China CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM Company News

The annual conference and celebration of the Ziitek Group in 2025 was successfully held.

Ziitek’s Top Ten Products of 2025 At Ziitek Technology, we continue to lead the way in advanced thermal management. Our comprehensive portfolio of thermal interface materials and next-generation cooling solutions is designed to deliver exceptional performance and reliability for your components and devices. From aluminium heat sinks to vapour chambers—and every TIM in between—we provide solutions engineered for the demands of modern electronics.   As we count down to Chinese New Year , we’ll be unveiling our Top 10 Products of 2025. Each week, we’ll share details of our most popular products across our You-tube, Facebook and X channels, building up to the grand reveal of our number one product of the year.   Stay tuned as we celebrate the innovations that shaped 2025!   10、TIF700HZ Our countdown has officially begun. TIF700HZ is the 10th product on our sales report list. It is one of our new series of products. this economical gap pad remains a firm customer favourite despite its softness (45 Shore 00!) and offers 7.0W/mK conductivity ，It can fill the gaps between heating devices and heat sinks or metal bases. Its flexibility and elasticity enable it to cover very uneven surfaces. Its outstanding performance allows heat to be conducted from the heating device or the entire printed circuit board to the metal casing or diffusion plate, thereby improving the efficiency and lifespan of the heating electronic components.   For more information about this high-performance composite cooling pad, please click here: TIF700HZ ultra soft Thermal Pad. 9、TIF500-40-11US Another product ranked ninth is our ultra-soft hot pad series, which can help engineers and manufacturers simplify the assembly process, reduce rework and quality inspection time, and extend the service life of products-without affecting the thermal design margin at all. Its thermal conductivity is reaching 4.0W /MK.   For more information about this high-performance composite cooling pad, please click here: TIF500-40-11US cooling pad. 8、TIF800QE Holding its place at number 8th is our TIF800QE High thermal conductivity Thermal Pad, This high thermal conductivity gap pad is still the customer's favorite, although it is very soft (35 Shore 00! ) and provides a conductivity of 13W/MK.Thanks to its tacky surfaces, it conforms well to uneven surfaces, helping maintain low thermal impedance in cost-sensitive designs without compromising on performance.   Find out more about this ever popular pad here: TIF800QE High thermal conductivity Thermal Pad   7、TIG780-30 Ranked seventh on the list is our thermal conductive paste.This high-stability silicone-based grease has a thermal conductivity of 3.0W/mK, excellent wetting characteristics, and long-term reliability. It's ideal for applications where a very thin, uniform TIM layer is needed, for example: in IC-to-heatsink interfaces, CPUs, or tightly packed power modules.   Find out more about this best seller here: TIG780-30 Thermal Paste   6、TIR300 In at six is TIR300 Synthetic Graphite which brings its ultra-thin, lightweight, highly oriented graphite polymer film to the spotlight. As per our 2025 review, this material has in-plane conductivity up to 1,700W/mK, making it significantly better than copper in the XY axis. Its flexibility, low resistance, and great EMI shielding make it a go-to choice for spreading heat in highly compact designs where space and efficiency are at a premium.   Find out more about what makes this thermal graphite here: TIR300 Synthetic Graphite 5、TIA800FG For our number of fifth place is TIA800FG Thermal Tape, is a double-sided thermal interface tape which provides exceptional bonding properties between electronic components and heat sinks, eliminating the need for mechanical fasteners. TIA800FG can be offered in various formats such as sheets, rolls and die cut parts depending on the application and are proven reliability under various mechanical, thermal, and environmental stresses. widely used in LED, M/B, P/S, Heat Sink, etc., which can replace hot melt adhesive, screws, fasteners and other fixing methods.   Find out more about this product profile here: TIA800FG 4、TIF500-50-11U For our number four place is TIF500-50-11U Ultra Soft Thermal Pad, a high-performance silicone-based gap filler. It features 5.0W/mK thermal conductivity, a Shore 00 hardness of 27, and an impressive dielectric breakdown voltage of 5500V/mm. With its natural tack and availability in standard sheets or die-cut parts, it’s perfect for high-reliability applications where electrical insulation and conformability matter, like in power electronics or compact modules such as our M2.SSD range.   Find out more about this popular pad here: TIF500-50-11U Ultra Soft Thermal Pad 3、TIG780-52 In third place is TIG780-52 Silicone Thermal grease ,With a thermal conductivity of 5.2 W/mK, this one-part, fully cured compound delivers low impedance and outstanding reliability under extreme conditions such as thermal cycling, vibrations, and shock. Itssilicone formulation also minimises pump-out and degradation, making it ideal for long-life, mission-critical systems and silicone sensitive applications such as optoelectronics.   Find out more about this Silicone Thermal grease here: TIG780-52 Silicone Thermal grease     2、TIF100-30-05E The ninth-ranked product is the TIF100-30-05E ultra-soft Thermal pad, a high-performance silicone-based gap filler. It features 3.0W/mK thermal conductivity, a Shore 00 hardness of 35, and an impressive dielectric breakdown voltage of 5500V/mm. With its natural tack and availability in standard sheets or die-cut parts, it’s perfect for high-reliability applications where electrical insulation and conformability matter, like in power electronics or compact modules.   Find out more about this popular pad here: TIF100-30-05E Ultra Soft Thermal Pad      1、TIF700RES Topping our sales prodcuts list in 2025, the top item is the TIF700RES ultra-soft low-compression force thermal pad, which is our best-selling heat dissipation pad product. It combines 8.5W/mK conductivity with a low Shore 00 hardness of 10, giving you high thermal performance with excellent compliance and electrical isolation. Its dielectric breakdown voltage of >5500V/mm and wide operating temperature range of –45 °C to +200 °C make it a reliable choice across a broad spectrum of applications, from aerospace and EVs to AI, VR, and beyond, This best-selling silicone based gap pads is self-adhesive and does not require additional surface adhesives.   Find out more about our chart topping number one best seller for 2025 here: TIF700RES Ultra Soft Thermal Pad    

Record of Communication Activities of between Dongguang Ziitek and Taiwan Ziitek Companies   The core of thermal conductive materials: thermal conductivity   The core of thermal insulation materials lies in efficiently transferring energy, eliminating barriers, and achieving synchronous resonance between systems. And an excellent team, is its essence not the same? In early 2026, as the dawn of the new year spread across the Asia-Pacific region, the elite members of the sales teams of Ziitek Technology's two sides embarked on a business exchange trip between the two sides. This was not an ordinary meeting or training session; it was an immersive work exchange journey that followed the company's industrial chain, delved into the production heartland, and extended to the market frontiers. Departing from Taipei, passing through Shanghai, visiting Kunshan, arriving at the headquarters in Dongguan, and finally reaching Hong Kong, the journey spanned across the three regions of the two sides. The sole purpose was to enhance the operational efficiency and competitiveness of the entire group.

Ziitek starts a new journey with running and condenses the future with strength.   Time flies and the struggle never stops. In 2025, Ziitek team kept walking, and deeply cultivated the field of heat conducting materials with concentration and enthusiasm; In 2026, we are ready to start and meet new challenges with a running attitude. Between crossing and moving forward, we use a morning run to wake up the vitality, and use a tug-of-war competition to unite and go to the next wonderful journey together! Running ---Welcome the light and start a new journey. In the early morning of January 2, 2026, when the first ray of sunshine shone on the earth, the Ziitek team had been assembled. As soon as the bell rang, everyone began to run. We bid farewell to 2025 in the running and bid farewell to yesterday's struggle with sweat. We are running into 2026, embracing the sun and welcoming the hope of the New Year. The scenery passes by along the way, and the hearts are full of enthusiasm, which is a vivid portrayal of Ziitek team's "focus on moving forward".   Let's twist into a rope and show off together After running in the morning, the tug-of-war field is in full swing! One rope, one heart, one strength-R&D, production, quality, engineering and sales teams hold on to the long rope, and it is not only strength but also trust that supports each other. In the shouting, winning or losing is not important. At this moment, we really realize that the team is our most solid "thermal conducting material", which transmits energy and condenses warmth.   Go forward to a new future together 20 years of concentration, the initial heart does not change. From heat-conducting materials to team spirit, Ziitek always believes that the real "thermal conduction" is the resonance between people and the link between heart and heart. This activity is not only a physical exercise, but also a tempering of team spirit. Let's take the temperature of walking side by side, with more enthusiasm and high-spirited attitude, and invest in the journey of the new year! In 2026, Ziitek team’s are ready: In the process of moving forward, save enough new power. Pass warmth in collaboration, Go to a more exciting future hand in hand! Morning running and tug-of-war activities are just the starting point. In 2026, more team activities and cultural construction will be launched one after another. Pay attention to Ziitek, join us, run out of acceleration and spell out new heights!

Merry Christmas and Happy New Yar 2026!   Thank you for partnering with us. We look forward to creating more success together in 2026.  

Solving the "thermal anxiety" of AI data center: Three high thermal conductivity materials of Ziitek are the cooling stability of CPU/GPU   When AI big model and VR/AR are running wildly, the CPU and GPU in the data center are experiencing "high temperature baking test"-they are both the core of computing power and the number one heat source. Once the heat dissipation can't keep up, not only will the stability of the equipment be discounted, but the energy consumption and operation and maintenance costs will also rise. The key to solve this heat dissipation dilemma lies in a detail that is easily overlooked: the thermal interface material. So, where does the "heat anxiety" of the data center come from?   1. High thermal conductivity interface material: detailed explanation of the performance of three "cooling tools"   Heat-conducting silica gel sheet: a "flexible heat-conducting sheet" suitable for complex scenes. Core performance: The thermal conductivity is usually 1.0~13W/(m? K), with excellent flexibility and insulation, the product has a fire protection grade of UL94-V0, with self-adhesive property without additional adhesive, which can be customized according to the gap thickness of equipment; Application scenario: the very strict joint area between CPU/GPU radiator and motherboard and the gap filling of storage device module-it can adapt components with different heights at the same time to avoid equipment damage caused by hard contact; Advantages of AI scene: Facing the dense component layout in AI server, it can flexibly fill irregular gaps, taking into account heat conduction efficiency and equipment protection.   2. Thermal conductive phase change material: an "intelligent thermal conductive layer" adapted with temperature. Core performance: it is solid at room temperature (easy to transport and install), and it will change into semi-liquid when the temperature reaches 50~60℃, which closely adheres to the surface of chip and heat sink; Application scenario: the core heat dissipation surface of high-performance CPU/GPU-it can fill nano-scale micro-cracks after phase change, greatly reducing the interface thermal resistance; Advantages of AI scene: During the training of AI large model, the chip will be in a high-load and high-temperature state for a long time, and the phase change material can keep close contact continuously, avoiding the thermal conductivity fault of traditional solid materials due to thermal expansion and cold contraction. 3. Thermal conductive gel: the core performance of "heat flow accelerator" that breaks through the upper limit of thermal conductivity. The thermal conductivity directly exceeds 8.0W/(m? K) It has the fluidity of heat-conducting gel, and its temperature resistance ranges from-45℃ to 200℃. Even if the local temperature changes sharply due to the fluctuation of refrigeration system or long-term high load of equipment in the data center, it can maintain stable heat-conducting performance. Moreover, the products have passed UL94 V-0 flame retardant certification and RoHS environmental protection standards, which can not only ensure heat dissipation, but also avoid potential safety hazards at high temperature, and meet the needs of long-term stable operation of data centers. Applicable scenarios: AI accelerator cards, high-power GPU and other "high-heat-density core devices"; Advantages of AI scene: In the cluster of large computing power, the power consumption of a single chip continues to rise, and the gel with high thermal conductivity can quickly export the concentrated heat to avoid the frequency reduction of computing power caused by local overheating of the chip. The combined use of these materials is equivalent to installing a "layered effective cooling channel" for the core equipment of the data center-it can not only accurately match the cooling requirements of different devices, but also reduce the energy consumption of fans and air conditioners, and indirectly reduce the operating cost of the data center.

Artificial heat-conducting graphite sheet: Lightweight and flexible, unlocking new possibilities for cooling curved devices   In the wave of innovation in electronic device forms, curved design and folding shapes have become the mainstream trends in consumer electronics, vehicle terminals, and wearable devices. However, the irregularity of the curved structure and the space limitations within the devices have left traditional heat dissipation materials in a predicament of "difficult adaptation and poor heat dissipation" - rigid heat dissipation plates cannot fit the curved surface, heavy materials occupy internal space, and thin materials are unable to meet the requirements for effective heat dissipation.   The emergence of artificial heat-conducting graphite sheets, with their core advantage of being "thin, lightweight and flexible", has effectively solved the heat dissipation problems of curved devices, becoming a key support for the innovation of terminal products. "Thin and flexible" is the core highlight that makes it suitable for curved devices. The thickness of the membrane can be customized in multiple specifications. The thin and lightweight feature almost does not occupy the internal space of the device, perfectly aligning with the design concept of "lightweighting and ultra-thinness" for curved and foldable devices. It also has excellent flexibility and bending performance, which can be freely fitted according to the curvature and contour of curved devices. Whether it is the curved edge of a curved-screen phone, the hinge area of a foldable laptop, or the curved display of a vehicle dashboard or wearable devices, it can closely cover the heat dissipation surface, achieving efficient and effective heat dissipation without any dead zones. This effectively solves the industry problem of traditional heat dissipation materials being "strongly rigid and poorly compatible".   In addition to its core adaptability advantage, the manually heated graphite sheet also has the characteristics of easy processing and wide adaptability. It supports precise die-cutting according to the size, shape and heat dissipation requirements of different devices, and can be customized with special specifications such as irregular shapes and holes, to meet the personalized heat dissipation needs of various curved surface devices. From curved screen mobile phones to foldable terminals, from curved central control units for vehicles to smart wearable devices, artificial heat-conducting graphite sheets have become the preferred solution for heat dissipation in curved devices due to their core characteristics of "high thermal conductivity, ultra-thinness, strong flexibility, and easy adaptability". It not only breaks the form limitations of traditional heat dissipation materials, but also helps terminal products achieve dual breakthroughs in design innovation and performance improvement, allowing curved devices to not only have stunning appearance designs but also maintain stable and smooth usage experiences.  

The heat dissipation savior is here! TIC800G thermal conductive phase change material - why is it the "invisible armor" of photographer's SD cards?     Why do high-speed SD cards become "hot potatoes"? With the increase in resolution and shooting speed, data pours into the SD card at a rate of every second. This intense read-write operation causes the main control chip and storage units of the SD card to generate an astonishing amount of heat. If overheating occurs, it will directly lead to: 1. Triggering frequency reduction: To protect the hardware, the SD card will automatically reduce its read and write speeds, resulting in lagging in continuous shooting and interruption of video recording. 2. Data error risk: High temperatures are the enemy of the stability of electronic components, which may increase the risk of data write errors or loss. 3. Lifespan reduction: Prolonged operation under high temperatures will accelerate the aging of the internal components of the SD card.     So why is the TIC800G thermal conductive phase-change material such a perfect match for SD cards?   1. Accurate temperature control, continuous performance boost: By effectively regulating the temperature of the chip, it can prevent the SD card from reducing its speed due to overheating. This means that when you are recording high-definition videos for a long time or performing high-speed continuous shooting, you can enjoy a more stable and uninterrupted performance output. 2. Ultra-thin and flexible, without occupying space: The TIC800G thermal phase-change material can be made into very thin sheets, which can be easily inserted into the compact space inside the SD card without requiring any changes to the existing design. It is an ideal solution for addressing the heat dissipation problem of small electronic devices. 3. Interface filling, effective heat conduction: Its soft nature can effectively fill the air gap between the chip and the housing (air is a poor conductor of heat), establishing an effective "heat conduction bridge", significantly enhancing the overall heat dissipation efficiency. 4. Reliable and durable, safeguarding data security: By keeping the SD card operating at a certain temperature, it not only enhances the     stability for immediate use, but also protects the flash memory chips and the main control chip in the long term, prolonging the product's service life. This provides an insurance for your valuable data assets.   The invisible guardianship, the visible stability, unlocking the unknown potential In today's era of rapid development in photography technology, stability and reliability have become a higher pursuit beyond mere parameters. The TIC800G thermal conductive phase change material, this "cooling guardian" working silently within the SD card, is precisely an embodiment of this pursuit. Although it is not visible externally, it is of vital importance and serves as a solid support to ensure that every professional creator does not miss any wonderful shots at critical moments.  

To determine whether the thermal conductive silicone is toxic, several key indicators need to be considered In the cooling solution of electronic devices, conductive silicone grease is the core material that fills the gap between heat sources and heat dissipation components, and is widely used in scenarios such as computer CPUs, smartphone chips, and main control boards of household appliances. As a consumable that closely cooperates with electronic devices, its safety directly affects the safety of production operations, the health of the usage environment, and even the potential harm to the human body after long-term contact. Many users will pay attention to whether "the conductive silicone grease is toxic" when choosing. In fact, the answer lies in the key indicators and certifications of the product. By mastering the following judgment points, risks can be avoided.     I. Core Component: Avoiding toxic additives is the foundation The toxicity of thermal conductive silicone grease mainly comes from the base material and additives. Good products will adopt environmentally friendly and non-toxic formulations. The main components to pay attention to are: Base adhesive base: Most regular products are based on silicone resin. This type of material has stable chemical properties and does not release volatile toxic substances. If the product is labeled as containing "dichlorobiphenyls" or "halogen-containing flame retardants", it must be avoided directly. These substances are not only toxic but also may decompose at high temperatures to produce harmful gases. Heat-conducting fillers: Common non-toxic fillers include inorganic powders such as aluminum oxide, boron nitride, and zinc oxide, which have high thermal conductivity and strong chemical inertness. However, be cautious of fillers containing heavy metal compounds like lead, cadmium, and mercury. If these substances enter the human body through skin contact or inhalation of dust, they can accumulate and cause chronic harm, especially during product application, maintenance, and replacement, where the risks are higher.     II. Hazardous Substance Content: Confirm with Official Standard Certification Whether the components are compliant requires an authoritative inspection and certification endorsement. When purchasing, you can mainly check if the product has the following certifications or indicators as descriptions: EU RoHS Certification: This standard strictly limits the content of 6 harmful substances such as lead, cadmium, mercury, and hexavalent chromium. Products that have passed the certification can be regarded as basically non-toxic safe options, suitable for most electronic device scenarios. China GB/T 26572 standard: A domestic mandatory standard for restricted substances in electronic and electrical products, which is consistent with the core requirements of RoHS certification. Products that comply with this standard will be clearly marked in the packaging or instructions. Volatile Organic Compounds (VOC) content: The VOC content of a good thermal conductive silicone grease should be very low. If the product is labeled as "VOC content ≤ 1g/L", it indicates that it will hardly release toxic volatile gases during use, thus avoiding indoor or equipment internal air pollution caused by long-term use.     III. Safety Level Marking: Focus on Adaptation to Usage Scenarios Some products will be clearly labeled with their safety grades, helping users quickly determine the applicable scenarios. Common labels include: "Non-toxic", "Environmentally friendly", "Food contact grade" (for special scenarios): Such labels must be supported by test reports, indicating that the product will not produce toxic substances even under high temperatures and long-term contact conditions, and are suitable for equipment with high safety requirements (such as medical electronics and children's electronic products). Classification and identification of hazardous chemicals: If the product is labeled with "Toxic Substance", "Stinging", etc., it indicates that it contains toxic components or is prone to cause harmful irritation. It cannot be used in enclosed spaces, electronic devices that are easily accessible to humans, and is only applicable in special industrial high-temperature scenarios (and requires professional protection).     IV. Auxiliary Judgment Based on User Experience: Avoiding Hidden Risks Apart from the explicitly stated indicators, the intuitive feelings during the usage process can also assist in judging the safety. Odor: A good thermal conductive silicone grease should have no obvious odor. If you smell a pungent or foul odor after opening the package, it may indicate that cheap and toxic solvents or inferior fillers have been added. Such products will release more toxic gases when used at high temperatures, and you should immediately stop using them. Stability: If the product dries out rapidly, cracks, or oozes oil after application, it may indicate an unstable formula, and the oil-seeping components may be toxic. On the other hand, a product with a uniform texture, low volatility, and no abnormal changes over a long period of use is more likely to be safe.   In conclusion: To determine whether a thermal conductive silicone is toxic, the key lies in "examining the ingredients, verifying the certification, and checking the labels": Opt for products that are based on organic silicon, with inorganic non-toxic fillers as the core, and that have passed RoHS or GB/T 26572 certification. Avoid options containing heavy metals, halogens, and high VOC levels. Whether it's for large-scale procurement by electronic equipment manufacturers or individual users' own replacements, the safety indicators of the product should be given due attention - good thermal conductive silicone not only ensures effective heat dissipation but also avoids health risks at the source, making the use of equipment more reassuring.

Invisible "radiator" of electronic equipment: magical application of heat conduction pad   The common problems, such as the sudden jamming of the mobile phone when playing games, the fan spinning wildly when the laptop is running software, and the disconnection of the router after working for a long time, mostly stem from the "fever crisis" of electronic equipment. Electronic components will continue to generate heat when working. If the heat cannot be discharged in time, it will not only reduce the performance of the equipment, but also shorten the service life and even cause safety hazards. In many heat dissipation schemes, the seemingly inconspicuous thermal pad is the key role to solve this problem. What is a thermal pad? Thermal pad is a kind of polymer composite material with silica gel as the core substrate and mixed with high thermal conductivity fillers such as metal oxides (such as alumina) and carbon materials (such as graphene). It is soft in texture, can be cut at will, and can be attached to the surface according to the shape of electronic components. It is not as hard and rigid as a metal heat sink, and it does not need complicated application of liquid thermal paste.   It seems that the electronic components are closely attached to the radiator, but there is actually a tiny gap, and the air in the gap has extremely poor thermal conductivity (only one thousandth of that of metal), which will form a "thermal barrier". The core function of the thermal pad is to fill these gaps, remove air, minimize the thermal resistance, and let the heat generated by the components be quickly transferred to the radiator, and then discharged through fans, cooling holes and other means to achieve efficient heat transfer.   Specific application of thermal pad in different electronic components; (1) Computer field CPU and graphics card are the "big fever families" of computers, especially the high-performance graphics cards of game books or desktops, and the working temperature can soar above 80℃. Between these components and the heat dissipation module, the heat conduction pad can closely adhere to the uneven surface, and cooperate with the heat pipe to quickly conduct away the heat, so as to avoid CPU frequency degradation due to overheating and graphics card jamming due to high temperature, and ensure the continuous high-performance operation of the equipment. ​   (2) Communication equipment Communication equipment such as base stations and routers need to work 24 hours a day, and internal signal processing chips and power modules will continue to generate heat. If the temperature is too high, the signal may be interrupted. The heat-conducting pad is installed between these heating elements and the equipment shell (or built-in heat sink), which can stably export heat without additional power supply and ensure the smooth and stable communication signal. ​   (3) Automotive electronics Battery management system (BMS) and on-board computer of new energy vehicles are extremely sensitive to temperature. Too high or too low temperature will affect battery life and driving safety. By virtue of its resistance to high and low temperature (-40℃~200℃), the thermal pad can fit the battery pack and the heat dissipation plate, adjust the temperature in real time, and be insulated and nonconductive, thus avoiding the risk of short circuit. ​   (4) Consumer electronic products Smart phones and tablets are too small to accommodate large heat sinks. Sticking thin thermal pads on the surfaces of processors, power amplifiers and other components can quickly transfer heat to the fuselage shell, reduce the phenomenon of "local burning", make users more comfortable to hold, and avoid the aging of components due to high temperature. ​   (5) LED lighting Although the LED lamp saves energy, the light source chip will still generate heat when it works. If the heat accumulates, it will lead to the dimming of the light and shorten the service life. The heat conducting pad is sandwiched between the LED light source and the heat dissipation substrate, which can efficiently conduct heat, keep the LED lamp stable in brightness, and prolong its service life by more than 30%. Compared with other heat dissipation materials, the thermal pad has outstanding advantages: first, it has strong insulation to avoid short circuit of components; Second, it has good flexibility and adapts to complex surfaces; Third, the installation is convenient, and it can be pasted after cutting without professional tools; Fourth, it is stable for a long time, not prone to aging and deformation, and can continue to play a heat dissipation role without frequent replacement. ​   When selecting, focus on three core indicators: First, thermal conductivity (unit: w/(MK)), the higher the value, the better the thermal conductivity, just choose 1-3 w/(MK) for ordinary equipment and 5 w/(MK) or above for high-performance equipment; Second, the thickness, according to the gap between the component and the radiator, is generally 0.5-5mm, too thick will increase the thermal resistance; The third is the working temperature range, which ensures the matching with the working environment of the equipment. For example, the automobile electronics needs to choose high and low temperature resistant models. ​   From daily mobile phones and computers to industrial communication base stations and automobile electronics, the thermal pad acts as an "invisible guardian" to ensure the stable operation of electronic equipment. With the development of technologies such as 5G and new energy vehicles, the requirements for heat dissipation will be higher, and the future thermal pads will be upgraded in the direction of higher thermal conductivity, lighter and more environmentally friendly, which will continue to "cool down" the development of the electronics industry.