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Liquid cooling immersion cooling new benchmark  Ziitek Technology's TIF100C series immersion thermal pad, meeting the long-term requirements for AI & GPU liquid cooling barriers   With AI computing power, new energy vehicles, and high-performance servers all entering the era of liquid cooling / immersion cooling for heat dissipation, traditional thermal interface materials often encounter problems such as insufficient heat conduction, poor adhesion, weak insulation, and cumbersome installation. Mako Electronics has newly launched the TIF®100C series of immersion-specific thermal silicone pads, featuring 8.0W/m·K high thermal conductivity, ultra-high compression flexibility, self-adhesive without glue, V-0 flame retardancy, etc. These hard-core performance characteristics make it an efficient thermal insulation solution for high-power devices and liquid cooling / metal bases. Ⅰ.make sure you understand: liquid cooling with cold plates vs immersion cooling are completely different concepts.   1. Cold plate liquid cooling (indirect cooling - progressive mainstream) ✅Principle: The cold plate is closely attached to the GPU/CPU, and the coolant circulates in a closed channel, only cooling the core chips. ✅Features: Minimal changes, strong compatibility, easy deployment. Preferred for existing data centers. ✅Limitations: Memory and power supplies still rely on air cooling, which may result in local hotspots. The upper limit for high-density scenarios is limited. 2. Immersion Liquid Cooling (Direct Cooling - High Density) ✅Principle: The entire machine is immersed in an insulating coolant, achieving full-area, non-overlapping heat exchange. The heat dissipation ✅efficiency is 20-30 times higher than that of air cooling. ✅Features: No fan, low noise, stable temperature control, PUE can be as low as 1.05. Suitable for high-density cluster cabinets with power exceeding 100kW. ✅Key Challenges: The compatibility of the coolant directly determines the lifespan, stability and heat dissipation efficiency of the thermal pad. II. The critical point of immersion liquid cooling: The heat-conducting pad cannot withstand the liquid, and all efforts will be in vain.、 In the immersion environment, the heat-conducting pad is constantly immersed in media such as PAO and fluorinated liquids. Ordinary materials will experience phenomena such as swelling, cracking, powder shedding, a sharp decline in heat conductivity, interface failure, GPU overheating and frequency reduction, soaring operation costs, and skyrocketing failure rates. This is why immersion liquid cooling requires the use of dedicated compatible heat-conducting materials.   III. Ziitek TIF100C Immersion Heat Conductive Sheet, Immersion Liquid Cooling Solution: Stable, Powerful, Long-lasting   Core breakthrough: Highly compatible with the entire series of thermal pads, deeply adapted to PAO4, various immersion oils, fluorinated liquids and other mainstream immersion media. Long-term immersion does not cause swelling or attenuation, and the performance is stable. It has been verified in multiple customer immersion scenarios and is compatible with TIF100C and other series of thermal sheet products. ✅Product features: Excellent thermal conductivity. Self-adhesive, no need for additional surface adhesives. High compressibility, soft and elastic, providing multiple thickness options. Good chemical stability. IV. Key Application Scenarios | Full Coverage High-Power Immersion/Liquid Cooling Field   ✅ AI servers / HPC high-performance computing Between GPU/CPU/accelerator cards and liquid cooling plates, low thermal resistance, high insulation, high reliability, supporting full computing power continuous output ✅ New energy vehicles (vehicle-grade) Motor controllers, OBC, DC-DC, battery pack thermal management, insulation flame retardancy, buffering vibration resistance, corrosion resistance to coolant ✅ Network communication / 5G / optical modules High-power power amplifiers, switching chips, base station equipment, immersion / liquid cooling cooling, stable low latency, long lifespan ✅ Industrial control / power supply / energy storage High-power power supply modules, inverters, energy storage converters, high-voltage insulation, fire safety, long-term stability ✅ Immersion-type liquid cooling chassis Data centers, supercomputers, special cooling equipment, perfectly adapting to immersion work without polluting the coolant   In the era of liquid cooling immersion, heat dissipation not only needs to be "fast", but also must be stable, safe, and easy to assemble. The Ziitek TIF®100C series, with its five core advantages of 8.0W high thermal conductivity, ultra-high compression, self-adhesive without glue, V-0 flame retardant, and high insulation, has become the preferred choice for immersion cooling in high-power scenarios such as AI, new energy, servers, and industrial equipment.

Three high-performance thermal conductive materials, providing a solid support for the thermal management of energy storage batteries   The energy storage battery pack, as the core component of the energy storage system, its performance and high reliability are the key factors ensuring the smooth operation of the energy storage system. During the daily operation of the energy storage batteries, thermal management undoubtedly holds a crucial position. With the significant improvement in the power handling capacity of batteries, the power density of lithium batteries has also increased accordingly. In this context, implementing a high thermal management strategy plays a vital role in extending the battery's service life and ensuring long-term stable operation. 1、Thermal Conductive Gel: Accurately Conducts Heat, Protects Battery Modules Heat conductive gel is a high-performance heat-conducting material specially designed for use between battery modules and liquid cooling plates. With its excellent heat-conducting properties, low compression stress, and the convenience of supporting automated dispensing, it significantly improves heat transfer efficiency, effectively preventing the occurrence of local overheating, and building a solid defense line to extend the battery's lifespan. 2、Silicone Foamed Rubber: Heat Insulation and Noise Reduction, Enhancing Battery Efficiency Silicone foamed rubber, as a multifunctional heat-conducting material, not only effectively prevents direct contact between the electrolyte and the battery casing, reducing the disorderly transfer of heat within the battery, thereby improving the overall efficiency of the battery; at the same time, its excellent sound insulation and noise reduction capabilities can significantly reduce the noise interference during the operation of the energy storage battery, providing a strong guarantee for the stable operation of the battery.   3、Thermal conductive potting compound： Sealing and Protecting, Safeguarding Battery Safety Thermal sealing compound plays a crucial role in the sealing process of battery packs. It can form a dense and sturdy protective film, effectively blocking the invasion of harmful factors such as moisture and contaminants from the outside, thereby significantly enhancing the sealing and safety of the battery. This protective film is like a sturdy armor for the battery, allowing it to maintain good performance and stability even in harsh working conditions.   These three high-performance thermal-conducting materials each play an irreplaceable role, jointly providing a comprehensive and effective solution for the thermal management of energy storage batteries, ensuring the continuous, stable and high-performance operation of the energy storage system.

New Era of SD Card Cooling: TIC800G Heat Conductive Phase Change Material, Ensuring No Frequency Drop During High-Speed Continuous Shooting   For every photographer who strives for high quality, whether it's capturing the fleeting moments of wild animals with continuous shooting, or recording 4K/8K high-bitrate videos for a long duration, the camera is their trusted companion. However, have you ever experienced the embarrassing situation where the camera suddenly alerts "Device overheating, about to shut down"? When you blame it on the camera body, perhaps you have overlooked a crucial heat source - the SD card in your hand.   Today, we would like to introduce to you a "heat dissipation guardian" hidden within the SD card - Ziitek TIC800G thermal phase change material. It is quietly enhancing the reliability standards of high-performance storage. With the continuous improvement of resolution and burst shooting speed, data is pouring into the SD card at a rate of several gigabytes per second. These intense read and write operations will generate an astonishing amount of heat for the main control chip and storage units of the SD card.If overheated, it will directly lead to:   1. Triggered frequency reduction: To protect the hardware, the SD card will automatically reduce its read and write speeds, resulting in lag during continuous shooting and interruption of video recording. 2. Data error risk: High temperature is the enemy of the stability of electronic components, potentially increasing the probability of data write errors or loss. 3. Lifespan reduction: Long-term operation under high temperature will accelerate the aging of internal components in the SD card, affecting its service life. The TIC800G thermal conductive phase-change material is different from traditional heat sinks. It is a high-performance thermal conductive material based on phase-change technology. Its "phase change" property is precisely the secret to its heat dissipation:   1. Solid adhesion: At room temperature, it is like a soft solid pad that closely adheres to the heat-generating chip surface of the SD card. 2. Heat absorption phase change: When the chip temperature rises to a specific critical point, the material absorbs a large amount of heat and transforms from a solid state to a semi-fluid state. This process absorbs much more heat than the simple temperature rise of ordinary materials. 3. Uniform heat conduction: During the phase change, it can quickly spread the heat from the hot area to the entire material surface, and then dissipate it through the SD card casing or metal frame. 4. Cooling restoration: When the reading and writing tasks are completed and the chip temperature drops, TIC800G releases the stored heat and returns to the solid state, waiting for the next cycle. In summary, it is like a reusable "heat energy buffer pad", continuously absorbing and releasing heat, firmly controlling the chip temperature within the safe range.   So, why is TIC800G the "perfect match" for SD cards? 1. Precise temperature control, continuous performance: By effectively controlling the temperature of the chip, it can prevent SD cards from reducing their frequency due to overheating, ensuring a stable and smooth reading and writing experience during long periods of high-load shooting. 2. Ultra-thin and flexible, seamless integration: TIC800G can be made into ultra-thin sheets, easily fitting into the compact space inside SD cards without occupying additional volume, and meeting the heat dissipation requirements of small electronic devices. 3. Interface filling, high thermal conductivity: Its soft nature can fully fill the air gaps between the chip and the casing (air is a poor conductor of heat), establishing a "high heat conduction bridge", improving the overall heat dissipation efficiency. 4. Reliable and durable, safeguarding data security: By keeping SD cards working at an appropriate temperature, it not only enhances the stability for immediate use but also delays the aging of flash memory chips and the main control chip from a long-term perspective, adding a solid safeguard for your valuable data assets.

The annual conference and celebration of the Ziitek Group in 2025 was successfully held.

Ziitek’s Top Ten Products of 2025 At Ziitek Technology, we continue to lead the way in advanced thermal management. Our comprehensive portfolio of thermal interface materials and next-generation cooling solutions is designed to deliver exceptional performance and reliability for your components and devices. From aluminium heat sinks to vapour chambers—and every TIM in between—we provide solutions engineered for the demands of modern electronics.   As we count down to Chinese New Year , we’ll be unveiling our Top 10 Products of 2025. Each week, we’ll share details of our most popular products across our You-tube, Facebook and X channels, building up to the grand reveal of our number one product of the year.   Stay tuned as we celebrate the innovations that shaped 2025!   10、TIF700HZ Our countdown has officially begun. TIF700HZ is the 10th product on our sales report list. It is one of our new series of products. this economical gap pad remains a firm customer favourite despite its softness (45 Shore 00!) and offers 7.0W/mK conductivity ，It can fill the gaps between heating devices and heat sinks or metal bases. Its flexibility and elasticity enable it to cover very uneven surfaces. Its outstanding performance allows heat to be conducted from the heating device or the entire printed circuit board to the metal casing or diffusion plate, thereby improving the efficiency and lifespan of the heating electronic components.   For more information about this high-performance composite cooling pad, please click here: TIF700HZ ultra soft Thermal Pad. 9、TIF500-40-11US Another product ranked ninth is our ultra-soft hot pad series, which can help engineers and manufacturers simplify the assembly process, reduce rework and quality inspection time, and extend the service life of products-without affecting the thermal design margin at all. Its thermal conductivity is reaching 4.0W /MK.   For more information about this high-performance composite cooling pad, please click here: TIF500-40-11US cooling pad. 8、TIF800QE Holding its place at number 8th is our TIF800QE High thermal conductivity Thermal Pad, This high thermal conductivity gap pad is still the customer's favorite, although it is very soft (35 Shore 00! ) and provides a conductivity of 13W/MK.Thanks to its tacky surfaces, it conforms well to uneven surfaces, helping maintain low thermal impedance in cost-sensitive designs without compromising on performance.   Find out more about this ever popular pad here: TIF800QE High thermal conductivity Thermal Pad   7、TIG780-30 Ranked seventh on the list is our thermal conductive paste.This high-stability silicone-based grease has a thermal conductivity of 3.0W/mK, excellent wetting characteristics, and long-term reliability. It's ideal for applications where a very thin, uniform TIM layer is needed, for example: in IC-to-heatsink interfaces, CPUs, or tightly packed power modules.   Find out more about this best seller here: TIG780-30 Thermal Paste   6、TIR300 In at six is TIR300 Synthetic Graphite which brings its ultra-thin, lightweight, highly oriented graphite polymer film to the spotlight. As per our 2025 review, this material has in-plane conductivity up to 1,700W/mK, making it significantly better than copper in the XY axis. Its flexibility, low resistance, and great EMI shielding make it a go-to choice for spreading heat in highly compact designs where space and efficiency are at a premium.   Find out more about what makes this thermal graphite here: TIR300 Synthetic Graphite 5、TIA800FG For our number of fifth place is TIA800FG Thermal Tape, is a double-sided thermal interface tape which provides exceptional bonding properties between electronic components and heat sinks, eliminating the need for mechanical fasteners. TIA800FG can be offered in various formats such as sheets, rolls and die cut parts depending on the application and are proven reliability under various mechanical, thermal, and environmental stresses. widely used in LED, M/B, P/S, Heat Sink, etc., which can replace hot melt adhesive, screws, fasteners and other fixing methods.   Find out more about this product profile here: TIA800FG 4、TIF500-50-11U For our number four place is TIF500-50-11U Ultra Soft Thermal Pad, a high-performance silicone-based gap filler. It features 5.0W/mK thermal conductivity, a Shore 00 hardness of 27, and an impressive dielectric breakdown voltage of 5500V/mm. With its natural tack and availability in standard sheets or die-cut parts, it’s perfect for high-reliability applications where electrical insulation and conformability matter, like in power electronics or compact modules such as our M2.SSD range.   Find out more about this popular pad here: TIF500-50-11U Ultra Soft Thermal Pad 3、TIG780-52 In third place is TIG780-52 Silicone Thermal grease ,With a thermal conductivity of 5.2 W/mK, this one-part, fully cured compound delivers low impedance and outstanding reliability under extreme conditions such as thermal cycling, vibrations, and shock. Itssilicone formulation also minimises pump-out and degradation, making it ideal for long-life, mission-critical systems and silicone sensitive applications such as optoelectronics.   Find out more about this Silicone Thermal grease here: TIG780-52 Silicone Thermal grease     2、TIF100-30-05E The ninth-ranked product is the TIF100-30-05E ultra-soft Thermal pad, a high-performance silicone-based gap filler. It features 3.0W/mK thermal conductivity, a Shore 00 hardness of 35, and an impressive dielectric breakdown voltage of 5500V/mm. With its natural tack and availability in standard sheets or die-cut parts, it’s perfect for high-reliability applications where electrical insulation and conformability matter, like in power electronics or compact modules.   Find out more about this popular pad here: TIF100-30-05E Ultra Soft Thermal Pad      1、TIF700RES Topping our sales prodcuts list in 2025, the top item is the TIF700RES ultra-soft low-compression force thermal pad, which is our best-selling heat dissipation pad product. It combines 8.5W/mK conductivity with a low Shore 00 hardness of 10, giving you high thermal performance with excellent compliance and electrical isolation. Its dielectric breakdown voltage of >5500V/mm and wide operating temperature range of –45 °C to +200 °C make it a reliable choice across a broad spectrum of applications, from aerospace and EVs to AI, VR, and beyond, This best-selling silicone based gap pads is self-adhesive and does not require additional surface adhesives.   Find out more about our chart topping number one best seller for 2025 here: TIF700RES Ultra Soft Thermal Pad    

Record of Communication Activities of between Dongguang Ziitek and Taiwan Ziitek Companies   The core of thermal conductive materials: thermal conductivity   The core of thermal insulation materials lies in efficiently transferring energy, eliminating barriers, and achieving synchronous resonance between systems. And an excellent team, is its essence not the same? In early 2026, as the dawn of the new year spread across the Asia-Pacific region, the elite members of the sales teams of Ziitek Technology's two sides embarked on a business exchange trip between the two sides. This was not an ordinary meeting or training session; it was an immersive work exchange journey that followed the company's industrial chain, delved into the production heartland, and extended to the market frontiers. Departing from Taipei, passing through Shanghai, visiting Kunshan, arriving at the headquarters in Dongguan, and finally reaching Hong Kong, the journey spanned across the three regions of the two sides. The sole purpose was to enhance the operational efficiency and competitiveness of the entire group.

Ziitek starts a new journey with running and condenses the future with strength.   Time flies and the struggle never stops. In 2025, Ziitek team kept walking, and deeply cultivated the field of heat conducting materials with concentration and enthusiasm; In 2026, we are ready to start and meet new challenges with a running attitude. Between crossing and moving forward, we use a morning run to wake up the vitality, and use a tug-of-war competition to unite and go to the next wonderful journey together! Running ---Welcome the light and start a new journey. In the early morning of January 2, 2026, when the first ray of sunshine shone on the earth, the Ziitek team had been assembled. As soon as the bell rang, everyone began to run. We bid farewell to 2025 in the running and bid farewell to yesterday's struggle with sweat. We are running into 2026, embracing the sun and welcoming the hope of the New Year. The scenery passes by along the way, and the hearts are full of enthusiasm, which is a vivid portrayal of Ziitek team's "focus on moving forward".   Let's twist into a rope and show off together After running in the morning, the tug-of-war field is in full swing! One rope, one heart, one strength-R&D, production, quality, engineering and sales teams hold on to the long rope, and it is not only strength but also trust that supports each other. In the shouting, winning or losing is not important. At this moment, we really realize that the team is our most solid "thermal conducting material", which transmits energy and condenses warmth.   Go forward to a new future together 20 years of concentration, the initial heart does not change. From heat-conducting materials to team spirit, Ziitek always believes that the real "thermal conduction" is the resonance between people and the link between heart and heart. This activity is not only a physical exercise, but also a tempering of team spirit. Let's take the temperature of walking side by side, with more enthusiasm and high-spirited attitude, and invest in the journey of the new year! In 2026, Ziitek team’s are ready: In the process of moving forward, save enough new power. Pass warmth in collaboration, Go to a more exciting future hand in hand! Morning running and tug-of-war activities are just the starting point. In 2026, more team activities and cultural construction will be launched one after another. Pay attention to Ziitek, join us, run out of acceleration and spell out new heights!

Merry Christmas and Happy New Yar 2026!   Thank you for partnering with us. We look forward to creating more success together in 2026.  

Solving the "thermal anxiety" of AI data center: Three high thermal conductivity materials of Ziitek are the cooling stability of CPU/GPU   When AI big model and VR/AR are running wildly, the CPU and GPU in the data center are experiencing "high temperature baking test"-they are both the core of computing power and the number one heat source. Once the heat dissipation can't keep up, not only will the stability of the equipment be discounted, but the energy consumption and operation and maintenance costs will also rise. The key to solve this heat dissipation dilemma lies in a detail that is easily overlooked: the thermal interface material. So, where does the "heat anxiety" of the data center come from?   1. High thermal conductivity interface material: detailed explanation of the performance of three "cooling tools"   Heat-conducting silica gel sheet: a "flexible heat-conducting sheet" suitable for complex scenes. Core performance: The thermal conductivity is usually 1.0~13W/(m? K), with excellent flexibility and insulation, the product has a fire protection grade of UL94-V0, with self-adhesive property without additional adhesive, which can be customized according to the gap thickness of equipment; Application scenario: the very strict joint area between CPU/GPU radiator and motherboard and the gap filling of storage device module-it can adapt components with different heights at the same time to avoid equipment damage caused by hard contact; Advantages of AI scene: Facing the dense component layout in AI server, it can flexibly fill irregular gaps, taking into account heat conduction efficiency and equipment protection.   2. Thermal conductive phase change material: an "intelligent thermal conductive layer" adapted with temperature. Core performance: it is solid at room temperature (easy to transport and install), and it will change into semi-liquid when the temperature reaches 50~60℃, which closely adheres to the surface of chip and heat sink; Application scenario: the core heat dissipation surface of high-performance CPU/GPU-it can fill nano-scale micro-cracks after phase change, greatly reducing the interface thermal resistance; Advantages of AI scene: During the training of AI large model, the chip will be in a high-load and high-temperature state for a long time, and the phase change material can keep close contact continuously, avoiding the thermal conductivity fault of traditional solid materials due to thermal expansion and cold contraction. 3. Thermal conductive gel: the core performance of "heat flow accelerator" that breaks through the upper limit of thermal conductivity. The thermal conductivity directly exceeds 8.0W/(m? K) It has the fluidity of heat-conducting gel, and its temperature resistance ranges from-45℃ to 200℃. Even if the local temperature changes sharply due to the fluctuation of refrigeration system or long-term high load of equipment in the data center, it can maintain stable heat-conducting performance. Moreover, the products have passed UL94 V-0 flame retardant certification and RoHS environmental protection standards, which can not only ensure heat dissipation, but also avoid potential safety hazards at high temperature, and meet the needs of long-term stable operation of data centers. Applicable scenarios: AI accelerator cards, high-power GPU and other "high-heat-density core devices"; Advantages of AI scene: In the cluster of large computing power, the power consumption of a single chip continues to rise, and the gel with high thermal conductivity can quickly export the concentrated heat to avoid the frequency reduction of computing power caused by local overheating of the chip. The combined use of these materials is equivalent to installing a "layered effective cooling channel" for the core equipment of the data center-it can not only accurately match the cooling requirements of different devices, but also reduce the energy consumption of fans and air conditioners, and indirectly reduce the operating cost of the data center.

Artificial heat-conducting graphite sheet: Lightweight and flexible, unlocking new possibilities for cooling curved devices   In the wave of innovation in electronic device forms, curved design and folding shapes have become the mainstream trends in consumer electronics, vehicle terminals, and wearable devices. However, the irregularity of the curved structure and the space limitations within the devices have left traditional heat dissipation materials in a predicament of "difficult adaptation and poor heat dissipation" - rigid heat dissipation plates cannot fit the curved surface, heavy materials occupy internal space, and thin materials are unable to meet the requirements for effective heat dissipation.   The emergence of artificial heat-conducting graphite sheets, with their core advantage of being "thin, lightweight and flexible", has effectively solved the heat dissipation problems of curved devices, becoming a key support for the innovation of terminal products. "Thin and flexible" is the core highlight that makes it suitable for curved devices. The thickness of the membrane can be customized in multiple specifications. The thin and lightweight feature almost does not occupy the internal space of the device, perfectly aligning with the design concept of "lightweighting and ultra-thinness" for curved and foldable devices. It also has excellent flexibility and bending performance, which can be freely fitted according to the curvature and contour of curved devices. Whether it is the curved edge of a curved-screen phone, the hinge area of a foldable laptop, or the curved display of a vehicle dashboard or wearable devices, it can closely cover the heat dissipation surface, achieving efficient and effective heat dissipation without any dead zones. This effectively solves the industry problem of traditional heat dissipation materials being "strongly rigid and poorly compatible".   In addition to its core adaptability advantage, the manually heated graphite sheet also has the characteristics of easy processing and wide adaptability. It supports precise die-cutting according to the size, shape and heat dissipation requirements of different devices, and can be customized with special specifications such as irregular shapes and holes, to meet the personalized heat dissipation needs of various curved surface devices. From curved screen mobile phones to foldable terminals, from curved central control units for vehicles to smart wearable devices, artificial heat-conducting graphite sheets have become the preferred solution for heat dissipation in curved devices due to their core characteristics of "high thermal conductivity, ultra-thinness, strong flexibility, and easy adaptability". It not only breaks the form limitations of traditional heat dissipation materials, but also helps terminal products achieve dual breakthroughs in design innovation and performance improvement, allowing curved devices to not only have stunning appearance designs but also maintain stable and smooth usage experiences.