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TIF100-20-18S Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF100-20-18S

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

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PrHigh Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Padoducts Nam:
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb
Thermal Conductivity:
2.0W/mK
Materials:
Ceramic Filled Silicone Elastomer
Hardness:
65/45 Shore 00
Keywords:
Thermal Gap Filler Pad
Application:
Pcb,LED, CPU & Electronic Component Gap Filling
Thickness Range:
0.020inch (0.5mmT)~0.200inch (5.0mm)
Color:
Green
Density:
2.5g/cm³
Flame Rating:
94-V0
PrHigh Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Padoducts Nam:
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb
Thermal Conductivity:
2.0W/mK
Materials:
Ceramic Filled Silicone Elastomer
Hardness:
65/45 Shore 00
Keywords:
Thermal Gap Filler Pad
Application:
Pcb,LED, CPU & Electronic Component Gap Filling
Thickness Range:
0.020inch (0.5mmT)~0.200inch (5.0mm)
Color:
Green
Density:
2.5g/cm³
Flame Rating:
94-V0
TIF100-20-18S Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb

Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb

 

Product descriptions

 

TlF®100-20-18S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

 

Features

 

> Good thermal conductive 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> UL recognized
> Easy release construction
> Electrically isolating
> High durability

 

Application

 

> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

 

Typical Properties of TIF®100-20-18S Series
Property Value Test method
Color Green Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.5 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
0.25~0.50 0.75~5.00
Hardness (Shore 00) 65 45 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200 ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.7 ASTM D150
Volume Resistivity (Ohm-meter) >1.0X1012 ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 2.0W/m-K ASTM D5470
2.0W/m-K ISO22007

 

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF100-20-18S Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

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