The TIF^®800QU Series is an ultra-soft thermal interface material, specially designed to protect precision components extremely sensitive to mechanical stress.This product combines ultra-high thermal conductivity with extreme gel-like softness, adapting to various uneven heat dissipation interfaces, compensating for assembly tolerances, minimizing air thermal resistance, and efficiently dissipating heat while providing comprehensive protection for chips, sensors and optoelectronic devices.It is the preferred solution for heat dissipation and protection in precision electronics.

• Good thermal conductivity
• Super soft and highly compliant
• Good insulation performance
• Self adhesive without the need for additional surface adhesive

• Millimeter wave radar
• Semiconductor microwave components
• 5G base station
• RF power amplifier
• High performance computing / server memory
• Al Servers
• Semiconductor Packaging
• Low-Altitude Aircraft
• Optical Communication Products

Standard Thickness: 0.020" (0.50mm) – 0.200" (5.00 mm), with increments of 0.010" (0.25 mm).

Standard Size: 16" × 16" (406 mm × 406 mm).

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us

Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high-performance thermal products including:

• Thermal gap pad
• Thermal graphite sheet / film
• Thermal double-sided tape
• Thermal insulation pad
• Thermal grease
• Phase change material
• Thermal gel

All products are compliant with UL94 V-0, SGS, and RoHS standards.

• ISO 9001:2015
• ISO 14001:2004
• IATF 16949:2016
• IECQ QC 080000:2017
• UL

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