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TIF700PES Thermal Silicone Pad 7.5W, High Conductivity Heat Dissipation Sheet For AI Server
TIF700M Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors
The TIF®700PES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines excellent thermal conductivity with a near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure,completely eliminating air thermal resistance,and providing superior thermal solutions and physical protection for the most precise and highest heat flux electronic components.
Features:
> High thermal conductivity:7.5W/mK
> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> High insulation performance
Applications
> AI Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
| Typical Properties of TIF®700PES Series |
| Property |
Value |
Test method |
| Color |
Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.4 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.020~0.030
(0.50~0.75)
|
0.040~0.200 (1.0~5.0) |
ASTM D374 |
| Hardness |
70 Shore 00 |
10 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
*** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
7.6 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
7.5 W/m-K |
ASTM D5470 |
| 7.5 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness: 0.020"(0.5 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
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