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TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
TIC®800G Series is a high-performance, cost-effective thermal interface material featuringa unique grain-oriented structure that enables precise conformity to device surfaces,thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°℃, the material softens and undergoes phase change,effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface,significantly improving heat dissipation performance.
Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment
Applications
> Power conversion equipment
> Power supply and vehicle storage battery
> Large communication switch hardware
> LED TV, Lighting
> Laptop computer
| Typical Properties of TIC®800G Series |
| Product Name |
TIC®805G |
TIC®806G |
TIC®808G |
TIC®810G |
TIC®812G |
Test Method |
| Color |
Gray |
Visual |
| Thickness |
0.005" |
0.006" |
0.008" |
0.010" |
0.012" |
ASTM D374 |
| (0.127mm) |
(0152mm) |
(0.203mm) |
(0.254mm) |
(0.305mm) |
| Density |
2.6g/cc |
ASTM D792 |
| Recommended Operating Temperature (℃) |
-40℃～125℃ |
Ziitek Test Method |
| Phase Change Softening Temperature(℃) |
50℃~60℃ |
Ziitek Test Method |
| Thermal Conductivity |
5.0 W/mK |
ASTM D5470 |
| Thermal Impedance(℃-cm²/W) @50 psi |
0.014 |
0.018 |
0.02 |
0.024 |
0.028 |
ASTM D5470 |
Standard Thickness:
0.005"(0.127 mm),0.006"(0.152 mm), 0.008"(0.203 mm),0.010"(0.254 mm),0.012" (0.305 mm)
For other thickness options, please contact us.
Standard size: 10”× 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC®800G series is supplied with a white release liner and backing pad.
Die-cutting with half-cut processing can include pull tabs.custom-shaped samples are also available.
Pressure-Sensitive Adhesive. lt is not applicable to TIC®800G series products.
Reinforcement Material: No reinforcement materialrequired.
Company Profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
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