Ziitek TIF900-15S: heat conduction and wave absorption in one, effectively solving EMI and heat dissipation problems.

Ziitek TIF^®️900-15S: heat conduction and wave absorption in one, effectively solving EMI and heat dissipation problems

With the continuous improvement of the integration and power density of 5G communication, automotive electronics, and industrial equipment, electromagnetic interference (EMI) and heat dissipation issues have become the key bottlenecks restricting the reliability of products. Ziitek has launched the TIF^®️900-15S series of flexible thermal conductive and absorbing materials, which integrate the thermal conduction path and absorbing function into a single material, providing engineers with an ideal solution that combines performance and space efficiency.

1. Product Positioning and Core Value

Dual Function Integration: TIF^®️900-15S has a thermal conductivity of 1.5 W/m·K and wide-band electromagnetic wave absorption capability, effectively replacing the combination of "thermal pads + absorbing foam", simplifying assembly processes and saving internal space.

Broad Applicable Frequency Range: Maintains stable absorbing performance in the frequency range of 100MHz to 10GHz, especially suitable for suppressing cavity resonance, eliminating surface standing waves, and reducing metal reflection interference.

High Flexibility and Adaptability: The material hardness is approximately 45(Shore 00), with excellent compressibility and deformation ability. It can closely adhere to uneven surfaces and act as a buffer during cover plate compression, avoiding damage to surrounding sensitive components.

2. Key Performance Parameters (Typical Values)

Thermal Conductivity: 1.5 W/m·K

Hardness: 45(Shore 00

Density: 3.9 g/cm³

Operating Temperature Range: -40°C to 200°C

Flame Retardant Grade: UL 94 V-0

Standard Thickness: 0.25mm to 5.00mm (increment of 0.25mm)

Standard Size: 305mm × 305mm

3. Main Application Scenarios

Data Communication and Telecommunication Equipment: Base station antennas, optical modules, RF front-end units

Automotive Electronics: Millimeter-wave radars, vehicle cameras, ECU control units

Consumer Electronics and Industrial Control: Drones, industrial motherboard, power conversion modules

Cavity Structure Equipment: Suitable for applications with cover plate gaps or internal cavity space, can fully fill to reduce electromagnetic leakage

4. Customization Options and Processability

Ziitek offers various additional treatments to meet different installation and process requirements:

Reinforcement Carrier: Optional glass fiber (FG) reinforcement to enhance tear resistance and installation strength.

Surface Treatment: Non-adhesive coating (NS1) or single-sided hardening coating (DC1), facilitating automated handling.

Pressure Sensitive Adhesive Treatment: Supports single-sided (A1) or double-sided (A2) pressure-sensitive adhesives, facilitating pre-fixation assembly.

Non-standard Customization: Can provide other thicknesses, sizes, and custom-shaped punches to match customer-specific structures.

5. Quality Assurance and Technical Support

Ziitek has a complete material testing system, and all products are verified for performance in accordance with ASTM and ISO standards. The company provides global on-site service support and can provide selection suggestions and simulation data references for specific customer application scenarios.

TIF^®️900-15S is a function-integrated material developed by Ziitek for the trend of high frequency and high power. It not only reduces the difficulty of balancing electromagnetic compatibility and thermal design, but also helps customers accelerate the product development cycle through its flexible customizability. If you need samples, technical specifications or customized solutions, please contact the Ziitek sales team or visit the official website.