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TIF100-30-15E Thermal Conductive Pad Designed To Fill Air Gaps And Provide Thermal Interface For Enhanced Heat Dissipation In Electronic Systems
Thermal Conductive Pad Designed To Fill Air Gaps And Provide Thermal Interface For Enhanced Heat Dissipation In Electronic Systems
Product descriptions
TIF®100-30-15E Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Features
> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> RoHS compliant
> UL recognized
Application
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Routers
> AI server
> Medical equipment
> Unmanned aerial vehicle(UAV)
> Robot
> Wireless Charger
| Typical Properties of TIF®100-30-15E Series |
| Property |
Value |
Test method |
| Color |
Purple |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.0 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020 |
0.030~0.200 |
ASTM D374 |
| 0.25~0.50 |
0.75~5.00 |
| Hardness (Shore 00) |
65 |
35 |
ASTM 2240 |
| Recommended Operating Temperature (℃) |
-40 to 200 |
****** |
| Breakdown Voltage (V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
7.5 |
ASTM D150 |
| Volume Resistivity (Ohm-meter) |
＞1.0X1012 |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
3.0W/m-K |
ASTM D5470 |
| 3.0W/m-K |
ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China / Vietnam
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Is a thinner Thermal Silicone Pad always better?
A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.
Q: What are the common thicknesses of Thermal Silicone Pads?
A: Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.
Q: Can Thermal Silicone Pads be customized in size?
A: Yes. Thermal silicone pads can be customized according to the customer's product structure, including length, width, thickness, and complex shapes. Die-cutting, punching, and other processing methods can also be used to produce customized parts.
Q: Can Thermal Silicone Pads have an adhesive backing?
A: Some thermal silicone pads can be supplied with single-sided or double-sided adhesive backing. The adhesive is mainly used to assist with material positioning and installation. The appropriate adhesive should be selected according to the operating temperature and application environment.
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