The "savior" of computer CPU's heat dissipation performance-thermal conductive gel

The "savior" of computer CPU's heat dissipation performance-thermal conductive gel

When the computer is running, the CPU runs at a high speed like a "brain", which generates a lot of heat. If the heat can't be released in time, the CPU temperature will soar, which will directly lead to a sudden drop in the running speed of the computer, frequent jamming, even a crash, blue screen and other conditions, and even shorten the service life of the hardware in serious cases.For gamer, video editors and other people who need computers to run with high load for a long time, the heat dissipation problem is a "roadblock" that affects the work and entertainment experience. Therefore, heat dissipation is very important for CPU, and thermal conductive gel plays an indispensable role in it. How does it play its role?

Thermal conductive Gel, also often called thermal conductive gap filler materials, is a kind of high thermal conductive material specially developed to solve the problem of heat conduction, which plays a key role in the field of heat dissipation of electronic equipment. It is mainly made of silicone grease, which has good insulation and chemical stability and can provide stable structural support for thermal conductive gel. Metal oxides (such as alumina, zinc oxide, etc.) and some special heat conducting materials (such as silver powder, ceramic particles, etc.) are also added as heat conducting fillers. These thermal conductive fillers are the key to improve the thermal conductivity of thermal conductive gel. They are like efficient heat transfer messengers, which can quickly capture and transfer heat.

Compared with ordinary thermal conductive materials, the thermal conductivity of thermal conductive gel is much higher. This means that it can transfer the heat generated by the CPU to the radiator at a faster speed. For overclocking players who pursue extreme performance, and users who need the computer to run under high load for a long time (such as those who do large-scale 3D modeling and rendering work), this efficient heat conduction ability is very important and can effectively avoid the performance bottleneck caused by overheating.

Compared with thermal conductive pad, thermal conductive gel has wider applicability. Regardless of the shape and size of the CPU, it can be perfectly adapted. The daubing installation process is simple and easy to understand, and even novices can get started quickly. Moreover, when it needs to be replaced in the future, it is more convenient to clean up the residue, and it will not be as difficult to handle as some materials. Among the materials to improve heat dissipation performance, the price of thermal conductive gel is relatively close to the people. For users who want to improve the heat dissipation of computers and don't want to invest too much budget in this area, it is undoubtedly an ideal choice with high cost performance. Spending a little money can get obvious performance improvement, which is favored by the majority of users.

To sum up, thermal gel plays an important role in the heat dissipation of computer CPU, which provides strong support for improving computer performance with its excellent thermal conductivity, flexible ease of use and high cost performance. For users who want to improve the heat dissipation of computers, they may try to use thermal gel, which may bring unexpected results. With the continuous development of science and technology, the future heat dissipation materials will move towards a more efficient, safer and more convenient direction, and the thermal conductive gel is also expected to show greater potential in the technological upgrading and continue to contribute to computer heat dissipation.