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TIF800QE Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU Computer Accessories
Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU Computer Accessories
Product descriptions
TIF®800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.
Features:
> Excellent thermal conductivity 13.0W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
| Typical Properties of TIF®800QE Series |
| Property |
Value |
Test method |
| Color |
Gray |
Visual |
| Construction |
Ceramic filled silicone elastomer |
ZKTM J024 |
| Density(g/cm³) |
3.45 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.012~0.020 |
0.030~0.200 |
ASTM D374 |
| 0.30~0.50 |
0.75~5.00 |
| Hardness (Shore 00) |
40 |
35 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
ZKTM J025 |
| Breakdown Strength(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
7.0 |
ASTM D150 |
| Volume Resistivity(Ohm-meter) |
＞1.0X1012 |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity (W/m-K) |
13 |
ASTM D5470 |
Product Specification
Standard Thickness: 0.012" (0.30mm) ~0.200" (5.00mm).
Standard Size: 16" X 16" (406mm X 406mm).
The TIF®️ series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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