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TIS100-16-02 Electrically Insulating Thermal Sheet For Power Supply

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: UL and RoHs

Model Number: TIS100-16-02

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

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Highlight:
Products Name:
Electrically Insulating Thermal Sheet For Power Supply
Thermal Conductivity:
1.6 W/mK
Color:
Pink
Construction & Compostion:
Ceramic Filled Silicone Elastomer / Fiberglass
Density:
1.8g/cm³
Recommended Operating Temperature (℃):
-40~200℃
Keywords:
Electrically Insulating Thermal Sheet
Application:
Car Battery & Power Supply
Products Name:
Electrically Insulating Thermal Sheet For Power Supply
Thermal Conductivity:
1.6 W/mK
Color:
Pink
Construction & Compostion:
Ceramic Filled Silicone Elastomer / Fiberglass
Density:
1.8g/cm³
Recommended Operating Temperature (℃):
-40~200℃
Keywords:
Electrically Insulating Thermal Sheet
Application:
Car Battery & Power Supply
TIS100-16-02 Electrically Insulating Thermal Sheet For Power Supply

Electrically Insulating Thermal Sheet For Power Supply

  

Products description

 

TIS®️100-16-02 Series is a thermally conductive and electrically insulating product. It achieves insulating and thermally conductive effects by adding insulating silicone-based materials into thermally conductive materials. Meanwhile, the fiberglass provides excellent tear resistance and puncture resistance. The product is non-toxic, environmentally friendly, and flame-retardant. It is mainly used to isolate power supplies from heat sinks, among other applications.

TIS100-16-02 Electrically Insulating Thermal Sheet For Power Supply

Features

 

> Highly thermal conductive 1.6W/mK

> High dielectric strength

> Low thermal resistance with high voltage isolation

> Easy release construction

> Resistant to teaars and punctures


Applications


> Car Battery & Power Supply

> Power semiconductors
> Audio and Video components

> Motor controllers

> Notebook
> Power supply
> Memory Modules
> Mass storage devices

Typical Properties TIS®️100-16-02 Series
Property Value Test Method
Color Pink Visual
Construction & Composition Ceramic filled silicone elastomer / Fiberglass ZKTM J024
Thickness range (inch/mm) 0.008/0.20 | 0.009/0.23 | 0.010/0.25 | 0.012/0.30 |0.018/0.45 ASTM D374
Hardness (Shore A) 80 ASTM D2240
Density (g/cm³) 1.8 ASTM D792
Tensile Strength (Mpa) 40 ASTM D412
Recommended Operating Temperature (℃) -40~200 ZKTM J025
Breakdown voltage (V) ≥3500 | ≥4000 | ≥5000 | ≥6000 | ≥8000 ASTM D149
Dielectric Constant @1MHz 5.5 ASTM D150
Volume Resistivity (Ohm*cm) >1.0x10¹² ASTM D257
Thermal Conductivity (W/m*K) 1.6 ASTM D5470
Thermal impedance (℃*in²/W) @25psi 1.13 | 1.15 | 1.46 | 1.47 | 2.70 ASTM D5470
Flame Rating V-0 UL94 (E331100)
Product Specifications
  • Standard Thickness: 0.008"(0.20 mm), 0.009"(0.23 mm), 0.010"(0.25 mm), 0.012"(0.30mm),0.018"(0.45 mm)
  • Standard Size: 12"×160" (304 mmX48.7 m)
  • The TIS®️ series is available in custom shapes and various forms
  • For other thicknesses or more information, please contact us

TIS100-16-02 Electrically Insulating Thermal Sheet For Power Supply

Packaging Details & Lead time

 

The packaging of Thermal Insulation Materials

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 
Company profile
 
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China / Vietnam

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q:What Is a Thermal Interface Material (TIM)?
A:Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.

 

Q:What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?

A:Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m·K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.

 

Q:What Is Thermal Resistance in Thermal Interface Materials?

A:Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.

 

Q:What Is the Difference Between Thermal Conductivity and Thermal Resistance?

A:Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area and interface conditions.

 

Q:Does Higher Thermal Conductivity Always Mean Better Cooling?

A:Not necessarily. Thickness, interface contact, compression and actual thermal resistance can signi

ficantly affect final cooling performance.

 

Q:Why Do AI Servers Need High-Performance Thermal Interface Materials?

A:AI GPUs, CPUs and Application Specific Integrated Circuits generate high power and heat flux, requiring efficient heat transfer to heat sinks or cold plates. High-performance TIMs help reduce interface thermal resistance.

 

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