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TIC800G Phase Changing Materials Providing Thermal Interface Solutions With Excellent Heat Transfer In Energy Storage And Industrial
Phase Changing Materials Providing Thermal Interface Solutions With Excellent Heat Transfer In Energy Storage And Industrial
Products description
TIC®800G Series is a thermally conductive phase change material with high reliability and high thermal conductivity. It is solid at room temperature, facilitating operation and installation.When it reaches a specific phase transition temperature,the material softens and becomes semi-fluid, fully filling the microscopic gaps between the heat-generating interface and the heat sink, significantly reducing the contact thermal resistance and achieving good heat transfer efficiency. This material can solve the heat dissipation problem of medium and high power density electronic devices under transient or steady-state operation.
Features
> High thermal conductivity
> Soft surface
> Low thermal resistance
> Self-adhesive,no additional adhesive required
Applications
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
| Typical Properties of TIC®800G Series |
| Product Name |
TIC®804G |
TIC®805G |
TIC®806G |
TIC®808G |
TIC®810G |
TIC®812G |
Test Method |
| Color |
Gray |
Visual |
| Thickness |
0.004" |
0.005" |
0.006" |
0.008" |
0.010" |
0.012" |
ASTM D374 |
| 0.10mm |
0.13mm |
0.15mm |
0.20mm |
0.25mm |
0.30mm |
| Density (g/cm³) |
2.3 |
ASTM D792 |
| Recommended Operating Temperature (℃) |
-40～125 |
ZKTM J025 |
| Phase Change Softening Temperature(℃) |
50~60 |
ZKTM J025 |
| Thermal Conductivity (W/m·K) |
5.0 |
ASTM D5470 /ISO22007 |
| Thermal Impedance (℃-cm²/W) @50 psi |
0.028 |
0.031 |
0.032 |
0.049 |
0.064 |
0.078 |
ASTM D5470 |
| Flame Rating |
V-0 |
Equivalent to UL94 |
Standard Thickness:
0.004"(0.10mm), 0.005"(0.13 mm),
0.006"(0.15mm), 0.008"(0.20mm),
0.010"(0.25mm), 0.012" (0.30mm)
Standard size: 11.811"× 19.685"(300 mm x 500 mm),
Pressure-sensitive Adhesive: Not applicable to TIC®️ series products.
The TIC®️ series can be die-cut into different shapes.
If you need different thicknesses and specifications or would like to learn more about thermal conductive materials,please contact our company.
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: What is a Phase Change Thermal Interface Material?
A: A phase change material (PCM) undergoes a physical phase transition when it reaches a specific temperature. This phase change helps improve the interface contact between the heat source and heat sink, enhancing heat transfer performance.
Q: What are the main advantages of PCM?
A: PCM can soften or undergo a phase transition within a specific temperature range, allowing it to conform more closely to the mating surfaces, improve interface contact, and reduce interface thermal resistance.
Q: What applications are suitable for PCM?
A: PCM is commonly used in CPUs, GPUs, power electronics, telecommunications equipment, and other applications requiring low interface thermal resistance and reliable thermal transfer.
Q: What is the difference between PCM and thermal silicone pads?
A: Thermal pads generally maintain a relatively stable solid form during operation, while PCM is designed to soften or undergo a phase transition at a specific temperature, allowing it to conform more closely to the heat source and heat sink surfaces.
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