TIE380-25 One Part Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue

TIE380-25 One Part Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue

Product Summary:

TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength.

TIE™380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

Feature

> Good thermal conductivity: 2.5W/mK

> Good maneuverability andadhesion performance

> Low shrinkage

> Low viscosity, easy-to-gas emissions

> Good solvent resistance, water resistance

> Longer working hours

> Excellent resistance to thermal shock

Application Features:TIE™380-25

Color:                                 Gray

Viscosity@25℃ :              140,000 cPs

Specific Gravity@25℃:   2.1 g/cc

Shelf life @25℃° :           10 Days

@0℃° :                             6 Months

(Storage methods and temperature will affect the shelf life)

Curing procedures:

Curing temperature Curing time

100℃°:     3 Hours

125℃ :     1.5 Hour

150℃:      20 Minutes

170℃:      5 Minutes

General package:

1kg/can

Company profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.