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TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
Products description
TIC®800G Series is a thermally conductive phase change material with high reliability and high thermal conductivity. It is solid at room temperature, facilitating operation and installation.When it reaches a specific phase transition temperature,the material softens and becomes semi-fluid, fully filling the microscopic gaps between the heat-generating interface and the heat sink, significantly reducing the contact thermal resistance and achieving good heat transfer efficiency. This material can solve the heat dissipation problem of medium and high power density electronic devices under transient or steady-state operation.
Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment
Applications
> Power conversion equipment
> Power supply and vehicle storage battery
> Large communication switch hardware
> LED TV, Lighting
> Laptop computer
| Typical Properties of TIC®800G Series |
| Product Name |
TIC®804G |
TIC®805G |
TIC®806G |
TIC®808G |
TIC®810G |
TIC®812G |
Test Method |
| Color |
Gray |
Visual |
| Thickness |
0.004" |
0.005" |
0.006" |
0.008" |
0.010" |
0.012" |
ASTM D374 |
| 0.10mm |
0.13mm |
0.15mm |
0.20mm |
0.25mm |
0.30mm |
| Density (g/cm³) |
2.3 |
ASTM D792 |
| Recommended Operating Temperature (℃) |
-40～125 |
ZKTM J025 |
| Phase Change Softening Temperature(℃) |
50~60 |
ZKTM J025 |
| Thermal Conductivity (W/m·K) |
5.0 |
ASTM D5470 /ISO22007 |
| Thermal Impedance (℃-cm²/W) @50 psi |
0.028 |
0.031 |
0.032 |
0.049 |
0.064 |
0.078 |
ASTM D5470 |
| Flame Rating |
V-0 |
Equivalent to UL94 |
Standard Thickness:
0.004"(0.10mm), 0.005"(0.13 mm),
0.006"(0.15mm), 0.008"(0.20mm),
0.010"(0.25mm), 0.012" (0.30mm)
Standard size: 11.811"× 19.685"(300 mm x 500 mm),
Pressure-sensitive Adhesive: Not applicable to TIC®️ series products.
The TIC®️ series can be die-cut into different shapes.
If you need different thicknesses and specifications or would like to learn more about thermal conductive materials,please contact our company.
Company Profile
Ziitek was founded in 2006 as a high-tech enterprise, specializing in the research and development, manufacturing, and solution development of thermal conductive, heating, sealing, and EMI materials.
✅ Production Capacity Layout: Headquarter in Dongguan, Guangdong Province, production bases in Kunshan, Jiangsu Province, Taiwan, Vietnam. Global layout ensures rapid delivery.
✅ Application Fields: New energy vehicles, energy storage, high-performance chips, laptops, security, AI automation, 5G communication, aerospace.
✅ Core Products: TIF thermal conductive pads series, Z-Paster non-silicon thermal conductive pads series, TIG thermal paste, TIC phase change thermal material, TIS thermal insulating material, TIA thermal double-sided adhesive, TIR high thermal conductivity conductive material, TIF900 series EMI materials, K-heat heating products (PI heating film, silicone heating sheet, PTC heater), Z-foam foaming silicone sealing parts, TCP thermal engineering plastics.
✅ Quality Certification: IATF16949, ISO9001, ISO14001, QC080000; products comply with RoHS, REACH, UL.Ziitek gathers professional R&D engineers and implements a joint development model, deeply participating in the early design of customer products. We empower customers with technological innovation and are committed to becoming a trusted material strategic partner for global customers.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: What is a Phase Change Thermal Interface Material?
A: A phase change material (PCM) undergoes a physical phase transition when it reaches a specific temperature. This phase change helps improve the interface contact between the heat source and heat sink, enhancing heat transfer performance.
Q: What are the main advantages of PCM?
A: PCM can soften or undergo a phase transition within a specific temperature range, allowing it to conform more closely to the mating surfaces, improve interface contact, and reduce interface thermal resistance.
Q: What applications are suitable for PCM?
A: PCM is commonly used in CPUs, GPUs, power electronics, telecommunications equipment, and other applications requiring low interface thermal resistance and reliable thermal transfer.
Q: What is the difference between PCM and thermal silicone pads?
A: Thermal pads generally maintain a relatively stable solid form during operation, while PCM is designed to soften or undergo a phase transition at a specific temperature, allowing it to conform more closely to the heat source and heat sink surfaces.
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