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TIS812-11-03 Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

Name: TIS812-11-03 Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance
Brand: CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
SKU: TIS812-11-03
Price: 4.10 USD
Availability: InStock

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: UL and RoHs

Model Number: TIS812-11-03

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

Get Best Price

Product Details

Product Description

Highlight:

Products Name:	Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance	Application:	Car Battery & Electric
Keywords:	Thermal Conductive Insulator	Construction & Compostion:	Ceramic Filled Silicone Elastomer / Polyimide Film
Thermal Conductivity:	0.9W/mK	Continuous Use Temp:	-60~180℃
Density:	2.4g/cc	Color:	Gray
Thickness Range(inch/mm):	0.009/0.229

Products Name:	Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance
Application:	Car Battery & Electric
Keywords:	Thermal Conductive Insulator
Construction & Compostion:	Ceramic Filled Silicone Elastomer / Polyimide Film
Thermal Conductivity:	0.9W/mK
Continuous Use Temp:	-60~180℃
Density:	2.4g/cc
Color:	Gray
Thickness Range(inch/mm):	0.009/0.229

TIS812-11-03 Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

TIS812-11-03 Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

The TIS^®812-11-03 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding insulating silicone base material to the heat-conducting material.

Features:
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures

> Easy release construction
> Electrically isolating
> High durability

Applications:
> Car Battery & Power Supply

> Power semiconductors
> Audio and Video components

> Motor controllers

> Display card
> Mainboard/mother board
> Notebook

> Power supply
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIS^®812-11-03 Series
Property	Value	Test Method
Color	Yellow	Visual
Construction &Compostion	Ceramic filled silicone elastomer /Polyimide Film	******
Thickness range	0.012inch (0.305mm)	ASTM D374
Tensile Strength(MPa)	1.5	ASTM D412
Density	2.4 g/cc	ASTM D297
Continuos Use Temp	-60 to 180℃	******
Breakdown Voltage(V/mm)	5000	ASTM D149
Dielectric Constant @ 1MHz	5.0	ASTM D150
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257
Fire rating	94 V0	UL(E331100)
Thermal conductivity	1.1W/m-K	ASTM D5470
Thermal impedance(℃-in²/W)@30psi	0.61	ASTM D5470

Standard Thicknesses

0.012inch (0.305mm)

Standard Sizes
12" x 160"(304mm x 48.76M)

The TlS series can be die-cut into different shapes and provided. lf you need different thicknesses, please contact our company.

TIS812-11-03 Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance 0

Packaging Details & Lead time

The packaging of Thermal Insulation Materials

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Independent R&D team

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