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TIF100-18-56E High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF100-18-56E

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

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PrHigh Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Padoducts Nam:
High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board
Materials:
Ceramic Filled Silicone Elastomer
Thickness Range:
0.020inch (0.5mmT)~0.200inch (5.0mm)
Hardness:
27 Shore 00
Color:
Gray
Thermal Conductivity:
1.8W/mK
Specific Gravity:
2.3g/cc
Flame Rating:
94-V0
Application:
CPU & Electronic Component Gap Filling
Keywords:
Heat Transfer Pads
PrHigh Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Padoducts Nam:
High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board
Materials:
Ceramic Filled Silicone Elastomer
Thickness Range:
0.020inch (0.5mmT)~0.200inch (5.0mm)
Hardness:
27 Shore 00
Color:
Gray
Thermal Conductivity:
1.8W/mK
Specific Gravity:
2.3g/cc
Flame Rating:
94-V0
Application:
CPU & Electronic Component Gap Filling
Keywords:
Heat Transfer Pads
TIF100-18-56E High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board

TIF100-18-56E High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board

 

Product descriptions

 

TlFTM100-18-56E  thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0.

 

Features

> Good thermal conductive 1.8W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts

 

 

Application

> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

 

Typical Properties of  TIFTM100-18-56E Series
Property Value Test method
Color Green *****
Construction &Compostion Ceramic filled silicone elastomer *****
Specific Gravity 2.3g/cc ASTM D297
Thickness range 0.020inch (0.5mmT)~0.200inch (5.0mm) ASTM D374
Hardness 27 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ *****
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 3.7 MHz ASTM D150
Volume Resistivity 4.0X1013Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Outgassing(TML) 0.55% ASTM E595
Thermal conductivity 1.8W/m-K ASTM D5470

 

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

 

Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

TIF100-18-56E High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

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