TIC800R-SP Low Thermal Resistance Phase Change Thermal Paste For Server And Data Center Equipment

Low Thermal Resistance Phase Change Thermal Paste For Server And Data Center Equipment

Products description

TIC^®800R-SP is a paste like thermal phase change material that can undergo phase transition at operating temperature, fully filling_the micro voids at the contact interface, thereby significantly improving thermal conductivity eficiency. The material adopts a sturdy polymer phase change structure, exhibiting excellent wetting properties within a typical operating temperature range,and can form close contact with various substrate surfaces, achieving extremely low surface contact resistance. The product has undergone rigorous long-term reliability testing and can maintain stable thermal conductivity and physical properties under high temperature, high humidity, temperature_cycling and other working_conditions, fully meeting the strict requirements of high-performance electronic devices for long-term stability.

Features

>Excellent thermal conductivity
>Excellent surface wettability
>Outstanding operability and repairability
>Low thermal resistance
>No need for heating and curing,suitable for automated dispensing processes

Applications

>Automotive Electronics and New Energy Electronic Control System
>IT/Enterprise
>Power Semiconductor Devices and Modules
>Consumer Electronics
>Server and data center equipment

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.