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TIF100-30-01UF Soft Silicone Thermal Pad Thermal Interface Material With High Compression Performance For Electronic Devices Cooling
Soft Silicone Thermal Pad Thermal Interface Material With High Compression Performance For Electronic Devices Cooling
Product descriptions
TIF®100-30-01UF Series is a structural support thermal pad, designed to provide high heat dissipation while also meeting structural support and durability requirements, can reliably fill interface gaps, transfer heat, and provide certain mechanical support for stacked components to resist compression deformation. This product is an ideal choice for application scenarios that require a balance between heat dissipation, insulation, and mechanical stability.
Features
>High thermal conductivity
>Good softness and filling property
>Self-adhesive without the need for additional surface adhesives
>Good insulation performance
Application
>Power tools
>Network communication products
>Electric vehicle batteries
>Computer CPU/GPU Cooling
>New energy vehicle power systems
| Typical Properties of TIF®100-30-01UF Series |
| Property |
Value |
Test method |
| Color |
Black |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
ZKTM J024 |
| Density(g/cm³) |
2.9 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020 |
0.030~0.200 |
ASTM D374 |
| 0.25~0.50 |
0.75~5.00 |
| Hardness (Shore 00) |
75 |
75 |
ASTM 2240 |
| Recommended Operating Temperature (℃) |
-40 to 200 |
ZKTM J025 |
| Breakdown Strength (V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
5.3 |
ASTM D150 |
| Volume Resistivity (Ohm-meter) |
＞1.0X1012 |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
3.0W/m-K |
ASTM D5470 |
| 3.0W/m-K |
ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China / Vietnam
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Is a thinner Thermal Silicone Pad always better?
A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.
Q: What are the common thicknesses of Thermal Silicone Pads?
A: Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.
Q: Can Thermal Silicone Pads be customized in size?
A: Yes. Thermal silicone pads can be customized according to the customer's product structure, including length, width, thickness, and complex shapes. Die-cutting, punching, and other processing methods can also be used to produce customized parts.
Q: Can Thermal Silicone Pads have an adhesive backing?
A: Some thermal silicone pads can be supplied with single-sided or double-sided adhesive backing. The adhesive is mainly used to assist with material positioning and installation. The appropriate adhesive should be selected according to the operating temperature and application environment.
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