China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM Company News

ZIITEK technology: an innovation leader in the field of heat dissipation materials in the AI era   In today's era of rapid development of science and technology, the efficiency and heat dissipation of electronic equipment has become the key bottleneck of industrial development. With the popularization of artificial intelligence (AI), high-performance computing (HPC) and 5G communication technology, the calorific value of the chip has rapidly increased, and the traditional heat dissipation scheme can no longer meet the demand. In this heat dissipation technology competition, " Ziitek Technology, Ltd" is gradually emerging in the global market and becoming an invisible helper in the heat dissipation field of various industries with its innovative research and development technology of heat conduction materials. From local enterprises to international supply chain Founded in 2007, " Ziitek Technology" initially focused on the research and development and production of traditional electronic heat dissipation materials, and has been deeply involved in the electronic industry for 18 years. Over the years, " Ziitek Technology" has served major heat dissipation module factories and electronic factories in Taiwan Province with its own development experience and patented technology accumulation. Small heat conduction materials have become an indispensable functional part in the heat dissipation scheme of the electronic industry. With the explosive growth of AI and data center market, Ziitek has locked in the development of high-grade Thermal Interface Materials,TIMs). Nowadays, it has not only gained a foothold in the domestic market, but also successfully entered the European, American and Asian markets, becoming a key supplier of international technology giants.   Technical Breakthrough: From Material Formulation to Application Innovation "Where there are devices that use electricity, there is a demand for heat conduction." The application fields of heat conduction materials can be seen in the thermal management system, from the home appliances 3C closest to our lives to the fields of new energy, medical care and even aerospace. The core competitiveness of Ziitek thermal conductive materials lies in its "deep research and development ability of material science". Different from the traditional thermal conductive silica gel pad, the ultra-soft thermal conductive silica gel pad developed by Ziitek has a thermal conductivity of 8.5W/mK, a hardness of only 10°ShoreOO, and a stable compression deformation of 40% at a pressure of 5psi. Recently, Ziitek has developed a thermal conductive silica gel pad with thermal conductivity of 10W/mK and hardness of 20°ShoreOO. Therefore, Ziitek 's thermal conductive silica gel pad is generally loved by display card customers. In recent years, the demand for heat dissipation of Ai servers has expanded, which has also promoted the application of Ziitek 's ultra-soft materials in high-end computing power.   Under the trend of automatic production, Ziitek has also introduced "dispensing thermal conductive gel (TIF two-component series)", which can be accurately coated by machines to replace the traditional manual bonding of thermal conductive gaskets, greatly improving production efficiency. The company also cooperated with semiconductor manufacturers to develop special heat dissipation solutions for CoWoS package and HBM memory to solve the thermal management challenges brought by advanced packaging technology.   In the automotive market, Ziitek 's thermal insulation materials (TIS series) are applied to the inverter and battery management system of electric vehicles to ensure the reliable operation of high-voltage components in harsh environments. In addition, with the popularization of 5G Small Cell, Ziitek 's lightweight thermal conductive plastics (TCP series) have also become the first choice for equipment manufacturers, which can reduce the weight by 30% compared with the traditional aluminum heat dissipation mechanism, while maintaining excellent heat dissipation efficiency. Future challenges and opportunities Although Ziitek is outstanding in technology and market, the industrial competition is becoming increasingly fierce. Ziitek actively recruits talents for polymer materials research and development, cooperates closely with academic institutions, and holds a positive attitude in both technology and talents to cope with this wave of technological changes and keep pace with the times.   The next revolution of heat dissipation materials From traditional electronic heat dissipation to AI high-efficiency computing, the development of Ziitek Electronics witnessed the evolution of heat dissipation technology. With the gradual slowdown of Moore's Law, heat dissipation determines efficiency, which has become a new concept in the semiconductor industry. Ziitek continues to break through the limits of heat-conducting materials with material innovation, and contributes to serving the global high-efficiency computing and people's faster and more environmentally friendly life.

The application of TIF thermal pad in GPU: Innovation and challenge of heat dissipation technology   With its excellent thermal conductivity, TIF thermal pad has become an innovator in the field of GPU heat dissipation. It can closely fit the tiny gap between the GPU chip and the heat sink, effectively eliminate the thermal barrier of air, and build a smooth heat conduction path. With a thermal conductivity of 1.25 to 25W/(m·K), depending on the material formulation and manufacturing process, TIF thermal pad can quickly conduct the heat generated by the GPU to the radiator, significantly reducing the operating temperature of the GPU. There are often problems with uneven surfaces or small gaps between the GPU chip and the heat sink, which affects the efficiency of heat conduction. The TIF thermal conductive silicone sheet is soft and elastic, which can give full play to its stress buffer function and effectively avoid the risk of hardware damage caused by local stress concentration. At the same time, it can be tightly fitted on the surface of the GPU to form a seamless heat transfer layer, reducing thermal resistance and improving heat transfer efficiency.     The TIF thermal conductive silicone sheet also has good electrical insulation performance, which can build a solid electrical barrier between the GPU chip and the heat sink to ensure the stable operation and safe use of the device. Assembly flexibility and adaptability TIF thermal pad are easy to process and cut, and can adapt to the needs of different shapes and thicknesses. It is especially suitable for the internal design of equipment with complex structure or limited space, and provides more possibilities for the optimization of GPU cooling schemes. Whether it is a desktop, laptop or server application scenario, TIF therma pad can be easily handled to ensure the unimpeded heat transfer. Despite the softness and compressibility of TIF thermal pad, it is still a challenge to ensure a tight fit between them and the GPU surface in practical applications. Small gaps or bubbles can affect the efficiency of heat transfer, so professional tools and methods need to be used during the installation process to ensure a suitable fit. Different GPU models and heat dissipation requirements have different performance requirements on thermal conductive silicone sheets. Therefore, when choosing a TIF thermal conductive silicone chip, it is necessary to measure its size and thickness according to the specific performance and heat dissipation requirements of the GPU to ensure a tight fit and heat transfer between the GPU surface and the heat sink. TIF thermal conductive silicone sheet may be affected by aging, pollution and other factors during use and reduce performance. Therefore, it needs to be maintained and replaced regularly to ensure its long-term stable operation. At the same time, the material quality and manufacturing process of thermal conductive silica gel sheet also directly affect its service life and reliability, and it is necessary to choose reputable suppliers and products. In short, the application of TIF thermal conductive silicone sheet in GPU heat dissipation not only solves the heat dissipation problem caused by high-performance computing, but also provides solid technical support for users and professional applications in pursuit of performance experience. With the continuous progress of GPU technology and the increasing demand for heat dissipation, TIF thermal pad will continue to play an innovative role in heat dissipation technology. At the same time, facing the challenges in practical applications, it is necessary to continuously optimize the performance of thermal conductive silicone sheets, select the right products, and strengthen maintenance and replacement work to ensure the stable operation and extend the service life of the GPU.

Welcome to visit ZIITEK booth at 2025 MWC Shanghai！！   ZIITEK Booth: N2. A83 Date: 18th to 20th June 2025 Add.: SNIEC Shanghai  

Thermal conductive silicone sheet: Empowering the automotive chassis control system and solving the heat dissipation dilemma   Driven by the waves of automotive electrification and intelligence, the chassis control system, as the core hub of the vehicle, is facing performance challenges. The integration degree of core components such as high-precision sensors, domain controllers, and electric actuators is constantly increasing, while complex working conditions such as high temperature, vibration, and humidity have become invisible shackles restricting the stability of the system. Thermal conductive silicone sheets, with their outstanding thermal management capabilities and reliability, have become a key solution to break through the heat dissipation bottleneck, safeguarding the safety and efficiency of the chassis control system. Thermal conductive silicone sheet: Reshaping the boundaries of thermal management with technology   1.Effective heat conduction, breaking through the heat flow bottleneck: By using high thermal conductivity silicone base material and combining with nano-scale filler technology, a low thermal resistance connection between the heating element and the heat sink is achieved. Experimental data show that under the same working conditions, the use of thermal conductive silicone sheets can reduce the junction temperature of the chip by 15-20℃, significantly delaying the risk of thermal failure.   2. Flexible adaptation to cope with complex working conditions: Anti-vibration design: The hardness of 30-80 Shore A is adjustable. It absorbs mechanical vibration energy and avoids contact surface cracking caused by thermal stress. Weather resistance breakthrough: Wide temperature range operation from -40℃ to 200℃, resistant to salt spray and oil erosion, ensuring long-term reliability. Insulation protection: Volume resistivity ≥1.0 × 10¹² Ω·cm, effectively isolating high-voltage components and enhancing the electromagnetic compatibility of the system. Product features of thermal conductive silicone sheets 1. Good thermal conductivity: 1.2W - 25W/mK 2. Fire resistance rating: UL94-V0 3. Multiple thickness options are available: 0.25mm-12.0mm 4. Hardness: 5 to 85shoreoo 5. High compressibility, soft and elastic, suitable for low-pressure application environments 6. Self-adhesive without the need for additional surface adhesives   Application Scenarios: Full-chain empowerment from traditional to intelligent   1. Electric power steering System (EPS) : Reduces temperature fluctuations in the motor drive module and enhances steering response accuracy. 2. Electronic Stability Program (ESP) : Ensures the stable operation of the hydraulic control unit under adverse working conditions and shortens the braking response time. 3. By-wire chassis: It provides a continuous low-temperature environment for redundant computing units to ensure the achievement of functional safety levels. 4. Air suspension control system: Optimize the heat dissipation of the solenoid valve group to extend the frequency and lifespan of suspension adjustment. From traditional fuel vehicles to smart electric vehicles, the heat dissipation requirements of chassis control systems have always evolved in tandem with technological innovations. Thermal conductive silicone sheets have been elevated from supporting roles to key technical carriers. Choosing a professional-level heat conduction solution is choosing the reliability and sustainability of future travel. When every bit of heat can be accurately dissipated, the "footwork" of the car can be more stable, providing users with a safe, effective and long-lasting driving experience.

Ziitek sincerely invite you to the 2025 Taipei International Computer Exhibition (COMPUTEX 2025)     Exhibition information   Time: 2025.5.20-23   Booth number: R073a   Address: Taipei Nangang Exhibition Center , Taiwan  

Ziitek sincerely invite you to the 17th China International Battery Fair CIBF2025     Exhibition information   Time : 2025.5.15-17   Booth number : 4B151   Address : Shenzhen Futian International Convention and Exhibition Center    

How to Choose Reliable Thermal Pad Factory   Choosing a reliable thermal pad factory is essential for ensuring the quality, performance, and longevity of your thermal management solutions. Thermal pads play a critical role in dissipating heat in industries like electronics, discmotive, and telecommunications, so selecting the right factory requires careful consideration. Step 1: Understand the parameters. Many people only look at the price when choosing thermal pads, but ignore the core parameters. Thermal conductivity is the key to heat dissipation. The higher the value, the faster the heat conduction. Generally, 2-5W/mK is enough for notebook computers, while 8W/mK-25W-mK or more is recommended for high-heat equipment such as servers. Thickness is also very particular, too thin is easy to break, too thick will increase thermal resistance. For example, 0.5mm is suitable for precision chips, and 1mm is more suitable for filling between radiator and motherboard. In addition, softness affects the fit, too soft and easy to deform, too hard and not tight, so it is more reliable to choose one that can easily compress about 30%.   Step 2: Visit the factory. A reliable factory should have a strong quality control system. Possesses the ISO9001, ISO14001, IATF16949 quality management system certifications, with all products going through UL94 V-0 (fire resistance), SGS, RoHS certification , indicating adherence to international standards, Those who dare to provide third-party test data are trustworthy. Looking at the equipment, the automatic production line can ensure uniform thickness and accurate cutting; Then ask R&D, manufacturers with laboratories and patented technology can customize products according to demand; Finally check the quality inspection.   Step 3: Check word of mouth and see "true strength" Reliability goes beyond products. Choose factories with the following conditions, responding to services, and they should solve technical problems quickly. Clear communication, customer case is the touchstone! Ask peers which brands they have used. Real cases are far more convincing than advertisements. At the same time, pay attention to after-sales service, and manufacturers who can respond 24 hours a day and return goods for free will be more worry-free to cooperate.   Step 4. Look for Added Features Depending on your needs, consider: Electrical Insulation: High dielectric strength prevents shorts in sensitive applications. Durability: Pads should withstand harsh conditions like moisture or chemicals. Ease of Use: Adhesive backing or pre-cut sizes simplify assembly.   In order to choose a reliable hot pad factory, their quality assurance, material selection, manufacturing capacity and performance specifications are evaluated while considering cost, support and sustainability. For example, Vietnam ZIITEK Technology Co., Ltd. has ISO9001, ISO14001 and IATF16949 quality management system certifications, and all products have passed UL, SGS and RoHS certifications, which are in line with international standards.   A carefully selected factory will provide thermal pads to enhance heat transfer and ensure equipment reliability according to your specific requirements. If you want to know more about ZIITEK high-performance thermal interface materials, please visit our website in www.ziitek.com.vn  

One component thermal gel: The key to an effective heat dissipation system     One component thermal gel: The key to an effective heat dissipation system   One component thermal gel is a kind of heat dissipation material that does not need mixing and is easy to construct. It can form a uniform thermal conductivity layer between the contact surfaces, effectively filling small gaps, thereby improving the efficiency of heat transfer. Compared with traditional heat dissipation materials, such as heat dissipation silicone grease or heat dissipation gaskets, single-component thermal gel has higher thermal conductivity and better stability, and can maintain stable thermal conductivity over a wider temperature range.     The single component thermal gel is widely used in the heat dissipation design of electronic equipment. Whether it is the core processor such as CPU and GPU, or the key components such as memory and chipset, the single-component thermal gel can provide good heat dissipation support. It can be tightly fitted to the surface of the radiator and heat source, the heat is quickly transferred to the radiator, and the heat is discharged out of the equipment through the cooling device such as the fan or liquid cooling system, so as to ensure that the equipment can maintain a low temperature under high load operation.     In addition, the single component thermal gel also has excellent electrical insulation properties and weather resistance. It can maintain stable thermal conductivity and insulation performance in humid, high temperature, low temperature and other harsh environments, providing a strong guarantee for the long-term stable operation of electronic equipment. At the same time, the construction of single-component thermal gel is simple, without professional skills and equipment, which greatly reduces the installation cost and maintenance cost of the heat dissipation system.  

How to use thermal conductive pad to improve heat dissipation efficiency   In the era of pursuing high performance electronic equipment, heat dissipation has become a key factor restricting the performance of equipment. As an innovative heat dissipation solution, thermal conductive silica gel sheet is gradually becoming a star product to improve the overall heat dissipation efficiency with good thermal conductivity, flexibility and adaptability. Thermal conductive silica gel sheet is a kind of thermal conductive medium material synthesized by special process based on silica gel and adding metal oxide and other auxiliary materials. It can fill the gap between the heat source and the radiator, effectively open up the heat channel, improve the efficiency of heat transfer. The thermal conductive silica gel sheet not only has good thermal conductivity, but also has excellent electrical insulation characteristics, which provides additional safety guarantee for the equipment. In electronic equipment, thermal conductivity silicone sheet is widely used in LED, switching power supply, medical equipment, industrial computer and automotive electronics and other fields. It can effectively reduce the thermal resistance between the heat source and the radiator, and realize the rapid transfer and dispersion of heat. This feature enables the equipment to remain calm during high load operation, avoiding performance degradation or failure caused by overheating, thus ensuring long-term stability and effective operation of the equipment.   The method of use of thermal conductive silica pad is also very important. Before installation, please ensure that the contact surface between the electronic component and the gasket is free of dirt. Any stains will affect the self-adhesive and thermal conductivity of the gasket. In the installation process, it is necessary to tear off the protective film and place it slowly after accurate alignment to avoid air bubbles. If bubbles occur, lift one end of the gasket and repeat or gently wipe away the bubbles with a hard plastic sheet. Then, apply appropriate pressure and stand for a period of time to ensure that the gasket is firmly fixed, so as to play a heat dissipation effect. Thermal conductivity silicone sheet also has good flexibility and compressibility, can easily adapt to a variety of complex shapes and uneven surfaces, to achieve intimate fit. This seamless connection not only improves the efficiency of heat conduction, but also reduces the energy loss during heat transfer, ensuring that every piece of heat can be effectively used and converted into continuous power for the equipment.   In general, thermal conductivity silicone pad has become an important choice to improve the heat dissipation efficiency of electronic equipment and ensure the stable operation of equipment by virtue of its good thermal conductivity, excellent electrical insulation characteristics, good adaptability and environmental protection characteristics. Through the correct installation and use of thermal conductive silica gel sheets, we can significantly improve the heat dissipation efficiency of equipment, extend the service life of equipment, and contribute to scientific and technological progress and social development.  

Instructions of applying thermal phase change materials For heat sinks   In the field of modern electronic equipment in pursuit of effective heat dissipation, thermal phase change materials have become a key bridge connecting heat sinks and heat sources with superior thermal conductivity. How to operate the thermal phase change material on the heat sink? The following is a detailed how-to guide to accurately and efficiently apply thermal phase change materials to your heat sink.   Preparation   1, cleaning and inspection: use a dust-free cloth dipped in an appropriate amount of electronic cleaning agent, gently wipe the radiator and heat source surface, to ensure that no oil, dust and impurities remain. Then check whether the packaging of the thermal conductivity phase change material is intact to avoid contamination or damage to the material during transportation or storage.   2, environmental preparation: Ensure that the operating environment is clean and dust-free, to avoid the introduction of impurities in the operation process. Maintain appropriate temperature and humidity to avoid material performance due to environmental changes.   Laminating steps   1, material preparation: take out the thermal phase change material from the package, and carefully tear off the protective film on one side. Take care to keep the material flat and avoid curling or folding.   2, preliminary positioning: the thermal phase change material is gently placed on the radiator, according to the location of the heat source for preliminary positioning. Make sure the material covers the heat source area and the edges are aligned with the edges of the heat sink.   3, tight fit: Use a professional tool (such as a scraper or roller) to gently press the thermal phase change material to make it closely fit with the radiator surface. Pay attention to uniform strength, avoid local pressure too much to cause material damage. During the laminating process, the radiator can be moderately heated (such as using a hot air gun, but the temperature must be controlled not exceeding the material tolerance range) to promote the phase transition process of the material with thermal phase change and improve the laminating effect.   4, tear off the remaining protective film: after the thermal phase change material is fully fitted with the radiator, carefully tear off the other side of the protective film. Pay attention to avoid displacement or deformation of the material during the film tearing process.