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TIF100-18-56U Ultra-soft thermal pad

Name: TIF100-18-56U Ultra-soft thermal pad
Brand: CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
SKU: TIF100-18-56U
Price: 4.10 USD
Availability: InStock

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: UL and RoHs

Model Number: TIF100-18-56U

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

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Product Details

Product Description

Highlight:

Products Name:	Ultra-soft Thermal Pad	Thermal Conductivity:	1.8W/mK
Density:	2.3g/cm³	Keywords:	Thermal Pad
Color:	Green	Hardness:	27 Shore 00
Dielectric Breakdown Voltage:	>5500VAC	Application:	CPU & GPU

Products Name:	Ultra-soft Thermal Pad
Thermal Conductivity:	1.8W/mK
Density:	2.3g/cm³
Keywords:	Thermal Pad
Color:	Green
Hardness:	27 Shore 00
Dielectric Breakdown Voltage:	>5500VAC
Application:	CPU & GPU

TIF100-18-56U Ultra-soft thermal pad

TIF100-18-56U Ultra-soft thermal pad

The TIF™100-18-56U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

TIF100-18-56U Ultra-soft thermal pad 0

Features:

> Good thermal conductive: 1.8W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized

Applications:

> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIF100-18-56U Series
Property	Value	Test method
Color	Green	Visual
Construction & Compostion	Ceramic filled silicone elastomer	******
Density	2.3g/cm³	ASTM D297
Thickness range	0.020"(0.5mm)~0.200"(5.0mm)	******
Hardness	27 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 160℃	***
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	3.7 MHz	ASTM D150
Volume Resistivity(Ohm-cm)	4.0X10¹³	ASTM D257
Fire rating	94 V0	UL E331100
Thermal conductivity	1.8W/m-K	ASTM D5470
Outgassing(TML)	0.55%	ASTM E595

Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

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