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TIF200-10-02ES Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation
TIF®200-10-02ES Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation
Product descriptions
The TIF®200-10-02ES Series is a compound thermal interface material that combines good thermal conductivity,reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength,effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation,such as power devices,new energy vehicles,and portable electronic devices.
Features
> Good thermal conductivity
> Extremely soft, low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Puncture-resistant, tear-resistant,and scratch-resistant performance
Applications
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
| Typical Properties of TIF®200-10-02ES Series |
| Property |
Value |
Test method |
| Color |
Pink/White |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
2.8 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020 |
0.030~0.200 |
ASTM D374 |
| (0.25~0.50) |
(0.75~5.00) |
| Hardness |
10 Shore 00 |
10 Shore 00 |
ASTM 2240 |
| Continuos Use Temp |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥ 5500 |
ASTM D149 |
| Dielectric Constant |
5.0 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Thermal Conductivity (W/m-K) |
1.0 |
ASTM D5470 |
| 1.0 |
ISO22007 |
| Fire rating |
V-0 |
UL 94 (E331100) |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us.
4. We will reply you as soon as possible with Email or online.
FAQ:
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
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