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TIC800M High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

Name: TIC800M High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
Brand: CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
SKU: TS-Ziitek-Sharp Metal X01
Price: 4.10 USD
Availability: InStock

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: UL & RoHS

Model Number: TS-Ziitek-Sharp Metal X01

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-6 work days

Payment Terms: T/T

Supply Ability: 1000000 pcs/month

Get Best Price

Product Details

Product Description

Highlight:

Products Name:	X01 High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets	Keywords:	Metal Phase Changing Materials
Density:	8.0g/cm³	Applicatoin:	Microprocessors Chipsets
Thermal Conductivity:	18.9W/mK	Feature:	Good Thermal Conductive
Phase Change Softening Temperature:	40℃~250℃	Composition:	Alloy
Products Name:	High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets	Keywords:	Metal Phase Changing Materials
Density:	8.0g/cm³	Applicatoin:	Microprocessors Chipsets
Thermal Conductivity:	18.9W/mK	Feature:	Excellent Thermal Conductive
Phase Change Softening Temperature:	40℃~250℃	Construction & Composition:	Bissmuth Alloy
Products Name:	High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets	Keywords:	Metal Phase Changing Materials
Density:	8.0g/cm³	Applicatoin:	Microprocessors Chipsets
Thermal Conductivity:	18.9W/mK	Feature:	Excellent Thermal Conductive
Phase Change Softening Temperature:	40℃~250℃	Construction & Composition:	Bissmuth Alloy

Products Name:	X01 High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
Keywords:	Metal Phase Changing Materials
Density:	8.0g/cm³
Applicatoin:	Microprocessors Chipsets
Thermal Conductivity:	18.9W/mK
Feature:	Good Thermal Conductive
Phase Change Softening Temperature:	40℃~250℃
Composition:	Alloy
Products Name:	High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
Keywords:	Metal Phase Changing Materials
Density:	8.0g/cm³
Applicatoin:	Microprocessors Chipsets
Thermal Conductivity:	18.9W/mK
Feature:	Excellent Thermal Conductive
Phase Change Softening Temperature:	40℃~250℃
Construction & Composition:	Bissmuth Alloy
Products Name:	High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets
Keywords:	Metal Phase Changing Materials
Density:	8.0g/cm³
Applicatoin:	Microprocessors Chipsets
Thermal Conductivity:	18.9W/mK
Feature:	Excellent Thermal Conductive
Phase Change Softening Temperature:	40℃~250℃
Construction & Composition:	Bissmuth Alloy

TIC800M High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets

TIC^®800M is a new type of phase change thermal conductivity product made by mixing multiple metals, designed specifically to solve heat dissipation problems and improve application reliability. This material has high thermal conductivity,is not easy to evaporate,is safe and non-toxic, and has stable physical and chemical properties. When the temperature is higher than its phase transition temperature, the material will soften and undergo phase transition, which can tightly fill the small irregular contact surfaces on the device surface, forming a low contact thermal resistance thermal interface, thereby achieving excellent heat dissipation effect.

Features

> Excellent thermal conductivity
> Non toxic, environmentally friendly, and safe, meeting RoHS requirements
> Excellent long-term stability
> Thoroughly fill the contact surface to create low thermal resistance
> Not easily volatile

Applications

> Microprocessors
> Chipsets
> Graphic processing chips
> Set Top Box
> LED TV and LED lighting fixtures

Typical Properties of TIC^®800M Series
Property	Value	Test Method
Color	Silvery white	Visual
Form	Flaky solid	Visual
Construction & Composition	Bismuth Alloy	****
Density (g/cm³)	8.0	ASTM D792
Thermal conductivity(W/mK)	18.9	ISO22007
Specific heat capacity(J/g℃)	0.24	ASTM E1269
Resistivity (Ω-m)	＜10^-4	ASTM D257
Continuous Use Temp(℃)	-40 to 250℃	*****
Phase Change Temperature Range(℃)	>60	ASTM D3418
Solidification Range(℃)	＜57	ASTM D3418

Packaing:

TIC^®800M can be packaged according to customer requirements.

Usage Instructions:
After using this material, it is recommended to use suitable foam or gaskets to enclose the edges of the phase change metal,
ensuring that the material does not disperse or spread.
For more information about thermal conductive materials, please contact our company.

TIC800M High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets 0

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Tags:

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