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TIG680-40AB 4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation

Name: TIG680-40AB 4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation
Brand: CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
SKU: TIG680-40AB
Price: 4.10 USD
Availability: InStock

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: UL and RoHs

Model Number: TIG680-40AB

Payment & Shipping Terms

Minimum Order Quantity: 10KG

Price: 0.1-10 USD/kg

Packaging Details: 1kg/can

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 10000KG/month

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Product Details

Product Description

Highlight:

Products Name:	TIG680-40AB 4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation	Material:	Silicone Adhesive
Density（g/cm³）:	3.15	Thermal Conductivity:	4.0W/mk
Color:	Gray	Hardness:	25（Shore A）
Keywords:	Thermal Conducting Potting Compound	Application:	Electronic Industry Heat Dissipation

Products Name:	TIG680-40AB 4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation
Material:	Silicone Adhesive
Density（g/cm³）:	3.15
Thermal Conductivity:	4.0W/mk
Color:	Gray
Hardness:	25（Shore A）
Keywords:	Thermal Conducting Potting Compound
Application:	Electronic Industry Heat Dissipation

TIG680-40AB 4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation

TIG^®680-40AB 4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation

TIG^®680-40AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials. The low viscosity characteristic enables the thermal conductive sealant to cover the surface more comprehensively, greatly improving the heat transfer efficiency of the heating element or the entire printed circuit board to the metal shell or heat dissipation plate,thereby improving the performance and service life of electronic components.

Feature

> Good thermal conductivity: 2.0W/mK
> Good insulation performance
> Good elasticity
> Lower shrinkage
> Low viscosity,easy gas emissions
> Good solvent resistance and waterproof performance
> Longer working hours
> Excellent high and low temperature resistance
> No odor release during the curing process

Application

> Industrial control,transfomer,coil, amplifier, high voltage package,relay, high current junction box,etc
> Heat sink assembly, thermal sensor potting,thermal conductive product potting
> Heat conduction between the battery cell and the cold tube
> LED and power drive potting

Typical Properties of TIG^®680-40AB Series
Material Properties (Before Curing)
Property	Numerical	Test Method
Color/Part A	White	Visual
Color/Part B	Gray	Visual
Part A Viscosity (mPa.s)	16000	GB/T 10247
Part B Viscosity (mPa.s)	23000	GB/T 10247
Mix Ratio	1:1	Ziitek Test Method
Shelf life	6 months(Unopened)	Ziitek Test Method
Cure Schedule
Pot Life @25℃	30~45 mins	Ziitek Test Method
Cure @70℃	20~30 mins	Ziitek Test Method
Cure Material Properties
Color	Gray	Visual
Hardness (Shore A)	25	ASTM D2240
Density (g/cm³)	3.15	ASTM D792
Recommended Operating temperature (℃)	-45 ~200	*****
Flame Rating	V-0	UL 94
Thermal Conductivity (W/mK)	4.0	ASTM D5470
Breakdown Voltage (V/mm)	≥10000	ASTM D149
Dielectric Constant @1MHz	6.0~8.0	ASTM D150
Volume Resistivity (Ohm·cm)	3.0x10¹³	ASTM D257

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

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