25W/mK high-performance heat conduction! Ziitek TS-TIR700-25, unlocking a new solution for cooling high-heat flux devices

25W/mK high-performance heat conduction! Ziitek TS-TIR700-25, unlocking a new solution for cooling high-heat flux devices

Today, with 5G, high-performance chips, optoelectronics and wearable devices continuously evolving towards higher integration, greater power, and miniaturization, the accumulation of internal heat in devices has become the core bottleneck restricting performance, lifespan and stability. Traditional thermal conductive materials either have insufficient heat conduction or have high interface thermal resistance, making it difficult to meet the requirements of demanding scenarios. The TS-TIR^®700-25 series carbon fiber thermal pads launched by Ziitek Technology, with a stable thermal conductivity of 25W/mK, provide an efficient thermal management solution for high heat flux applications.

This gasket is made of a high thermal conductivity carbon fiber and high molecular silicone composite system. Through precise manufacturing techniques, it constructs a directional heat-conducting pathway, significantly reducing the interface thermal resistance and enabling rapid and uniform heat conduction. This effectively prevents local overheating at the source and significantly improves the heat dissipation efficiency and equipment reliability.

25W/mK high thermal conductivity, with maximum heat dissipation efficiency；

According to the ASTM D5470 standard test results, the thermal conductivity is stable at 25W/mK, far superior to conventional silicone gasket pads. It quickly discharges the heat from core heat sources such as chips and power devices, ensuring that the equipment operates at full capacity without overheating.

Low thermal resistance + low voltage compatibility, providing a more precise fit；

With extremely low interface thermal resistance, it can well fill microscopic gaps under low voltage, adapting to precision components and compact structures, without damaging the elements or increasing assembly stress. It is stable and reliable for long-term use.

Ultra-thin and flexible, suitable for various thickness scenarios；

The thickness ranges from 0.3 to 5.0mm. The standard thickness includes 0.3/0.5/1.0/1.5/2.0/2.5/3.0mm. It is lightweight, flexible, and can be die-cut for customization. It can easily adapt to narrow spaces and complex structures.

Wide temperature range and durability, safety and compliance；

Operating temperature: -40℃~200℃, flame retardant grade reaches UL94 V-0, complies with RoHS requirements. It maintains stable performance and ensures safety in both high and low temperature, as well as long-term operation environments.

Non-viscous and easy to assemble, non-insulated design；

The surface is non-sticky, making assembly and maintenance more convenient; non-insulated feature, suitable for professional thermal management scenarios with specific requirements for conductivity and heat conduction.

The application scenarios cover a wide range of high heat flux fields；

5G communication equipment: base stations, radio frequency units, small base stations, etc. - high-power components, stable heat dissipation ensures continuous signal transmission without interruption.

High-performance chips: CPU, GPU, AI acceleration cores and server cores, powerful temperature control, releasing computing power without frequency reduction.

Optoelectronic industry: Optical modules, laser devices, high-definition display drivers, suppressing temperature rise, extending the lifespan of optoelectronic components.

Wearable devices: Smart watches, VR/AR, health monitoring terminals, lightweight without a burdening feeling, long-lasting calmness and greater comfort.

General high-heat scenarios: Between chips and heat dissipation modules, power devices, industrial control and other high-density heat dissipation demand scenarios.

For electronic devices, heat dissipation is key to competitiveness. The Ziitek TS-TIR®700-25, with its 25W/mK high thermal conductivity, low thermal resistance, lightweight, flexible and robustness across a wide temperature range, has become the preferred thermal interface material in 5G, high-performance chips, optoelectronics, wearable devices and other fields, helping products maintain stable output under harsh conditions.

Whether it's the development of new products or the upgrade of existing solutions, this carbon fiber heat transfer gasket can help you bridge the "last mile" of heat dissipation with high cost-effectiveness and high compatibility, making the equipment cooler, more durable and more powerful.