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TIF100-12-05US Premium Performance Thermal Pads 1.2W Laptop Silicone Thermal Pads

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: UL and RoHs

Model Number: TIF100-12-05US

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

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Products Name:
Premium Performance Thermal Pads 1.2W Laptop Silicone Thermal Pads
Thermal Conductivity:
1.2W/mK
Hardness:
60/20 Shore 00
Density:
2.0 G/cm³
Color:
Blue
Breakdown Voltage (V/mm):
≥5500
Application:
LED,CPU,Display Card,Automotive Electronics
Keywords:
Silicone Thermal Pad
Products Name:
Premium Performance Thermal Pads 1.2W Laptop Silicone Thermal Pads
Thermal Conductivity:
1.2W/mK
Hardness:
60/20 Shore 00
Density:
2.0 G/cm³
Color:
Blue
Breakdown Voltage (V/mm):
≥5500
Application:
LED,CPU,Display Card,Automotive Electronics
Keywords:
Silicone Thermal Pad
TIF100-12-05US Premium Performance Thermal Pads 1.2W Laptop Silicone Thermal Pads

TIF®100-12-05US Premium Performance Thermal Pads 1.2W Laptop Silicone Thermal Pads

 

The TIF®100-12-05US Series thermally conductive interface materials are gapfillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture-,tear-, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.

 

Features:


> Good thermal conductive: 1.2W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized


Applications:


> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp

 

Typical Properties of TIF®100-12-05US Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.2 W/m-K ASTM D5470
1.2 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF100-12-05US Premium Performance Thermal Pads 1.2W Laptop Silicone Thermal Pads 0
Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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