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TIF200-30-50S Electrically Insulating Thermal Pad Silicone Thermal Pad Thermal Gap Filler Pad For Ev Battery
Electrically Insulating Thermal Pad Silicone Thermal Pad Thermal Gap Filler Pad For Ev Battery
Product descriptions
TIF®️200-30-50S Series is a compound thermal interface material that combines high thermal conductivity, reliable electrical insulation, and soft characteristics. This product not only provides high thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuitshort circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series isan ideal choice for applications requiring electrical isolation,suchas power devices, new energy vehicles, and portable electronic devices.
Features
- Good thermal conductive 3.0W/mK
- Moldability for complex parts
- Soft and compressible for low stress applications
- RoHS compliant
- UL recognized
- Easy release construction
Application
- Cooling components to the chassis of frame
- High speed mass storage drives
- Heat Sinking Housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
- Display card
- Heat pipe thermal solutions
- Memory Modules
- Mass storage devices
- Automotive electronics
- Set top boxes
- Audio and video components
Technical Specifications of TIF®️200-30-50S Series
| Property |
Value |
Test Method |
| Color(Silicone Cloth/Silicone) |
Pink |
Visual |
| Construction |
Ceramic filled silicone elastomer |
- |
| Density (g/cm³) |
3 |
ASTM D792 |
| Thickness Range |
0.010" (0.25mm) / |
ASTM D374 |
| 0.020"~0.200" (0.50~5.00mm) |
| Hardness (Shore 00) |
70 | 45 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
- |
| Breakdown Strength (V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
4.5 |
ASTM D150 |
| Volume Resistivity (Ohm-meter) |
＞1.0×10¹² |
ASTM D257 |
| Flame Rating |
V-0 |
UL 94 (E331100) |
| Thermal Conductivity (W/m-K) |
3.0 |
ASTM D5470 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).
Component Codes:
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF®️ series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Founded in 2006, ZIITEK is a professional manufacturer specializing in the development and production of thermal management materials. With nearly two decades of industry experience, ZIITEK has established a strong manufacturing and supply chain network with production facilities in Dongguan, Kunshan, Taiwan and Vietnam.
Our multi-site manufacturing footprint enables us to provide reliable supply, flexible production support and efficient delivery to customers worldwide.
ZIITEK offers a comprehensive portfolio of thermal management materials, including thermal pads, thermal gels, thermal greases, phase change materials, thermal potting compounds, thermally conductive plastics and other functional thermal materials. Our solutions are widely used in AI servers, data centers, electric vehicles, energy storage, communications, consumer electronics and industrial equipment.
By integrating R&D, manufacturing, precision processing and supply chain resources, ZIITEK provides flexible support for product development, customized solutions and mass production while enhancing supply stability and delivery efficiency.
From material development to global manufacturing, ZIITEK is committed to being a trusted thermal management partner for customers worldwide.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a manufacturer with facilities in China and Vietnam.
How long is your delivery time?
Generally 3-7 work days for in-stock items, or 7-10 work days for non-stock items, depending on quantity.
What Is a Thermal Interface Material (TIM)?
Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.
What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?
Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.
What Is Thermal Resistance in Thermal Interface Materials?
Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
What Is the Difference Between Thermal Conductivity and Thermal Resistance?
Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area and interface conditions.
Does Higher Thermal Conductivity Always Mean Better Cooling?
Not necessarily. Thickness, interface contact, compression and actual thermal resistance can significantly affect final cooling performance.
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