Z-PASTER100 6035-11 High Thermal Conductivity Non-Silicone Thermal Pad Silicone-Free Thermal Interface Material For AI Server

Good Performance Non Silicone Thermal Gap Pad For Automotive Electronics

Z-Paster^®100 6035-11 Series is a silicone-free thermal conductive material used to fill gaps between heat-generating components and heat sinks or metal bases.Thanks to its flexibility and elasticity, this material can conform to uneven surfaces. Its outstanding performance facilitates heat transfer from heat-generating components or the entire PCB to metal enclosures or heat sinks, thereby improving the efficiency and service life of heated electronic assemblies.

Features

> High thermal conductivity
> Silicone-free
> Available in different thickness options
> High compliance adapts to various pressure application environments

Application

> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps

Product Specifications

Standard Thickness: 0.030" (0.75 mm)～0.200" (5.00 mm) with increments of 0.010 (0.25 mm).
Standard Size: 16"×16" (406 mm×406 mm).

The Z-paster^® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Packaging Details & Lead time

The packaging of silicone free thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Q:What is Thermal Conductivity?
A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m·K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.

Q:What is Thermal Resistance?
A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.

Q:What is the difference between Thermal Conductivity and Thermal Resistance?
A: Thermal conductivity primarily reflects the intrinsic heat-conduction capability of a material, while thermal resistance is also affected by factors such as thermal conductivity, material thickness, contact area, and interface conditions. In practical applications, it is important to consider not only thermal conductivity but also the overall thermal resistance of the TIM layer.