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Home > Products > Thermal Pad > TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery

TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF500-40-11US

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

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Highlight:
Products Name:
4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery
Materials:
Ceramic Filled Silicone Elastomer
Keywords:
Silicone Thermal Pad
Thermal Conductivity:
4.0W/mK
Specific Gravity:
3.2g/cc
Sample:
Sample Free
Flame Rating:
94-V0
Hardness:
20 Shore 00
Color:
Gray
Application:
CPU GPU EV Battery
Products Name:
4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery
Materials:
Ceramic Filled Silicone Elastomer
Keywords:
Silicone Thermal Pad
Thermal Conductivity:
4.0W/mK
Specific Gravity:
3.2g/cc
Sample:
Sample Free
Flame Rating:
94-V0
Hardness:
20 Shore 00
Color:
Gray
Application:
CPU GPU EV Battery
TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery

TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery

 

 Product descriptions

 

TIF®500-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Features


> Excellent thermal conductivity: 4.0W/mK
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts

 

Applications


> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure

 

Typical Properties of TIF®500-40-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 4.0 W/m-K ASTM D5470
3.2W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010" to 0.200" (0.25 to 5.00 mm) with increments of 0.01 (0.25 mm).

Standard Size: 16"X16"(203 mm×406 mm).


Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


TheTIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

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