term stability High thixotropy, facilitating operation Fully fills the microscopic contact surfaces, creating low thermal resistance With the continuous development of AI technology, the performance of AI chips will continue to improve, and the demand for heat dissipation will also increase. Thermal conductive silicone grease, due to its unique heat dissipation advantages, cost-effectiveness and good applicability, has become an important choice for heat dissipation of AI chips. In the future, with the continuous progress of materials science, the performance of thermal conductive silicone grease is also expected to further improve, providing more powerful thermal management support for the stable operation of AI chips and the development of AI technology.

Thermal conductive graphite sheet can easily solve the problem of difficult heat dissipation of mobile phone chips   The heat dissipation of mobile phone chips is a key issue that affects the performance of devices and user experience. Especially in high-performance computing, 5G communication and game scenarios, the surge in chip heat generation may lead to frequency reduction, jamming and even hardware damage. ZIITEK Electronic Materials Technology Co., Ltd., with its innovative thermal conductive material technology, can be effectively cracked by thermal conductive graphite sheets. Its core advantages and technical characteristics are as follows: 1. Effective thermal conductivity:: The thermal conductive graphite sheet has a high thermal conductivity of 240-1700W/m-K in the plane, which is 2-4 times that of copper and 3-7 times that of aluminum. It can quickly disperse the heat generated by the chip to the heat dissipation module and significantly reduce the temperature of the chip.   2, light and flexible characteristics: The thickness of thermal conductive graphite sheet can be as thin as 0.012mm, and it has excellent flexibility, which can fit the chip and heat dissipation module seamlessly and eliminate the dead angle of thermal resistance. Its thin and light characteristics are especially suitable for devices that require strict space, such as folding screen mobile phones, to ensure heat dissipation efficiency without increasing the burden on the fuselage.   3, chemical stability and environmental protection: The graphite sheet has good corrosion resistance and oxidation resistance, can work stably at the temperature of -40℃ to 400℃ (operating temperature), and has no gas and liquid permeability, and the graphite layer is not aged or brittle. In addition, it contains no halogen and sulfur elements, conforms to green manufacturing standards, and is safe and pollution-free in production and use.   Product characteristics： > High thermal conductivity > High molding temperature, stable and reliable performance and no aging problem. > Good flexibility, easy die cutting, installation and use. > Soft and flexible, light and thin, high EMI shielding efficiency. > Comply with the EU RoHS directive and meet the requirements of halogen-free and other harmful substances.   Product application: > PDP, LCD TV, set-top box > Notebook computer, projector > Mobile phones, handheld devices > "Automotive Electronics"   Although the thermal conductive graphite sheet is a high-performance material, its price is relatively reasonable, which can greatly reduce the equipment failure rate and maintenance cost caused by overheating and enhance the competitiveness of products. With the development of technologies such as 5G and AI, the market demand for effective heat dissipation materials continues to grow, and the market prospect of thermal conductive graphite sheets is broad.

Exploring Thermal Conductive Interface Materials: Types, Characteristics and Applications   Today, with the miniaturization and high performance of electronic equipment, the power of heating components such as chips is constantly improving, and the heat dissipation problem has become a key factor affecting the stability and service life of equipment. Thermal Interface Materials (TIM), as a "bridge" connecting heat source and radiator, can effectively fill tiny gaps between interfaces, reduce thermal resistance and improve heat dissipation efficiency. Next, let's deeply understand the main types and characteristics of thermal interface materials.   Thermal grease Thermal conductive silicone grease, also known as heat dissipation paste, is a common paste-like thermal conductive interface material. It is made of silicone resin as matrix and high thermal conductivity filler (such as alumina, aluminum nitride, zinc oxide, etc.). Its advantage lies in its good fluidity and wettability, which can fully fill the tiny gap between the heat source and the radiator and effectively reduce the contact thermal resistance. The thermal conductivity of thermal conductive silicone grease is generally between 1-15w/(MK), which is suitable for the heat transfer between the heat sink and chips with high heat dissipation requirements such as CPU and GPU. ​ However, thermal conductive silicone grease also has some limitations. It has no structural support capacity, and the coating thickness needs to be strictly controlled. Too thick or too thin will affect the heat dissipation effect. Moreover, in the process of long-term use, silicone grease may dry up and its performance may decrease, so it needs to be replaced regularly. Thermal pad Thermal pad is a kind of sheet-like thermal conductive material with certain flexibility and elasticity, which is usually composed of polymer matrix (such as silicone rubber, polyurethane, etc.) and thermal conductive filler. According to the different hardness and shape, heat-conducting gasket can be divided into non-silicon heat-conducting gasket, high-hardness heat-conducting gasket, self-adhesive heat-conducting gasket and many other types. ​ The thermal conductivity of the thermal conductive pad is wide, generally 1-12w/(MK), which can closely adhere to the heating surface and the heat dissipation surface under a certain pressure and play a good role in buffering and damping. It is suitable for electronic components that are sensitive to mechanical stress, such as cooling modules in tablet computers and notebook computers. Because of its convenient installation, no complicated coating process and long service life, it has gradually become one of the mainstream options for heat dissipation of electronic equipment. Thermal conductive gel The thermal conductive gel has both the high filling property of thermal conductive silicone grease and the flexibility of thermal conductive gasket. It is based on silicone, with special thickener and high thermal conductivity filler. When it is not cured, it is gel-like, which can easily fill the interface gap and form an elastomer after curing. ​ The thermal conductivity of thermal conductive gel is usually 3-10w/(MK), which has the advantage that the dosage can be accurately controlled by dispensing process, and it has good aging resistance and mechanical stability after curing, and it will not dry up and crack, so it is suitable for automatic production. It is often used in mobile phones, smart wearable devices and other electronic products with strict requirements on space and heat dissipation. Thermal conductive phase change material Thermal conductive phase change material is a kind of special thermal conductive material with phase change in a certain temperature range, and the common phase change is from solid to liquid. In the process of phase change, materials can absorb or release a lot of latent heat, thus achieving efficient heat transfer. ​ This kind of material is solid at room temperature. When the temperature rises to the phase transition point, it will be transformed into a liquid with good fluidity to fill the interface gap, and its thermal conductivity will be significantly improved before and after the phase transition, generally reaching 5-15w/(MK). Thermal conductive phase change materials are especially suitable for electronic equipment with high heat dissipation requirements and large fluctuation of heating power, such as game books and servers. Thermal conductivity potting Thermal conductivity potting is a two-component or one-component liquid heat-conducting material, which is filled in the gap or cavity of electronic equipment by potting process and solidified to form a solid with certain strength and heat conductivity. It is mainly composed of resin matrix (such as epoxy resin, silicone resin, etc.) and heat conductive filler. ​ The Thermal conductivity potting compound is generally 1-8W/(MK), which can not only conduct heat, but also play the roles of waterproof, dustproof, insulation and mechanical fixation. It is often used in power modules, LED driving power supplies and other electronic devices that need integral sealing and heat dissipation.   With the rapid development of electronic technology, the requirements for thermal interface materials are getting higher and higher. In the future, thermal interface materials will develop in the direction of higher thermal conductivity, lower thermal resistance, thinner thickness, more environmental protection and multifunctional integration to meet the emerging new application scenarios and technical requirements.

Magical Application of Thermal Conductive Phase Change Materials in LED Products   As we all know, LED lamps have become the darling of the lighting industry because of their energy-saving and super-bright characteristics. But it generates a lot of heat when it works. If it can't dissipate heat, as soon as the temperature of the LED chip rises, the brightness will be affected and the life will be greatly reduced. According to research, every 10℃ increase of LED chip will reduce its luminous efficiency by about 3%-5%, and the internal structure of the chip will accelerate aging, greatly shortening the service life of LED lamps. So how to solve this heat dissipation problem? Thermal conductivity phase change material is a kind of material that can change shape with the change of temperature and absorb or release a lot of heat. It is solid at room temperature, and the thermal conductivity phase change material is particularly convenient to install. Just like a hard mat, it can be stably placed between the LED chip and the radiator. When the LED starts to work, the working temperature starts to rise. When the temperature reaches 50-60℃, the thermal conductivity phase change material begins to soften and flow, filling the uneven gullies and gaps between the chip and the radiator, so as to reduce the thermal resistance. You should know that air is a poor conductor of heat, and these gaps will seriously hinder the conduction of heat. However, with such changes in thermal conductivity phase change materials, the thermal resistance will be instantly reduced and the heat dissipation efficiency will be greatly improved. Generally, the thermal resistance of traditional heat conducting materials is 0.5-1.0℃ in/w, while the thermal resistance of phase change materials can be reduced to 0.1-0.3℃ in/w, which can improve the heat dissipation efficiency by 30%-50%. Compared with traditional heat conducting materials, it has obvious advantages. In LED products, how is the thermal conductivity phase change material specifically applied? In the LED lamp, there are many gaps between the bottom surface of the radiator and the surface of the LED chip. When the lamp is started, it will absorb heat, slow down the temperature rise of the LED, turn into liquid when it reaches the phase transition temperature, and quickly conduct heat to the radiator and emit it. When the light is turned off, it changes from liquid to solid, releasing heat. This can prolong the life of LED lamps.   In some high-end LED spotlights, the service life of lamps is increased from 20,000 hours to more than 30,000 hours after using phase change materials with thermal conductivity. In the LED display screen, thermal conductivity phase change materials can also be used to quickly dissipate heat, ensuring that each pixel can stably emit light and present a clear and colorful picture. Especially for outdoor large LED display screen, in the face of long-term sun exposure and high temperature environment, thermal conductivity phase change materials can effectively maintain the stable operation of the display screen, and avoid problems such as uneven color blocks and decreased brightness. Thermal conductive phase change materials have indeed brought revolutionary changes to the heat dissipation of LED products, making LED products have better performance and longer life. I believe that with the continuous development of technology, it will shine in more LED products and bring us better lighting and display experience! Thermal conductivity phase change material is a kind of material that can change shape with the change of temperature and absorb or release a lot of heat. It is solid at room temperature, and the thermal conductivity phase change material is particularly convenient to install. Just like a hard mat, it can be stably placed between the LED chip and the radiator. When the LED starts to work, the working temperature starts to rise. When the temperature reaches 50-60℃, the thermal conductivity phase change material begins to soften and flow, filling the uneven gullies and gaps between the chip and the radiator, so as to reduce the thermal resistance. You should know that air is a poor conductor of heat, and these gaps will seriously hinder the conduction of heat. However, with such changes in thermal conductivity phase change materials, the thermal resistance will be instantly reduced and the heat dissipation efficiency will be greatly improved. Generally, the thermal resistance of traditional heat conducting materials is 0.5-1.0℃ in/w, while the thermal resistance of phase change materials can be reduced to 0.1-0.3℃ in/w, which can improve the heat dissipation efficiency by 30%-50%. Compared with traditional heat conducting materials, it has obvious advantages.   In LED products, how is the thermal conductivity phase change material specifically applied? In the LED lamp, there are many gaps between the bottom surface of the radiator and the surface of the LED chip. When the lamp is started, it will absorb heat, slow down the temperature rise of the LED, turn into liquid when it reaches the phase transition temperature, and quickly conduct heat to the radiator and emit it. When the light is turned off, it changes from liquid to solid, releasing heat. This can prolong the life of LED lamps.   In some high-end LED spotlights, the service life of lamps is increased from 20,000 hours to more than 30,000 hours after using phase change materials with thermal conductivity. In the LED display screen, thermal conductivity phase change materials can also be used to quickly dissipate heat, ensuring that each pixel can stably emit light and present a clear and colorful picture. Especially for outdoor large LED display screen, in the face of long-term sun exposure and high temperature environment, thermal conductivity phase change materials can effectively maintain the stable operation of the display screen, and avoid problems such as uneven color blocks and decreased brightness. Thermal conductive phase change materials have indeed brought revolutionary changes to the heat dissipation of LED products, making LED products have better performance and longer life. I believe that with the continuous development of technology, it will shine in more LED products and bring us better lighting and display experience!

Discover ZIITEK Innovations in Thermal Management That Keep Electronics Cool & Reliable   ZIITEK Technologies, formally known as ZIITEK Electronic Materials Technology Co., Ltd., is a leading developer and manufacturer of thermal interface materials (TIMs) and related solutions, specializing in thermal management for electronics. Established in 2006 and based in China, Ziitek has built a strong reputation for delivering innovative products that enhance the cooling and reliability of electronic devices across industries like automotive, data centers, drones, and electric vehicles (EVs).   Thermal Management Innovations   Focuses on creating advanced TIMs that bridge the gap between heat-generating components (like CPUs, GPUs, and power electronics) and heat sinks or cooling systems. Our thermal solutions are designed to efficiently dissipate heat, ensuring electronics remain cool and perform reliably under demanding conditions. Key innovations include:   1. Diverse TIM Portfolio Thermal Pads: Offers soft, thermally conductive gap fillers, such as the TIF100 series, which feature a fiberglass-reinforced liner for added durability. These pads are highly conformable, filling microscopic gaps to reduce thermal resistance and improve heat transfer. They’re ideal for applications with uneven surfaces or varying tolerances, like EV battery packs or automotive electronics.   Thermal Grease/Paste: These compounds eliminate air gaps between components and heat sinks, offering low thermal resistance . They’re easy to apply and excel in high-power devices where precision cooling is critical.   Phase-Change Materials: Combining the benefits of adhesives and grease, these materials transition from solid to liquid at specific temperatures, providing excellent heat transfer ，They’re suited for standard transistor assemblies and compact electronics.   Thermally Conductive Adhesives and Potting Encapsulants: These provide structural support alongside heat dissipation, protecting components while managing thermal loads in rugged environments like drones or industrial equipment.   Thermal conductive double-sided adhesive tape: thermal conductive double-sided adhesive tape is a kind of adhesive tape, which is generally used to bond heat sinks and heating equipment. Put the thermal condctive double-sided adhesive tape between the heat sink and the heat sink, and press it with force, and the heat sink will be firmly fixed on the heat sink, which is simple and convenient to use and conducive to improving production efficiency. Its heat dissipation effect is more obvious than that of ordinary heat dissipation stickers, which greatly improves the service life of components and Widely used in LED products. Conductive graphite sheet: Nano-carbon coated composite aluminum foil is a brand-new heat-conducting and heat-dissipating material, with unique grain orientation and uniform heat conduction in two directions. The sheet-like structure can be well adapted to any surface, shielding heat sources and components while improving the performance of consumer electronic products. It has a very high thermal conductivity: (450W/m-K) it can be used in notebooks, computers, projectors and other equipment, and it also has good functions of heat conduction and high-temperature radiation heat dissipation.

With the continuous progress of LED technology, LED lamps are more and more widely used, from home lighting to commercial lighting, and then to industrial lighting, LED lamps have won wide recognition in the market for their effective, energy-saving and environmental protection characteristics. However, LED lamps will produce a certain amount of heat in the process of working, if the heat cannot be dissipated in time, the performance of the lamps will be reduced, or even damaged. Therefore, the problem of heat dissipation has always been a key link in the design and manufacture of LED lamps. In recent years, as a new type of heat dissipation material, thermal conductive plastic has shown unique advantages in the heat dissipation of LED lamps. 1. It is light in weight and easy to install and transport   By adding high thermal conductivity materials, the thermal conductivity of thermal conductive plastic is prepared into thermal conductive filler/polymer composite, and its thermal conductivity has been significantly improved. In some applications, the thermal conductivity of thermally conductive plastics has been comparable to that of traditional heat dissipation materials such as thermally conductive silicone grease, especially in the need for lightweight materials, thermally conductive plastics show their unique advantages. And the density of thermally conductive plastics is much lower than that of metallic materials such as aluminum, which means that heat sinks made of thermally conductive plastics weigh less in the same volume. The weight of LED lighting has an important impact on its transportation, installation and falling risks, so the use of heat conductive plastic made of radiators in these aspects has more advantages. The lightweight design not only reduces the total weight of the lamp, but also makes the installation and transportation of the lamp more convenient.   2. convenient processing, flexible design   Thermally conductive plastics are easy to form under injection molds, and more complex and thinner shapes can be designed, and a molding without post-processing, greatly improving the production efficiency. In contrast, traditional heat dissipation materials, such as metal heat sinks, may require more steps and costs in the processing process. In addition, the design flexibility of thermally conductive plastics is higher and can meet the needs of different shapes and sizes, providing more possibilities for the design of LED lamps.     3. strong environmental protection   In the production process of plastic cases, little toxic pollution is generated, while in the production of aluminum cases, processes such as electroplating may be involved, and metals in electroplating waste liquid can cause pollution to water sources and soil. Therefore, from an environmental point of view, thermally conductive plastics have more advantages. This is in line with the current society's pursuit of green and environmental protection, and it is also an important factor that LED lamp manufacturers need to consider when selecting heat dissipation materials.

High performance thermal conductive pad can easily solve the heat dissipation problem of intelligent robot   With the continuous progress of science and technology, various types of robots developed by modern science and technology have been widely used in many fields. At present, intelligent robots put into the market are mainly to achieve specific functions.There are a large number of electronic devices distributed in the control system of robots, such as controllers, motor drives and various sensors.   As the temperature increases, the failure rate of electronic components will increase exponentially. Like most electronic products, the robot also needs to dissipate heat to maintain stable operation. The controller structure of the main board will be equipped with a radiator according to the position of the heat source. In the middle, thermal conductive interface materials are needed to conduct heat, and thermal conductive silica gel sheet is one of the commonly used thermal conductive interface materials.   Ziitek high performance thermal pad has good characteristics, which can meet the heat dissipation needs of intelligent robots. The use of thermal conductivity silica gel sheet can also help heat dissipation efficiency, to ensure its stability. The thermal conductivity silica gel sheet also has very good thermal conductivity, which can effectively transfer heat from the intelligent robot chip, and can fill the tiny gap between the radiator and the chip, thus improving the efficiency of heat transfer.     TIF thermal conductive pad product features: 1. good thermal conductivity: 1.2~25W/mK 2. a variety of thickness options: 0.5mm-5.0mm 3. fire rating: UL94-V0 4. insulation and heat conduction, soft and elastic 5. suitable for low pressure application ring

  Application and Importance of Thermal Conductive Interface Materials in Heat Dissipation of Electric Vehicles   The rapid development of electric vehicles puts forward higher requirements for battery heat dissipation technology. Thermal interface material (TIM) plays an important role in the heat dissipation of electric vehicles. They are mainly used to fill tiny gaps between electronic components, reduce contact thermal resistance and improve heat dissipation efficiency. Common thermal interface materials include thermal conductive silica gel sheet, thermal conductive gel, thermal conductive gasket, etc. These materials have excellent thermal conductivity and insulation performance, and can effectively conduct heat from heating elements to heat dissipation system.   Specific application scenarios of thermal interface materials in electric vehicles;   1. Battery heat dissipation: In electric vehicles, the battery is one of the main heat sources. Thermal interface materials, such as thermal conductive silica gel sheet and thermal conductive gel, are widely used between battery module and water cooling system to help transfer heat efficiently and protect battery pack. For example, the thermal conductive silica gel sheet can closely adhere to the core components such as battery pack, motor and electronic control, improve the heat conduction efficiency and ensure the stable operation and safety of the battery system. 2. Heat dissipation of motor and electronic control system: The motor and electronic control system will also generate a lot of heat during operation. Thermal interface materials can effectively conduct the heat generated by these components to the heat dissipation system, and prevent performance degradation and damage caused by overheating.   If you would like to learn more about Ziitek performance thermal materials, please visit our website at www.ziitek.com.vn