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Home > Products > Thermal Pad > TIF100-11S Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions
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TIF100-11S Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions
TIF100-11S Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions
TIF100-11S Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions
TIF100-11S Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions

TIF100-11S Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: UL and RoHs

Model Number: TIF100-11S

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

Get Best Price

Product Details

Product Description
Highlight:
Products Name:
Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions
Thermal Conductivity:
1.5W/mK
Density:
2.3 G/cm³
Keywords:
Thermal Interface Pad
Color:
Dark Gray
Hardness:
45/65 Shore 00
Dielectric Breakdown Voltage(V/mm）:
≥5500
Application:
Heat Dissipation Solutions
Sample:
Free
Products Name:
Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions
Thermal Conductivity:
1.5W/mK
Density:
2.3 G/cm³
Keywords:
Thermal Interface Pad
Color:
Dark Gray
Hardness:
45/65 Shore 00
Dielectric Breakdown Voltage(V/mm）:
≥5500
Application:
Heat Dissipation Solutions
Sample:
Free
TIF100-11S Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions

Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions

 

The TIF®100-11S series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

TIF100-11S Heat Sink Thermal Pad Silicone Thermal Interface Pad With 1.5W/MK Thermal Conductivity RoHS Compliant For Heat Dissipation Solutions 0
Features:


> Good thermal conductive: 1.5W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized


Applications:


> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

 

Typical Properties of TIF®100-11S Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.3 ASTM D792
Thickness Range(inch/mm)

0.010~0.020

0.25~0.50

0.030~0.200

0.75~5.00

 ASTM D374
Hardness (Shore 00) 65  45 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1Mhz 4.5 ASTM D150
Volume Resistivity(Ohm-cm) ＞1.0X1012  ASTM D257
Thermal Conductivity (W/m-K) 1.5 ASTM D5470
1.5 ISO22007
Fire rating V-0 UL 94 (E331100)
 
Product Specifications
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

Company Profile

 

Vietnam Ziitek Technology Company Limited is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Tags:

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CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Products

Thermal Pad

Thermal Grease

Phase Changing Materials

Thermal Insulation Materials

Thermal Graphite Sheet

Thermal Adhesive Tape

Thermal Conductive Silicone Glue

sales26@ziitek.com +86 181 5378 1280
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