TIC800R-SP Low Thermal Resistance Phase Change Thermal Paste For Server And Data Center Equipment

Low Thermal Resistance Phase Change Thermal Paste For Server And Data Center Equipment

Products description

TIC^®800R-SP is a paste like thermal phase change material that can undergo phase transition at operating temperature, fully filling_the micro voids at the contact interface, thereby significantly improving thermal conductivity eficiency. The material adopts a sturdy polymer phase change structure, exhibiting excellent wetting properties within a typical operating temperature range,and can form close contact with various substrate surfaces, achieving extremely low surface contact resistance. The product has undergone rigorous long-term reliability testing and can maintain stable thermal conductivity and physical properties under high temperature, high humidity, temperature_cycling and other working_conditions, fully meeting the strict requirements of high-performance electronic devices for long-term stability.

Features

>Excellent thermal conductivity
>Excellent surface wettability
>Outstanding operability and repairability
>Low thermal resistance
>No need for heating and curing,suitable for automated dispensing processes

Applications

>Automotive Electronics and New Energy Electronic Control System
>IT/Enterprise
>Power Semiconductor Devices and Modules
>Consumer Electronics
>Server and data center equipment

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Q:What is a Thermal Interface Material (TIM)?
A:TIM (Thermal Interface Material) refers to a class of materials used to fill microscopic air gaps between a heat source and a heat sink. TIMs help reduce interface thermal resistance and improve heat transfer from the heat source to the cooling structure. Common TIMs include thermal pads, thermal gels, thermal greases, phase change materials (PCMs), and liquid metal.

Q:What is Thermal Conductivity?
A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m·K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.

Q:What is Thermal Resistance?
A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.