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Artificial heat-conducting graphite sheet: Lightweight and flexible, unlocking new possibilities for cooling curved devices   In the wave of innovation in electronic device forms, curved design and folding shapes have become the mainstream trends in consumer electronics, vehicle terminals, and wearable devices. However, the irregularity of the curved structure and the space limitations within the devices have left traditional heat dissipation materials in a predicament of "difficult adaptation and poor heat dissipation" - rigid heat dissipation plates cannot fit the curved surface, heavy materials occupy internal space, and thin materials are unable to meet the requirements for effective heat dissipation.   The emergence of artificial heat-conducting graphite sheets, with their core advantage of being "thin, lightweight and flexible", has effectively solved the heat dissipation problems of curved devices, becoming a key support for the innovation of terminal products. "Thin and flexible" is the core highlight that makes it suitable for curved devices. The thickness of the membrane can be customized in multiple specifications. The thin and lightweight feature almost does not occupy the internal space of the device, perfectly aligning with the design concept of "lightweighting and ultra-thinness" for curved and foldable devices. It also has excellent flexibility and bending performance, which can be freely fitted according to the curvature and contour of curved devices. Whether it is the curved edge of a curved-screen phone, the hinge area of a foldable laptop, or the curved display of a vehicle dashboard or wearable devices, it can closely cover the heat dissipation surface, achieving efficient and effective heat dissipation without any dead zones. This effectively solves the industry problem of traditional heat dissipation materials being "strongly rigid and poorly compatible".   In addition to its core adaptability advantage, the manually heated graphite sheet also has the characteristics of easy processing and wide adaptability. It supports precise die-cutting according to the size, shape and heat dissipation requirements of different devices, and can be customized with special specifications such as irregular shapes and holes, to meet the personalized heat dissipation needs of various curved surface devices. From curved screen mobile phones to foldable terminals, from curved central control units for vehicles to smart wearable devices, artificial heat-conducting graphite sheets have become the preferred solution for heat dissipation in curved devices due to their core characteristics of "high thermal conductivity, ultra-thinness, strong flexibility, and easy adaptability". It not only breaks the form limitations of traditional heat dissipation materials, but also helps terminal products achieve dual breakthroughs in design innovation and performance improvement, allowing curved devices to not only have stunning appearance designs but also maintain stable and smooth usage experiences.  

To determine whether the thermal conductive silicone is toxic, several key indicators need to be considered In the cooling solution of electronic devices, conductive silicone grease is the core material that fills the gap between heat sources and heat dissipation components, and is widely used in scenarios such as computer CPUs, smartphone chips, and main control boards of household appliances. As a consumable that closely cooperates with electronic devices, its safety directly affects the safety of production operations, the health of the usage environment, and even the potential harm to the human body after long-term contact. Many users will pay attention to whether "the conductive silicone grease is toxic" when choosing. In fact, the answer lies in the key indicators and certifications of the product. By mastering the following judgment points, risks can be avoided.     I. Core Component: Avoiding toxic additives is the foundation The toxicity of thermal conductive silicone grease mainly comes from the base material and additives. Good products will adopt environmentally friendly and non-toxic formulations. The main components to pay attention to are: Base adhesive base: Most regular products are based on silicone resin. This type of material has stable chemical properties and does not release volatile toxic substances. If the product is labeled as containing "dichlorobiphenyls" or "halogen-containing flame retardants", it must be avoided directly. These substances are not only toxic but also may decompose at high temperatures to produce harmful gases. Heat-conducting fillers: Common non-toxic fillers include inorganic powders such as aluminum oxide, boron nitride, and zinc oxide, which have high thermal conductivity and strong chemical inertness. However, be cautious of fillers containing heavy metal compounds like lead, cadmium, and mercury. If these substances enter the human body through skin contact or inhalation of dust, they can accumulate and cause chronic harm, especially during product application, maintenance, and replacement, where the risks are higher.     II. Hazardous Substance Content: Confirm with Official Standard Certification Whether the components are compliant requires an authoritative inspection and certification endorsement. When purchasing, you can mainly check if the product has the following certifications or indicators as descriptions: EU RoHS Certification: This standard strictly limits the content of 6 harmful substances such as lead, cadmium, mercury, and hexavalent chromium. Products that have passed the certification can be regarded as basically non-toxic safe options, suitable for most electronic device scenarios. China GB/T 26572 standard: A domestic mandatory standard for restricted substances in electronic and electrical products, which is consistent with the core requirements of RoHS certification. Products that comply with this standard will be clearly marked in the packaging or instructions. Volatile Organic Compounds (VOC) content: The VOC content of a good thermal conductive silicone grease should be very low. If the product is labeled as "VOC content ≤ 1g/L", it indicates that it will hardly release toxic volatile gases during use, thus avoiding indoor or equipment internal air pollution caused by long-term use.     III. Safety Level Marking: Focus on Adaptation to Usage Scenarios Some products will be clearly labeled with their safety grades, helping users quickly determine the applicable scenarios. Common labels include: "Non-toxic", "Environmentally friendly", "Food contact grade" (for special scenarios): Such labels must be supported by test reports, indicating that the product will not produce toxic substances even under high temperatures and long-term contact conditions, and are suitable for equipment with high safety requirements (such as medical electronics and children's electronic products). Classification and identification of hazardous chemicals: If the product is labeled with "Toxic Substance", "Stinging", etc., it indicates that it contains toxic components or is prone to cause harmful irritation. It cannot be used in enclosed spaces, electronic devices that are easily accessible to humans, and is only applicable in special industrial high-temperature scenarios (and requires professional protection).     IV. Auxiliary Judgment Based on User Experience: Avoiding Hidden Risks Apart from the explicitly stated indicators, the intuitive feelings during the usage process can also assist in judging the safety. Odor: A good thermal conductive silicone grease should have no obvious odor. If you smell a pungent or foul odor after opening the package, it may indicate that cheap and toxic solvents or inferior fillers have been added. Such products will release more toxic gases when used at high temperatures, and you should immediately stop using them. Stability: If the product dries out rapidly, cracks, or oozes oil after application, it may indicate an unstable formula, and the oil-seeping components may be toxic. On the other hand, a product with a uniform texture, low volatility, and no abnormal changes over a long period of use is more likely to be safe.   In conclusion: To determine whether a thermal conductive silicone is toxic, the key lies in "examining the ingredients, verifying the certification, and checking the labels": Opt for products that are based on organic silicon, with inorganic non-toxic fillers as the core, and that have passed RoHS or GB/T 26572 certification. Avoid options containing heavy metals, halogens, and high VOC levels. Whether it's for large-scale procurement by electronic equipment manufacturers or individual users' own replacements, the safety indicators of the product should be given due attention - good thermal conductive silicone not only ensures effective heat dissipation but also avoids health risks at the source, making the use of equipment more reassuring.

The heat dissipation savior is here! TIC800G thermal conductive phase change material - why is it the "invisible armor" of photographer's SD cards?     Why do high-speed SD cards become "hot potatoes"? With the increase in resolution and shooting speed, data pours into the SD card at a rate of every second. This intense read-write operation causes the main control chip and storage units of the SD card to generate an astonishing amount of heat. If overheating occurs, it will directly lead to: 1. Triggering frequency reduction: To protect the hardware, the SD card will automatically reduce its read and write speeds, resulting in lagging in continuous shooting and interruption of video recording. 2. Data error risk: High temperatures are the enemy of the stability of electronic components, which may increase the risk of data write errors or loss. 3. Lifespan reduction: Prolonged operation under high temperatures will accelerate the aging of the internal components of the SD card.     So why is the TIC800G thermal conductive phase-change material such a perfect match for SD cards?   1. Accurate temperature control, continuous performance boost: By effectively regulating the temperature of the chip, it can prevent the SD card from reducing its speed due to overheating. This means that when you are recording high-definition videos for a long time or performing high-speed continuous shooting, you can enjoy a more stable and uninterrupted performance output. 2. Ultra-thin and flexible, without occupying space: The TIC800G thermal phase-change material can be made into very thin sheets, which can be easily inserted into the compact space inside the SD card without requiring any changes to the existing design. It is an ideal solution for addressing the heat dissipation problem of small electronic devices. 3. Interface filling, effective heat conduction: Its soft nature can effectively fill the air gap between the chip and the housing (air is a poor conductor of heat), establishing an effective "heat conduction bridge", significantly enhancing the overall heat dissipation efficiency. 4. Reliable and durable, safeguarding data security: By keeping the SD card operating at a certain temperature, it not only enhances the     stability for immediate use, but also protects the flash memory chips and the main control chip in the long term, prolonging the product's service life. This provides an insurance for your valuable data assets.   The invisible guardianship, the visible stability, unlocking the unknown potential In today's era of rapid development in photography technology, stability and reliability have become a higher pursuit beyond mere parameters. The TIC800G thermal conductive phase change material, this "cooling guardian" working silently within the SD card, is precisely an embodiment of this pursuit. Although it is not visible externally, it is of vital importance and serves as a solid support to ensure that every professional creator does not miss any wonderful shots at critical moments.  

Invisible "radiator" of electronic equipment: magical application of heat conduction pad   The common problems, such as the sudden jamming of the mobile phone when playing games, the fan spinning wildly when the laptop is running software, and the disconnection of the router after working for a long time, mostly stem from the "fever crisis" of electronic equipment. Electronic components will continue to generate heat when working. If the heat cannot be discharged in time, it will not only reduce the performance of the equipment, but also shorten the service life and even cause safety hazards. In many heat dissipation schemes, the seemingly inconspicuous thermal pad is the key role to solve this problem. What is a thermal pad? Thermal pad is a kind of polymer composite material with silica gel as the core substrate and mixed with high thermal conductivity fillers such as metal oxides (such as alumina) and carbon materials (such as graphene). It is soft in texture, can be cut at will, and can be attached to the surface according to the shape of electronic components. It is not as hard and rigid as a metal heat sink, and it does not need complicated application of liquid thermal paste.   It seems that the electronic components are closely attached to the radiator, but there is actually a tiny gap, and the air in the gap has extremely poor thermal conductivity (only one thousandth of that of metal), which will form a "thermal barrier". The core function of the thermal pad is to fill these gaps, remove air, minimize the thermal resistance, and let the heat generated by the components be quickly transferred to the radiator, and then discharged through fans, cooling holes and other means to achieve efficient heat transfer.   Specific application of thermal pad in different electronic components; (1) Computer field CPU and graphics card are the "big fever families" of computers, especially the high-performance graphics cards of game books or desktops, and the working temperature can soar above 80℃. Between these components and the heat dissipation module, the heat conduction pad can closely adhere to the uneven surface, and cooperate with the heat pipe to quickly conduct away the heat, so as to avoid CPU frequency degradation due to overheating and graphics card jamming due to high temperature, and ensure the continuous high-performance operation of the equipment. ​   (2) Communication equipment Communication equipment such as base stations and routers need to work 24 hours a day, and internal signal processing chips and power modules will continue to generate heat. If the temperature is too high, the signal may be interrupted. The heat-conducting pad is installed between these heating elements and the equipment shell (or built-in heat sink), which can stably export heat without additional power supply and ensure the smooth and stable communication signal. ​   (3) Automotive electronics Battery management system (BMS) and on-board computer of new energy vehicles are extremely sensitive to temperature. Too high or too low temperature will affect battery life and driving safety. By virtue of its resistance to high and low temperature (-40℃~200℃), the thermal pad can fit the battery pack and the heat dissipation plate, adjust the temperature in real time, and be insulated and nonconductive, thus avoiding the risk of short circuit. ​   (4) Consumer electronic products Smart phones and tablets are too small to accommodate large heat sinks. Sticking thin thermal pads on the surfaces of processors, power amplifiers and other components can quickly transfer heat to the fuselage shell, reduce the phenomenon of "local burning", make users more comfortable to hold, and avoid the aging of components due to high temperature. ​   (5) LED lighting Although the LED lamp saves energy, the light source chip will still generate heat when it works. If the heat accumulates, it will lead to the dimming of the light and shorten the service life. The heat conducting pad is sandwiched between the LED light source and the heat dissipation substrate, which can efficiently conduct heat, keep the LED lamp stable in brightness, and prolong its service life by more than 30%. Compared with other heat dissipation materials, the thermal pad has outstanding advantages: first, it has strong insulation to avoid short circuit of components; Second, it has good flexibility and adapts to complex surfaces; Third, the installation is convenient, and it can be pasted after cutting without professional tools; Fourth, it is stable for a long time, not prone to aging and deformation, and can continue to play a heat dissipation role without frequent replacement. ​   When selecting, focus on three core indicators: First, thermal conductivity (unit: w/(MK)), the higher the value, the better the thermal conductivity, just choose 1-3 w/(MK) for ordinary equipment and 5 w/(MK) or above for high-performance equipment; Second, the thickness, according to the gap between the component and the radiator, is generally 0.5-5mm, too thick will increase the thermal resistance; The third is the working temperature range, which ensures the matching with the working environment of the equipment. For example, the automobile electronics needs to choose high and low temperature resistant models. ​   From daily mobile phones and computers to industrial communication base stations and automobile electronics, the thermal pad acts as an "invisible guardian" to ensure the stable operation of electronic equipment. With the development of technologies such as 5G and new energy vehicles, the requirements for heat dissipation will be higher, and the future thermal pads will be upgraded in the direction of higher thermal conductivity, lighter and more environmentally friendly, which will continue to "cool down" the development of the electronics industry.

Glory Escort: Ziitek Thermal Conductive Materials Assist Shanghai Terjin Unmanned Aerial Vehicle, Safeguarding Low-Flying Safety on the Victory Day of the "September 3rd Military Parade"   On the morning of September 3, 2025, a grand ceremony was held in Beijing to commemorate the 80th anniversary of the victory of the Chinese People's Resistance Against Japanese Aggression and the World Anti-Fascist War. Above Tiananmen Square, fighter jets were soaring, and on the ground, a continuous stream of vehicles was moving. A grand military parade was held. This military parade was of great significance. Many new types of equipment were showcased, among which unmanned and anti-unmanned equipment, as key components of new quality combat capabilities, demonstrated the leapfrog development of China's national defense science and technology.   Behind this highly anticipated and historic event, there was countless hours of meticulous preparation and strict protection. The hundreds of sets of unmanned aerial vehicle detection and defense equipment dispatched by Shanghai Special Forces served as the "invisible shield" for ensuring low-altitude safety at the scene. Once again, they did not disappoint and successfully completed the security mission, ensuring the safety of the military parade. The unmanned aerial vehicle (UAV) jammer/interference device of Shanghai Terjin is the core component of the low-altitude defense system. During the execution of tasks, the internal high-power radio frequency chips (RF Chips) and digital signal processors (DSP/FPGA) and other core components will generate a large amount of heat. Especially when operating continuously in complex outdoor environments throughout the day, the heat dissipation poses a severe challenge:   Performance attenuation risk: Heat accumulation leads to an increase in the chip's junction temperature, causing "thermal throttling", resulting in a shorter shielding distance and slower response of the equipment, directly affecting the security effectiveness. Equipment reliability risk: Long-term operation under high temperatures will accelerate the aging of electronic components and even cause system downtime. In the context of major event support, any minor malfunction is unacceptable. Environmental adaptability requirements: The equipment must be able to withstand outdoor exposure to sunlight, rain, and changes in temperature throughout the day, and the heat dissipation materials must possess excellent long-term stability and weather resistance. Therefore, an efficient, stable and reliable cooling solution is the physical foundation that ensures Shanghai Tekin equipment is always in a good working condition and can successfully complete tasks without any problems.   In response to the high power, high integration and high reliability requirements of the Shanghai Terjin unmanned aerial vehicle shielding device, Ziitek Electronics has provided a professional thermal conductive material application solution to ensure the "cool" operation of the equipment. Between the high-power RF chip and the heat dissipation housing, there is a TIF thermal conductive silicone sheet.   1. By filling the gap between the chip and the metal shielding shell or the heat dissipation base plate with Mako thermal conductive silicone sheet, it is possible to effectively fill the air gap, establish a high heat conduction channel, and quickly transfer the heat generated by the chip to the device casing and release it into the external air. Excellent thermal conductivity: Offers a range of thermal conductivities: 1.2 - 25 W/m·K for selection, meeting the requirements of different heat flux densities. 2. Insulation and shock resistance: The material itself has excellent electrical insulation properties, which can protect the chip. At the same time, it is soft and has a buffering effect, making it suitable for vibrations and shocks in vehicle-mounted and outdoor mobile environments. 3. Easy installation: It can be pre-formed and has inherent micro-adhesiveness, making it convenient for quick installation and maintenance, and suitable for large-scale production. Between the central processor and the compact heat sink, TIG thermal conductive silicone grease   1. For CPU/FPGA chips with extremely limited space and high thermal conductivity requirements, MegaCool thermal conductive silicone grease should be adopted. It can completely fill the microscopic unevenness on the surface of the chip and the heat sink, achieving a low contact thermal resistance and realizing efficient heat dissipation. Excellent thermal conductivity: Offers a range of thermal conductivities: 1.5 - 5.6 W/m·K for selection. 2. Ultra-low thermal resistance: The high-purity filler formula ensures excellent thermal conductivity, effectively reducing the temperature of the core chip. 3. High-temperature stability: Resistant to high temperatures, non-curing, non-dripping. Its performance remains unchanged even under long-term high-temperature operation, ensuring the equipment operates stably and continuously. The success of every national event is the result of the joint efforts of enterprises along the entire industrial chain. Shanghai Terjin, with its outstanding technical strength, ensures the safety of low-altitude airspace in the country. Meanwhile, Ziitek, with its excellent thermal conductivity material technology, quietly safeguards the stable operation of Shanghai Terjin's unmanned aerial vehicle equipment.   Ziitek Electronic Materials Technology is honored to be able to contribute to the security work for the 9.3 Victory Day military parade in this way. Together with Shanghai Terjin and all national enterprises, we deeply cherish our sense of patriotism, fulfill the social responsibility of contributing to the country through the industry, and jointly build a solid low-altitude security defense line.

Application of thermal grease   With the rapid development of science and technology, the transistor is getting smaller and smaller, the best way to solve the heat problem is using heat sinks. Someone may overlooked the tiny gap between the chip and heat sink, but the gap formation would affect the thermal conductive greatly.So we recommend you Ziitek thermal grease, which used between the chip and heat sink, filling the gap, help convey the heat.   Thermal silicone grease, commonly known as heat-dissipating paste, is a thermal interface materials that fills the gap between CPU and heat sink. It is made of organic silicone and a variety of heat-resistant and heat-conductive materials. When the computer is running, the CPU generates a lot of heat, which needs to be transferred to the heat sink and then dissipated. However, there is a tiny gap between the CPU and the heat sink, and air hinders the heat transfer. Thermal conductive silicone grease can fill the gap, allowing the CPU to transfer heat more smoothly, preventing the CPU from being damaged due to poor heat dissipation and prolonging its service life.     Thermal conductive silicone grease is widely used, involving the heat dissipation of electronic equipment. In the computer field, CPU and GPU run high-intensity tasks to generate a lot of heat, and thermal conductive silicone grease is coated between them and the radiator to maintain hardware stability; In the power module, components are helped to dissipate heat to ensure stable power supply; Improve the heat dissipation performance and prolong the service life of LED lighting lamps; In the automotive electronic equipment, ensure the stable operation of the equipment in the complex environment and ensure the driving safety; 5G communication base station equipment ensures that the base station works stably for a long time with high load and ensures the stability of communication signals.     Specs of Ziitek thermal grease TIG series   Although the thermal conductive silicone grease is small, it plays a key role in the stable operation of electronic equipment. From computers to all kinds of electronic devices, it silently guards the hardware so that they can work at a suitable temperature. Everyone must pay attention to the heat dissipation of equipment at ordinary times, regularly check the state of heat-conducting silicone grease, and replace it in time if it is dry or invalid. Choosing the appropriate thermal conductive silicone grease and mastering the correct application method can make our equipment more stable and last longer. Don't let a small heat dissipation problem affect the performance of the equipment, let's act together to "cool down" the electronic equipment!  

Advantage and Disadvantage of using potting glue for PCB board   The advantages and disadvantages of using thermal conductive potting glue for circuit boards are as follows: latest company news about Advantage and Disadvantage of using potting glue for PCB board 0 The advantages:   1. protect the circuit board: thermal conductivity potting adhesive can effectively protect the circuit board, prevent it from being affected by the external environment, such as moisture, dust, vibration, etc. 2. improve electrical performance: thermal conductivity potting adhesive has excellent electrical performance and insulation ability, can effectively improve the electrical performance and stability of the circuit board. 3. enhance thermal conductivity: thermal potting adhesive has good thermal conductivity, can transfer the heat generated by the circuit board to the surrounding environment, so as to reduce the operating temperature of the circuit board. 4. improve weather resistance: some thermal conductivity potting adhesive has good weather resistance, can maintain its performance in harsh environmental conditions stable, so as to extend the service life of the circuit board.   latest company news about Advantage and Disadvantage of using potting glue for PCB board 1 The disadvantages:   1. high cost: some good thermal conductivity potting adhesive price is high, will increase the manufacturing cost of the circuit board. 2. difficult to operate: the operation of thermal conductivity potting glue requires certain professional skills and experience, if improper operation may cause damage to the circuit board. 3. Long curing time: some thermal conductive potting adhesives need long curing time, which will affect production efficiency. 4. Environmental protection: Some thermal conductive potting adhesives may have a certain impact on the environment in the process of production and use.

From CPU to IGBT: Thermal Conductive Paste Selection and Thermal Management Optimization Guide   With the continuous increase in the power density of electronic devices, effective thermal management has become a key factor in ensuring the reliability and performance of the system. From the central processing unit (CPU) of personal computers to IGBTs in the power electronics field, if the heat generated by electronic components during operation cannot be promptly dissipated, the temperature will rise sharply, which will affect the performance of the equipment, shorten its service life, and even cause malfunctions.   Thermal conductive silicone is a common type of thermal interface material, which is widely used in the cooling systems of various electronic devices due to its excellent thermal conductivity, convenient application, and cost advantages. However, in response to the diverse requirements of different application scenarios, how to scientifically select and use thermal conductive silicone to achieve good thermal management results remains a practical challenge for engineers. Thermal conductive silicone is a paste-like composite material composed of an organic silicon matrix and a conductive filler. Its working principle is to fill the microscopic gaps between the heat sink and the heating element, remove the air between the interfaces, and establish an effective heat conduction channel. The key performance indicators of thermal conductive silicone include thermal conductivity (typically ranging from 1.2 to 25 W/m·K), thermal resistance (significantly affected by thickness and contact area), operating temperature range (-40°C to 200°C), dielectric strength (important for insulation applications), and rheological properties such as viscosity and thixotropy. Additionally, the stability of performance over long-term use, including resistance to aging, drying, and pump-out ability, is also a factor to consider in practical applications. Thermal conductive silicone is a key material for thermal management in electronic devices. The correct selection and application of this material have a significant impact on the performance and reliability of the devices. In the future, as the power density of electronic devices continues to increase and the application scenarios become more diverse, the technology of thermal conductive silicone will develop towards higher thermal conductivity, better stability, and greater intelligence.

The helpful companion of the heat dissipation module - thermal conductive silicone sheet The heat dissipation module is a module unit used for heat dissipation in systems, devices, and equipment. Using a heat dissipation module for cooling is one of the limited heat dissipation methods for most compact electronic products at present, and it is also the main heat dissipation method. In heat dissipation modules, similar products such as thermal conductive silicone sheets are mostly used to assist in heat dissipation, and the combination of the two achieves a better heat dissipation effect.   First of all, the thermal conductivity range of the thermal silicone sheet is very wide, ranging from 1.2 W/mk to 25 W/mk. Generally, as long as the temperature difference required by the product can be achieved, it is sufficient. If the thermal conductivity requirement is not very high, then a low thermal conductivity silicone sheet can be used. Because these silicone sheets have good cost performance, reasonable prices, stable performance and good thermal conductivity. Because the thermal conductive silicone sheet is very soft and has good compressibility, the compression ratio of the thermal conductive silicone sheet is over 20% (depending on the specific product hardness), so when choosing the thickness of the thermal conductive silicone sheet, the compression ratio issue must be taken into consideration. This will enable the thermal conductive silicone sheet to fit better between the heat source and the heat sink, significantly increasing the effective contact area and thereby improving the heat conduction effect.   Note: When choosing a heat dissipation module, using a heat-conducting silicone film is not about having the highest thermal conductivity. Instead, it depends on specific circumstances to select the appropriate product. Also, it's not that the more expensive it is, the better it is. Choosing the right one or the suitable one is what makes it good.  

The "savior" of computer CPU's heat dissipation performance-thermal conductive gel   When the computer is running, the CPU runs at a high speed like a "brain", which generates a lot of heat. If the heat can't be released in time, the CPU temperature will soar, which will directly lead to a sudden drop in the running speed of the computer, frequent jamming, even a crash, blue screen and other conditions, and even shorten the service life of the hardware in serious cases.For gamer, video editors and other people who need computers to run with high load for a long time, the heat dissipation problem is a "roadblock" that affects the work and entertainment experience. Therefore, heat dissipation is very important for CPU, and thermal conductive gel plays an indispensable role in it. How does it play its role? Thermal conductive Gel, also often called thermal conductive gap filler materials, is a kind of high thermal conductive material specially developed to solve the problem of heat conduction, which plays a key role in the field of heat dissipation of electronic equipment. It is mainly made of silicone grease, which has good insulation and chemical stability and can provide stable structural support for thermal conductive gel. Metal oxides (such as alumina, zinc oxide, etc.) and some special heat conducting materials (such as silver powder, ceramic particles, etc.) are also added as heat conducting fillers. These thermal conductive fillers are the key to improve the thermal conductivity of thermal conductive gel. They are like efficient heat transfer messengers, which can quickly capture and transfer heat.   Compared with ordinary thermal conductive materials, the thermal conductivity of thermal conductive gel is much higher. This means that it can transfer the heat generated by the CPU to the radiator at a faster speed. For overclocking players who pursue extreme performance, and users who need the computer to run under high load for a long time (such as those who do large-scale 3D modeling and rendering work), this efficient heat conduction ability is very important and can effectively avoid the performance bottleneck caused by overheating.   Compared with thermal conductive pad, thermal conductive gel has wider applicability. Regardless of the shape and size of the CPU, it can be perfectly adapted. The daubing installation process is simple and easy to understand, and even novices can get started quickly. Moreover, when it needs to be replaced in the future, it is more convenient to clean up the residue, and it will not be as difficult to handle as some materials. Among the materials to improve heat dissipation performance, the price of thermal conductive gel is relatively close to the people. For users who want to improve the heat dissipation of computers and don't want to invest too much budget in this area, it is undoubtedly an ideal choice with high cost performance. Spending a little money can get obvious performance improvement, which is favored by the majority of users.   To sum up, thermal gel plays an important role in the heat dissipation of computer CPU, which provides strong support for improving computer performance with its excellent thermal conductivity, flexible ease of use and high cost performance. For users who want to improve the heat dissipation of computers, they may try to use thermal gel, which may bring unexpected results. With the continuous development of science and technology, the future heat dissipation materials will move towards a more efficient, safer and more convenient direction, and the thermal conductive gel is also expected to show greater potential in the technological upgrading and continue to contribute to computer heat dissipation.