TIR26000-120 High Performance Graphene Thermal Pad For Consumer Electronics

TIR^®26000-120 Series is centered around a thermally conductive filler which, through precise process control, forms a continuous arrangement within the polymer matrix. This establishes an efficient heat transfer pathway and significantly enhances thermal conductivity. This structural characteristic enables the material to meet the demanding cooling requirements of high power density scenarios such as base stations and chips. Additionally, the gasket possesses low density and excellent resistance to compression deformation, making it suitable for assembly in confined spaces while contributing to improved process efficiency and long-term reliability.

• Low thermal resistance
• Low-permeability oil
• Stable and reliable thermal performance
• Low density

• Consumer Electronics
• Communication equipment
• Power devices
• Data Center

1. Store in a cool and dark place.
2. Storage temperature: ≤ 35 °C; Storage humidity: ≤ 75%.
3. The stacking height should not exceed 7 layers, and the total height should not exceed 1 meter.

1. Please confirm that the product is in good condition before use.
2. To clean, wipe with a regular or alcohol-based wet wipe.
3. This product is conductive. Do not use as an electrical insulation material.

TIR® series can provide different thickness and size specifications. For more information on thermal conductive materials, please contact our company.