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TIF500-75-11US Good Insulation Performance 7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors
TIF500-75-11US Good Insulation Performance 7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors
Product descriptions
The TIF®500-75-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Features
> Excellent thermal conductivity 7.5W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications
> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
| Typical Properties of TIF®500-75-11US Series |
| Property |
Value |
Test method |
| Color |
Dark Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.45 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.020~0.030 |
0.040~0.200 |
ASTM D374 |
| (0.50~0.75) |
(1.00~5.00) |
| Hardness |
50 Shore 00 |
20 Shore 00 |
ASTM 2240 |
| Continuos Use Temp |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
8.0 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Thermal conductivity(w/m-K) |
7.5 |
ASTM D5470 |
| 7.5 |
ISO22007 |
| Fire rating |
V-0 |
UL94 (E331100) |
Product Specifications:
Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
TheTIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
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This message should include any questions you might have about the products as well as your purchase requests.
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4. We will reply you as soon as possible with Email or online
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
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