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Thermal Interface Materials for Cold Plate Cooling: A Practical Guide For high-power AI servers, power electronics and liquid cooling systems   As power density surges in GPUs, ASICs and power modules, cold plate liquid cooling has become the mainstream thermal solution to replace traditional air cooling. Many engineers focus on cold plate structure, channel design and coolant selection, yet overlook a decisive link in the heat transfer chain: thermal interface materials (TIMs). Even a precision-machined cold plate cannot achieve perfect contact with the component surface. Microscopic gaps filled with air create extra thermal resistance and bottleneck heat dissipation. The right TIM displaces trapped air, fills surface irregularities, and builds a continuous, stable thermal path from die to cold plate. This practical guide helps you select, validate and deploy TIMs reliably for cold plate cooling systems.   Why TIM Performance Makes or Breaks Cold Plate Cooling The heat flow path in cold plate cooling follows a simple sequence: heat source → TIM → cold plate → circulating coolant. The cold plate itself only performs well when the interface stays low-resistance and stable over the product lifecycle. In cold plate applications, TIMs face harsher challenges than air-cooled scenarios: repeated thermal cycling, assembly compression, mechanical vibration, package warpage, and long-term risk of pump-out, dry-out or material migration. A poor TIM choice leads to rising junction temperature, unexpected thermal throttling, reduced computing uptime, accelerated component ageing and even premature field failure. For high-density AI computing, EV power converters and industrial high-power equipment, consistent interface performance is non-negotiable. Common TIM Types for Cold Plate Cooling: Match Material to Application No single thermal interface material fits all cold plate designs. Each category carries trade-offs in thermal resistance, BLT (bond line thickness), compressibility, reworkability, electrical insulation and long-term reliability.   Thermal Grease Offers ultra-thin bond line and very low thermal resistance for flat, rigid interfaces such as GPU integrated heat spreaders. It wets metal surfaces well under assembly pressure. Main drawbacks: pump-out risk after thousands of thermal cycles, messy dispensing and limited rework suitability. Best for controlled, low-warpage, high-volume assembly.   Phase Change Materials (PCM) Solid or semi-solid at room temperature; softens at designed phase-change temperature to conform tightly to mating surfaces. Balances low thermal resistance and less pump-out risk than grease. Easy to handle as preform sheets, cleaner in mass production. Widely adopted for AI server cold plates with moderate warpage.   Thermal Gel Single-component, dispensable, non-curing gel. Self-filling for variable gaps around HBM, VRMs and uneven surfaces. Good vibration resistance, reworkable and compatible with automated dispensing lines. Ideal for mixed-component cold plate assemblies where gap heights vary across the interface area.   Thermal Pads Solid, pre-cut sheets with controlled hardness and compression. Simple stacking, no contamination, excellent electrical insulation. Suited for larger, uneven gaps or components requiring cushioning. Note: thicker pads bring higher inherent thermal resistance, so specify the minimum usable thickness for your pressure window. Special TIMs (Liquid Metal, Solder TIM) Deliver industry-leading thermal resistance for extreme heat flux scenarios. However, they impose strict process constraints, carry electrical short risks and demand special handling. Reserved for premium high-performance systems with dedicated process controls.   Core Selection Checklist for Cold Plate TIMs Use these practical criteria to narrow down candidates instead of choosing by thermal conductivity alone: Target thermal resistance and BLT: Define the required bond line thickness under your actual assembly torque / pressure. Thermal conductivity is only meaningful at the compressed working thickness. Surface flatness and warpage: Severe die or cold plate warpage needs compliant materials such as gel or soft PCM, not thin grease. Pressure budget: Check TIM compression curve against your mounting hardware; avoid over-compression that damages chips or under-compression that leaves voids. Thermal cycling and lifetime requirement: Prioritize pump-out resistance, thermal stability and ageing data for data centre and 24/7 continuous operation. Electrical property: Confirm isolation requirements; conductive TIMs must never touch exposed circuits. Manufacturing flow: Evaluate dispensing, stencil printing, pick-and-place, rework and cleaning compatibility for your production line. Material compatibility: Verify no chemical interaction with cold plate surface finishes (Ni, Au, passivation), sealants and coolant vapour exposure.   Best Practices for Assembly & Validation Selection is half the work; proper integration unlocks the material’s rated performance. Control surface cleanliness: oil, release agent and dust create voids and raise thermal resistance. Standardise torque and pressure distribution: uneven clamping leads to local high resistance and hotspots. Characterise in the real system: bench thermal resistance tests in isolation often deviate from final cold plate assembly results. Run thermal cycling validation under representative power and temperature profiles. Monitor for degradation markers: rising junction delta-T after long-run testing signals pump-out, drying or delamination. Keep serviceability in mind: data centre cold plates that require field maintenance prefer reworkable gel or pad solutions over permanent bonding TIMs.   Tailored TIM Solutions for Your Cold Plate Projects Cold plate cooling is not one-size-fits-all, and neither is thermal interface material. Whether you design high-power GPU cold plates for AI racks, power module liquid cooling for energy conversion, or compact cold plates for transportation electronics, the optimal TIM stack balances thermal performance, manufacturability and long-term reliability. Our thermal engineering team supports material recommendation, sample validation, process guidance and custom formulation matching your cold plate design parameters, power loads and qualification standards. Turn thermal interface uncertainty into predictable, stable cooling performance. Contact our thermal experts today to review your cold plate specification and identify the best TIM solution for your application.

How to Select Thermal Pad Thickness for AI Server Applications As AI servers continue to handle increasingly demanding workloads, effective thermal management has become essential for maintaining system performance and reliability. GPUs, CPUs, AI accelerators, and power components generate significant heat during operation. Choosing the right thermal pad thickness helps improve heat transfer, reduce thermal resistance, and maintain stable contact between components and heat sinks. But how do you select the right thermal pad thickness for AI server applications? 1. Understand the Gap Between Components and Heat Sinks The first step is to measure the actual gap between the heat-generating component and the heat sink or cold plate. This gap may vary depending on component height, PCB layout, assembly tolerances, and mechanical deformation. A thermal pad that is too thin may not fill the gap completely, resulting in air pockets and poor thermal contact. A pad that is too thick may require excessive compression force, potentially placing unwanted stress on sensitive electronic components. For AI servers with multiple GPUs or high-power processors, accurate gap measurement is particularly important for consistent thermal performance. 2. Consider Thermal Conductivity and Compression Thermal pad thickness should not be selected based on thermal conductivity alone. The material's compressibility, hardness, and thermal resistance are also important. A softer thermal pad can conform to uneven surfaces with lower pressure, while a pad with excessive hardness may require greater assembly force. Selecting a material with suitable compression characteristics helps establish reliable contact without damaging components. In general, a thinner thermal pad may offer lower thermal resistance when other properties remain comparable. However, the best choice depends on the actual gap, contact pressure, surface conditions, and operating requirements. 3. Match Thickness to AI Server Components Different AI server components require different thermal interface solutions. GPUs and AI accelerators: Select thickness based on package height, heat sink design, and assembly tolerances. CPUs and power modules: Evaluate the interface gap and required thermal resistance under operating conditions. Memory modules and surrounding components: Consider component height variations and the available mounting pressure. VRMs and other power components: Choose a pad that provides reliable contact while accommodating different component heights. For assemblies with components at different heights, multiple pad thicknesses may be required to achieve consistent thermal contact across the board. 4. Validate Thickness Under Real Operating Conditions Before finalizing a thermal pad, engineers should evaluate thermal performance under representative workloads and assembly conditions. Key factors include operating temperature, compression ratio, mounting pressure, electrical insulation requirements, and long-term reliability. Testing different thicknesses can help identify the most suitable balance between heat transfer, mechanical stress, and assembly convenience. For high-performance AI servers, validation under actual system conditions is more reliable than selecting a pad based on thickness or thermal conductivity alone. 5. Choose the Right Thermal Pad with ZIITEK Selecting the right thermal pad thickness is a balance between gap dimensions, thermal performance, compressibility, and mechanical design. A properly selected thermal interface material helps support efficient heat dissipation and reliable AI server operation.   ZIITEK provides thermal management materials for demanding electronic applications, including thermal pads and other thermal interface solutions for GPUs, CPUs, AI accelerators, and data center equipment.   Contact ZIITEK to discuss your application requirements and identify a suitable thermal pad based on your target thickness, thermal conductivity, component gap, and assembly conditions.

ZIITEK TIF® 100N 8085-06: Low-Dielectric Thermal Management Solution for 5G, AI Computing, and High-Frequency Electronics With the rapid development of 5G communications, millimeter-wave radar, AI computing, and high-performance computing, electronic devices are becoming increasingly high-frequency, power-dense, and highly integrated. As electronic components generate more heat, efficient thermal management becomes essential, while thermal interface materials must also meet the electrical and high-frequency performance requirements of modern electronics. To address these demands, ZIITEK TIF®100N 8085-06 Low-Dielectric Thermal Pad combines high thermal conductivity, low dielectric properties, and excellent electrical insulation, providing a reliable thermal management solution for high-frequency and high-performance electronic devices. 1. AI Computing Servers: Managing Heat from High-Power Chips With the rapid growth of artificial intelligence, large AI models, and data centers, high-performance chips such as GPUs, CPUs, and ASICs in AI computing servers are required to process massive amounts of data. As chip power density continues to increase, efficient thermal management has become increasingly important. High-performance thermal interface materials can fill microscopic gaps between chips and heat sinks, helping establish an efficient and stable thermal transfer path.   Developed by ZIITEK, TIF®100N 8085-06 provides a thermal conductivity of up to 8.0 W/m·K and can be used for thermal interface management in AI servers and high-performance computing equipment. Its low-dielectric and electrical insulation properties provide a comprehensive TIM solution for advanced electronic devices. 2. 5G Base Stations: Thermal Management for High-Frequency Communication Equipment RF modules and power components in 5G base stations need to operate reliably for extended periods, while high-power operation generates continuous heat.TIF®100N 8085-06 combines 8.0 W/m·K thermal conductivity, low dielectric properties, and electrical insulation, making it suitable for thermal interface applications in communication equipment. The material helps transfer heat from heat-generating components to heat dissipation structures. 3. Millimeter-Wave Radar: Balancing Thermal Management and High-Frequency Signal Performance Millimeter-wave radar systems contain high-frequency electronic components that require thermal interface materials with both high thermal conductivity and suitable dielectric properties.TIF®100N 8085-06 features a dielectric constant of 4.0 @1MHz. Its low-dielectric design helps reduce energy loss during high-frequency signal transmission, while its 8.0 W/m·K thermal conductivity supports efficient heat transfer from electronic components. 4. RF Power Amplifiers: Combining Thermal Conductivity and Electrical Insulation RF power amplifiers generate significant heat during operation and require thermal interface materials with excellent thermal and electrical insulation performance.TIF®100N 8085-06 has a volume resistivity of >1.0×10¹² Ohm·cm and a dielectric breakdown strength of ≥3000 V/mm, helping provide efficient heat transfer while meeting electrical insulation requirements. 5. Semiconductor Microwave Components: Adaptable to Different Structural Designs Semiconductor microwave components typically feature highly integrated structures and require thermal materials with balanced thermal, electrical, and high-frequency performance. TIF®100N 8085-06 features a ceramic-filled silicone rubber construction and is available in standard thicknesses from 0.30 to 3.00 mm. The material can also be die-cut into different shapes to meet specific product and assembly requirements. 6. Product Features: Combining High Thermal Conductivity with Low Dielectric Properties To meet the comprehensive requirements of high-frequency and high-performance electronic devices, ZIITEK TIF®100N 8085-06 offers: 8.0 W/m·K high thermal conductivity Low dielectric properties, dielectric constant of 4.0 @1MHz Excellent electrical insulation UL94 V-0 flame retardancy Recommended operating temperature range of -40°C to 200°C Standard thicknesses from 0.30 to 3.00 mm Die-cutting and custom shape processing available Excellent weather resistance, aging resistance, and long-term reliability 7. ZIITEK: Focused on High-Performance Thermal Management Materials From AI computing servers, 5G base stations, millimeter-wave radar, and RF power amplifiers to semiconductor microwave components, different electronic products have different requirements for thermal interface materials.ZIITEK focuses on the research, development, and application of Thermal Interface Materials (TIMs), providing application-oriented thermal management solutions through different thermal conductivity levels, thicknesses, and material technologies.With 8.0 W/m·K thermal conductivity, low dielectric properties, electrical insulation, and reliable performance, TIF®100N 8085-06 provides comprehensive thermal management support for AI computing, high-frequency communications, and high-performance electronic devices.

Ziitek TIF®️900-15S: heat conduction and wave absorption in one, effectively solving EMI and heat dissipation problems   With the continuous improvement of the integration and power density of 5G communication, automotive electronics, and industrial equipment, electromagnetic interference (EMI) and heat dissipation issues have become the key bottlenecks restricting the reliability of products. Ziitek has launched the TIF®️900-15S series of flexible thermal conductive and absorbing materials, which integrate the thermal conduction path and absorbing function into a single material, providing engineers with an ideal solution that combines performance and space efficiency. 1. Product Positioning and Core Value   Dual Function Integration: TIF®️900-15S has a thermal conductivity of 1.5 W/m·K and wide-band electromagnetic wave absorption capability, effectively replacing the combination of "thermal pads + absorbing foam", simplifying assembly processes and saving internal space.   Broad Applicable Frequency Range: Maintains stable absorbing performance in the frequency range of 100MHz to 10GHz, especially suitable for suppressing cavity resonance, eliminating surface standing waves, and reducing metal reflection interference.   High Flexibility and Adaptability: The material hardness is approximately 45(Shore 00), with excellent compressibility and deformation ability. It can closely adhere to uneven surfaces and act as a buffer during cover plate compression, avoiding damage to surrounding sensitive components.   2. Key Performance Parameters (Typical Values)   Thermal Conductivity: 1.5 W/m·K Hardness: 45(Shore 00 Density: 3.9 g/cm³ Operating Temperature Range: -40°C to 200°C Flame Retardant Grade: UL 94 V-0 Standard Thickness: 0.25mm to 5.00mm (increment of 0.25mm) Standard Size: 305mm × 305mm   3. Main Application Scenarios   Data Communication and Telecommunication Equipment: Base station antennas, optical modules, RF front-end units Automotive Electronics: Millimeter-wave radars, vehicle cameras, ECU control units Consumer Electronics and Industrial Control: Drones, industrial motherboard, power conversion modules Cavity Structure Equipment: Suitable for applications with cover plate gaps or internal cavity space, can fully fill to reduce electromagnetic leakage   4. Customization Options and Processability Ziitek offers various additional treatments to meet different installation and process requirements:   Reinforcement Carrier: Optional glass fiber (FG) reinforcement to enhance tear resistance and installation strength.   Surface Treatment: Non-adhesive coating (NS1) or single-sided hardening coating (DC1), facilitating automated handling.   Pressure Sensitive Adhesive Treatment: Supports single-sided (A1) or double-sided (A2) pressure-sensitive adhesives, facilitating pre-fixation assembly.   Non-standard Customization: Can provide other thicknesses, sizes, and custom-shaped punches to match customer-specific structures.   5. Quality Assurance and Technical Support Ziitek has a complete material testing system, and all products are verified for performance in accordance with ASTM and ISO standards. The company provides global on-site service support and can provide selection suggestions and simulation data references for specific customer application scenarios. TIF®️900-15S is a function-integrated material developed by Ziitek for the trend of high frequency and high power. It not only reduces the difficulty of balancing electromagnetic compatibility and thermal design, but also helps customers accelerate the product development cycle through its flexible customizability. If you need samples, technical specifications or customized solutions, please contact the Ziitek sales team or visit the official website.

Effective cooling, limitless computing power | Ziitek sincerely invites you to attend the three major industry events in Shenzhen   Dear Partner: Hello!   VIETNAM ZIITEK TECHNOLOGY COMPANY LIMITD sincerely invites you to attend the three industry trade fairs to be held from June 10th to 12th, 2026 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). Our booth location: Hall 14, Booth 14H87 (Halls 14 and 16).   ▪ Shenzhen International AI Computing Power Industry Exhibition ▪ The 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition ▪ The 16th Shenzhen International Heat Conductive and Heat Dissipation Materials and Equipment Exhibition (CIME 2026)     During the three exhibitions, the total exhibition area exceeded 40,000 square meters, gathering over 500 leading enterprises in the industry. It is expected to attract 30,000+ professional visitors. Simultaneously, 30 high-end technical forums will be held. As a highly influential event in the thermal management industry in South China, it comprehensively covers three major tracks: AI computing power, liquid cooling heat dissipation, and thermal conductive materials.   Choose Ziitek and unlock professional thermal management solutions   With a 20-year history in the field of electronic heat dissipation materials, Ziitek adheres to the development mission of "finding the best solution for every degree of heat". The core technical team comes from the Chinese Academy of Sciences and leading semiconductor enterprises, holding over 40 invention patents. Their products have all passed international authoritative certifications such as UL, RoHS, and REACH. We focus on high-performance thermal interface materials, customized liquid cooling solutions, and AI chip-level thermal management services. We have served over 200 data centers, computing clusters, and consumer electronics enterprises, helping customers improve equipment efficiency by 15% to 30%, and laying a solid foundation for the stable operation of high-load equipment.   Three major new products make their debut at the event   ✅ High thermal conductivity thermal pad—— Thermal conductivity reaches 16W/mK, suitable for AI servers and high-power chips, providing efficient and long-lasting heat dissipation。   ✅ Carbon fiber thermal pad ——Thermal conductivity exceeds 25W/mK, featuring lightweight and high strength, suitable for demanding scenarios such as new energy vehicles and aerospace   ✅ High thermal conductive gel | Thermal conductivity is 15W/mK, with excellent fluidity, capable of adapting to irregular gaps, suitable for 5G base stations and high-density consumer electronics Throughout the exhibition, a professional technical team is on-site to provide services, offering one-on-one free customized thermal management solutions to address various industry challenges such as computing power heat dissipation and liquid cooling selection.     Exhibition Details     ♦ Exhibition Date: June 10th - 12th, 2026 ♦ Exhibition Venue: Shenzhen International Convention and Exhibition Center (Bao'an New Hall), Hall 14 & 16 ♦ Booth Number: 14H87 Scan the code immediately to make an appointment. You will enjoy priority reception and an exclusive exquisite gift! We are looking forward to meeting you in person and exploring new opportunities in the field of cooling and computing power together!   VIETNAM ZIITEK TECHNOLOGY COMPANY LIMITD   Sincerely invites    

Ziitek Technology Will Showcase COMPUTEX 2026 Taipei International Computer Exhibition. Ziitek Technology, a global leader in thermal management solutions with over 20 years of industry experience, will make a grand appearance at COMPUTEX International Computer Exhibition (booth: A0217) in Taipei, showcasing its high-quality solutions for the thermal management industry of data centers, and cooperate with global industry partners to explore opportunities for innovation and development of artificial intelligence electronics industry.     Since its establishment in 2006, ZIITEK Technology has been dedicated to the research and large-scale production of thermal interface materials. With long-term technological accumulation and continuous product iterations, the company's self-developed thermal management solutions have been widely applied in the fields of communication, new energy vehicles, aerospace and military, power, medical care, and consumer electronics. Thanks to their stable and reliable product performance, the company has received high recognition from global customers. At this exhibition, the enterprise will fully showcase its entire series of core thermal interface materials, fully demonstrating its core technical advantages in efficient heat conduction, material integration, and customized heat dissipation design.   In response to the stringent heat dissipation requirements of high-power and high-density electronic devices, ZIITEK Technology has independently developed carbon fiber thermal conductive materials, which are suitable for 5G equipment, high-end chips, AI servers, and power control units and other core devices. This product further improves the company's integrated technical system from basic materials, heat dissipation components to the overall heat dissipation system. It can efficiently solve the heat dissipation problems of high-end equipment and provide solid technical support for the green and efficient operation of data centers.

Embarking on a New Journey Toward a Brighter Future | Groundbreaking Ceremony Successfully Held for Phase II of KUNSHAN ZIITEK’s Manufacturing Project Good morning, distinguished leaders, guests, and friends,   Today, during this vibrant season of growth and renewal, we are delighted to gather here for the groundbreaking ceremony of Phase II of KUNSHAN ZIITEK’s manufacturing project. On behalf of Ziitek, I would like to extend our warmest welcome and sincere appreciation to all the leaders, partners, and friends joining us today.   We would especially like to thank the government authorities and officials of Lujia Town for their continuous support and guidance throughout this project. My heartfelt thanks also go to all Ziitek team members who have contributed to the preparation of this important event.   The launch of this project marks a significant milestone in Ziitek’s development journey. With a total investment of RMB 100 million and covering approximately 20 acres, the expanded facility will provide around 18,000 square meters of manufacturing space.   Upon completion, the new base will integrate R&D, manufacturing, and sales operations, further strengthening our capabilities in intelligent manufacturing and lean production. This project represents an important step forward in supporting Ziitek’s long-term growth and innovation strategy.     Today’s groundbreaking is not only the start of a construction project, but also a reflection of our commitment to sustainable development, operational excellence, and social responsibility.   Throughout the construction process, we will prioritize workplace safety, quality standards, and environmental protection. At the same time, the project will create more employment opportunities and contribute positively to local economic development.   To our construction partners, we look forward to working together with the highest standards of safety and quality to build a reliable and outstanding facility.   To all members of the Ziitek management team, close collaboration and dedication will be essential as we move forward. With determination, professionalism, and teamwork, we are confident that this project will be completed successfully and become a strong foundation for Ziitek’s future growth.   For more than 20 years, Ziitek has remained committed to innovation and excellence in thermal management materials. Today marks another important step toward our future, and we look forward to creating even greater value together with our customers, partners, and employees around the world.   Finally, thank you once again for your presence and support. We wish everyone good health, happiness, and continued success. Thank you.    

Ziitek Technology will showcase 20 years of Thermal Innovation at 2026 Global data center Innovative development and application of liquid cooling Technical exhibition   Ziitek Technology, a global leader in thermal management solutions with over 20 years of industry experience, will make a grand appearance at the 5th Global Data Center Liquid Cooling Innovation Development and Application Technology Conference in 2026, showcasing its cutting-edge technologies and innovative achievements in the thermal management field to demonstrate its leading position in the industry. During the conference, Ziitek Technology will bring its core products and solutions to the B100 booth at the Shanghai Exhibition Center from May 18th to 20th, presenting a full range of innovative achievements from advanced thermal interface materials (TIM) to high-performance liquid cooling systems, providing new ideas and practical references for the global data center thermal management field. Since its establishment in 2006, Ziitek Technology has been deeply engaged in the research and development and manufacturing of thermal interface materials. With continuous technological iteration and innovation, its thermal management solutions have been widely applied in multiple core fields such as consumer electronics, telecommunications, industrial automation, electric vehicles, and high-density servers, earning high recognition and trust from global customers. At this conference, Ziitek will comprehensively display its full range of core thermal interface materials, fully demonstrating its profound accumulation and outstanding professional capabilities in thermal conductivity efficiency, material integration technology, and customized cooling design. In response to the growing heat dissipation demands of high-power and high-density equipment worldwide, Ziitek Technology has launched a modular liquid cooling system specifically designed for next-generation data centers, advanced servers, and power control units. The release of this series of products further highlights Ziitek's end-to-end full-stack thermal management solution capabilities, from materials to systems, from components to complete cooling modules, effectively addressing the world's most stringent heat dissipation challenges and providing strong support for the green, low-carbon, and efficient operation of data centers. To deepen interaction and communication with on-site visitors, a professional service team composed of experienced R&D engineers and technical advisors will provide one-on-one real-time technical consultation services, helping industry professionals accurately solve specific thermal design problems, obtain customized component selection and system architecture guidance, and achieve precise matching of technical needs and solutions. In addition to professional technical displays and consultations, Ziitek has also carefully designed the "Join the Cooling Warriors, Defeat the Heat Boss" theme interactive experience activity, which combines fun and knowledge. In the activity, professional wrestlers will join hands with participants to become "thermal energy warriors", symbolically fighting against the "heat boss" representing excessive heat, vividly highlighting the core role of advanced thermal energy technology in modern systems, allowing visitors to deeply understand the importance of thermal management technology in an entertaining and interactive way. A spokesperson for Ziitek said, "The 5th Global Data Center Liquid Cooling Innovation Development and Application Technology Conference is of milestone significance for Ziitek. It is not only an important platform for us to showcase our development achievements but also marks our successful transformation from a TIM technology innovator to a global supplier of comprehensive thermal management solutions. In the future, we will continue to focus on technological innovation, providing more competitive products and services to help global customers address various heat dissipation challenges."   Exhibition Details Event: Global data center Innovative development and application of liquid cooling Technical exhibition 2026 Date: May 18-20, 2025 Booth: No.2345 Longyang Road, Pudong New Area, Shanghai, China Website: www.ziitek.com.vn

25W/mK high-performance heat conduction! Ziitek TS-TIR700-25, unlocking a new solution for cooling high-heat flux devices   Today, with 5G, high-performance chips, optoelectronics and wearable devices continuously evolving towards higher integration, greater power, and miniaturization, the accumulation of internal heat in devices has become the core bottleneck restricting performance, lifespan and stability. Traditional thermal conductive materials either have insufficient heat conduction or have high interface thermal resistance, making it difficult to meet the requirements of demanding scenarios. The TS-TIR®700-25 series carbon fiber thermal pads launched by Ziitek Technology, with a stable thermal conductivity of 25W/mK, provide an efficient thermal management solution for high heat flux applications. This gasket is made of a high thermal conductivity carbon fiber and high molecular silicone composite system. Through precise manufacturing techniques, it constructs a directional heat-conducting pathway, significantly reducing the interface thermal resistance and enabling rapid and uniform heat conduction. This effectively prevents local overheating at the source and significantly improves the heat dissipation efficiency and equipment reliability.   25W/mK high thermal conductivity, with maximum heat dissipation efficiency； According to the ASTM D5470 standard test results, the thermal conductivity is stable at 25W/mK, far superior to conventional silicone gasket pads. It quickly discharges the heat from core heat sources such as chips and power devices, ensuring that the equipment operates at full capacity without overheating.   Low thermal resistance + low voltage compatibility, providing a more precise fit； With extremely low interface thermal resistance, it can well fill microscopic gaps under low voltage, adapting to precision components and compact structures, without damaging the elements or increasing assembly stress. It is stable and reliable for long-term use.   Ultra-thin and flexible, suitable for various thickness scenarios； The thickness ranges from 0.3 to 5.0mm. The standard thickness includes 0.3/0.5/1.0/1.5/2.0/2.5/3.0mm. It is lightweight, flexible, and can be die-cut for customization. It can easily adapt to narrow spaces and complex structures.   Wide temperature range and durability, safety and compliance； Operating temperature: -40℃~200℃, flame retardant grade reaches UL94 V-0, complies with RoHS requirements. It maintains stable performance and ensures safety in both high and low temperature, as well as long-term operation environments.   Non-viscous and easy to assemble, non-insulated design； The surface is non-sticky, making assembly and maintenance more convenient; non-insulated feature, suitable for professional thermal management scenarios with specific requirements for conductivity and heat conduction.   The application scenarios cover a wide range of high heat flux fields； 5G communication equipment: base stations, radio frequency units, small base stations, etc. - high-power components, stable heat dissipation ensures continuous signal transmission without interruption.   High-performance chips: CPU, GPU, AI acceleration cores and server cores, powerful temperature control, releasing computing power without frequency reduction. Optoelectronic industry: Optical modules, laser devices, high-definition display drivers, suppressing temperature rise, extending the lifespan of optoelectronic components. Wearable devices: Smart watches, VR/AR, health monitoring terminals, lightweight without a burdening feeling, long-lasting calmness and greater comfort. General high-heat scenarios: Between chips and heat dissipation modules, power devices, industrial control and other high-density heat dissipation demand scenarios.   For electronic devices, heat dissipation is key to competitiveness. The Ziitek TS-TIR®700-25, with its 25W/mK high thermal conductivity, low thermal resistance, lightweight, flexible and robustness across a wide temperature range, has become the preferred thermal interface material in 5G, high-performance chips, optoelectronics, wearable devices and other fields, helping products maintain stable output under harsh conditions.   Whether it's the development of new products or the upgrade of existing solutions, this carbon fiber heat transfer gasket can help you bridge the "last mile" of heat dissipation with high cost-effectiveness and high compatibility, making the equipment cooler, more durable and more powerful.

Liquid cooling immersion cooling new benchmark  Ziitek Technology's TIF100C series immersion thermal pad, meeting the long-term requirements for AI & GPU liquid cooling barriers   With AI computing power, new energy vehicles, and high-performance servers all entering the era of liquid cooling / immersion cooling for heat dissipation, traditional thermal interface materials often encounter problems such as insufficient heat conduction, poor adhesion, weak insulation, and cumbersome installation. Mako Electronics has newly launched the TIF®100C series of immersion-specific thermal silicone pads, featuring 8.0W/m·K high thermal conductivity, ultra-high compression flexibility, self-adhesive without glue, V-0 flame retardancy, etc. These hard-core performance characteristics make it an efficient thermal insulation solution for high-power devices and liquid cooling / metal bases. Ⅰ.make sure you understand: liquid cooling with cold plates vs immersion cooling are completely different concepts.   1. Cold plate liquid cooling (indirect cooling - progressive mainstream) ✅Principle: The cold plate is closely attached to the GPU/CPU, and the coolant circulates in a closed channel, only cooling the core chips. ✅Features: Minimal changes, strong compatibility, easy deployment. Preferred for existing data centers. ✅Limitations: Memory and power supplies still rely on air cooling, which may result in local hotspots. The upper limit for high-density scenarios is limited. 2. Immersion Liquid Cooling (Direct Cooling - High Density) ✅Principle: The entire machine is immersed in an insulating coolant, achieving full-area, non-overlapping heat exchange. The heat dissipation ✅efficiency is 20-30 times higher than that of air cooling. ✅Features: No fan, low noise, stable temperature control, PUE can be as low as 1.05. Suitable for high-density cluster cabinets with power exceeding 100kW. ✅Key Challenges: The compatibility of the coolant directly determines the lifespan, stability and heat dissipation efficiency of the thermal pad. II. The critical point of immersion liquid cooling: The heat-conducting pad cannot withstand the liquid, and all efforts will be in vain.、 In the immersion environment, the heat-conducting pad is constantly immersed in media such as PAO and fluorinated liquids. Ordinary materials will experience phenomena such as swelling, cracking, powder shedding, a sharp decline in heat conductivity, interface failure, GPU overheating and frequency reduction, soaring operation costs, and skyrocketing failure rates. This is why immersion liquid cooling requires the use of dedicated compatible heat-conducting materials.   III. Ziitek TIF100C Immersion Heat Conductive Sheet, Immersion Liquid Cooling Solution: Stable, Powerful, Long-lasting   Core breakthrough: Highly compatible with the entire series of thermal pads, deeply adapted to PAO4, various immersion oils, fluorinated liquids and other mainstream immersion media. Long-term immersion does not cause swelling or attenuation, and the performance is stable. It has been verified in multiple customer immersion scenarios and is compatible with TIF100C and other series of thermal sheet products. ✅Product features: Excellent thermal conductivity. Self-adhesive, no need for additional surface adhesives. High compressibility, soft and elastic, providing multiple thickness options. Good chemical stability. IV. Key Application Scenarios | Full Coverage High-Power Immersion/Liquid Cooling Field   ✅ AI servers / HPC high-performance computing Between GPU/CPU/accelerator cards and liquid cooling plates, low thermal resistance, high insulation, high reliability, supporting full computing power continuous output ✅ New energy vehicles (vehicle-grade) Motor controllers, OBC, DC-DC, battery pack thermal management, insulation flame retardancy, buffering vibration resistance, corrosion resistance to coolant ✅ Network communication / 5G / optical modules High-power power amplifiers, switching chips, base station equipment, immersion / liquid cooling cooling, stable low latency, long lifespan ✅ Industrial control / power supply / energy storage High-power power supply modules, inverters, energy storage converters, high-voltage insulation, fire safety, long-term stability ✅ Immersion-type liquid cooling chassis Data centers, supercomputers, special cooling equipment, perfectly adapting to immersion work without polluting the coolant   In the era of liquid cooling immersion, heat dissipation not only needs to be "fast", but also must be stable, safe, and easy to assemble. The Ziitek TIF®100C series, with its five core advantages of 8.0W high thermal conductivity, ultra-high compression, self-adhesive without glue, V-0 flame retardant, and high insulation, has become the preferred choice for immersion cooling in high-power scenarios such as AI, new energy, servers, and industrial equipment.