TIR700-35 High Thermal Conductive 35W/MK Carbon Based Thermal Pad For Aerospace And Satellite Electronic Equipment

High Thermal Conductive 35W/MK Carbon Based Thermal Pad For Aerospace And Satellite Electronic Equipment

Products description

TIR^®700-35 Series is a high-efficiency carbon fiber thermal pad that combines high thermal conductivity carbon fiber with polymer silicone material. Using advanced technology, the carbon fibers are vertically aligned to achieve excellent heat transfer performance, effectively reducing interface thermal resistance and improving cooling efficiency. It features an ultra-thin, lightweight design and mechanical flexibility, making it suitable for applications that require high heat dissipation while demanding good mechanical strength of the material.

Feature

• High thermal conductivity
• Excellent mechanical properties
• Outstanding weather stability
• Safe and reliable

Application

• CPUs for laptops and desktops
• Aerospace and satellite electronic equipment
• Thermal conduction between the cells inside the power battery pack and the heat dissipation plate and casing
• Variable-frequency drive, servo motors, and power modules
• Thermal conduction for automotive electronic components

Product Specification
 

• Standard Thickness: 0.012" (0.30 mm) – 0.200" (5.00 mm)
• Standard Size: 5" × 6" (127 mm × 152.4 mm)

The TIR^®700-35 series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

FAQ:

Q:What is a Thermal Interface Material (TIM)?
A:TIM (Thermal Interface Material) refers to a class of materials used to fill microscopic air gaps between a heat source and a heat sink. TIMs help reduce interface thermal resistance and improve heat transfer from the heat source to the cooling structure. Common TIMs include thermal pads, thermal gels, thermal greases, phase change materials (PCMs), and liquid metal.

Q:What is Thermal Conductivity?
A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m·K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.

Q:What is Thermal Resistance?
A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.

Q:What is the difference between Thermal Conductivity and Thermal Resistance?
A: Thermal conductivity primarily reflects the intrinsic heat-conduction capability of a material, while thermal resistance is also affected by factors such as thermal conductivity, material thickness, contact area, and interface conditions. In practical applications, it is important to consider not only thermal conductivity but also the overall thermal resistance of the TIM layer.