Highlight:
TIF800QE High Thermal Conductivity Gray Silicone Thermal Pad For Electronic Heat Dissipation
High Thermal Conductivity Gray Silicone Thermal Pad For Electronic Heat Dissipation
Product descriptions
The TIF®️800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It ofers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity,enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink.This significantly improves the heat dissipation eficiency of electronic lcomponents, thereby enhancing operational stability and extending device lifespan.
Features
> Good thermal conductive:13.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
Application
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
| Typical Properties of TIF®800QE Series |
| Property |
Value |
Test method |
| Color |
Gray |
Visual |
| Construction |
Ceramic filled silicone elastomer |
ZKTM J024 |
| Density(g/cm³) |
3.45 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.012~0.020 |
0.030~0.200 |
ASTM D374 |
| 0.30~0.50 |
0.75~5.00 |
| Hardness (Shore 00) |
40 |
35 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
ZKTM J025 |
| Breakdown Strength(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
7 |
ASTM D150 |
| Volume Resistivity(Ohm-meter) |
＞1.0X1012 |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity (W/m-K) |
13 |
ASTM D5470 |
Product Specifications
Standard Thickness: 0.012" (0.30mm) ~0.200" (5.0mm).
Standard Size: 16" X 16" (406mm X 406mm).
The TIF®️ series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Vietnam Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Your message must be between 20-3,000 characters!
