Highlight:
Products Name: |
Low Melting Point Thermal Interface Materials Thermal Phase Changing Material |
Keywords: |
Thermal Phase Changing Material |
Phase Change Softening Temperature: |
50℃~60℃ |
Feature: |
Nuturally Tacky At Room Temperature,no Adhesive Required |
Thickness: |
±0.005"(0.126mm） |
Applicatoin: |
Netbook And Desktop PCs,Memory Modules |
Thermal Conductivity: |
0.95W/mK |
Density: |
2.2g/cc |
TIC800P Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
TIC800P Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
The TIC™800P series is low melting point thermal interface material. At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.
TIC™800P series is a flexible solid at room temperature and free standing without reinforcing components that reduce thermal performance.
TIC™800P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration(pump out)at operating temperatures.
Features
> 0.021℃-in²/W thermal resisitance
> Naturally tacky at room temperature,no adhesive required
> No heat sink preheating required
Applications
> Automotive electronics
> Set top boxes
> Set top boxes
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
| Typical Properties of TIC™800P series |
| Product Name |
TIC™805P |
TIC™806P |
TIC™810P |
Test Method |
| Color |
Pink |
Visual |
| Thickness |
0.005"/0.126mm |
0.008"/0.203mm |
0.010"/0.245mm |
****** |
| Thickness Tolerance |
±0.0008"/±0.019mm |
±0.0008"/±0.019mm |
±0.0012"/±0.030mm |
****** |
| Specific Gravity |
2.2 g/cc |
Helium Pycnometer |
| Temperature range |
-25 to 125℃ |
****** |
| Phase Change Softening Temperature |
50℃-60℃ |
****** |
| Thermal conductivity |
0.95W/mK |
ASTM D5470 |
| Thermal Impedance@50psi |
0.24℃-in²/W 0.15℃-cm²W |
0.053℃-in²/W 0.34℃-cm²W |
0.080℃-in²/W 0.52℃-cm²W |
ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm) ,0.008"(0.203mm), 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
12" x 16"(304.8mm x 406mm) , 12"x400(304.8mm x 121.92m)
TIC800P series are supplied with a white release paper and a bottom liner.
TIC800P series is available inkiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC800P series products.
Reinforcement:
No reinforcement is necessary.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
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