Highlight:
TIF100-20-10UF Thermally Conductive Gap Filler Pads For Mobile Phone, Smart Watch, Earphone, Mobile Power Supply
Thermally Conductive Gap Filler Pads For Mobile Phone, Smart Watch, Earphone, Mobile Power Supply
Product descriptions
TlF®️100-20-10UF Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive 2.0W/mK
> RoHS compliant
> UL recognized
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
Applications
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
| Typical Properties of TIF®100-20-10UF Series |
| Property |
Value |
Test method |
| Color |
Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
ZKTM J024 |
| Density(g/cm³) |
2.8 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.200 /0.25~5.00 |
ASTM D374 |
| Hardness (Shore oo) |
75 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
ZKTM J025 |
| Breakdown Strength (V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
6.5 |
ASTM D150 |
| Volume Resistivity (Ohm-cm) |
＞1.0X1012 |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity (W/m-K) |
2.0 |
ASTM D5470 |
| 2.0 |
ISO22007 |
Product Specifications:
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
The TIF®️ series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China / Vietnam
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q:What Is a Thermal Interface Material (TIM)?
A:Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.
Q:What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?
A:Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m·K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.
Q:What Is Thermal Resistance in Thermal Interface Materials?
A:Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
Q:What Is the Difference Between Thermal Conductivity and Thermal Resistance?
A:Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area and interface conditions.
Q:Does Higher Thermal Conductivity Always Mean Better Cooling?
A:Not necessarily. Thickness, interface contact, compression and actual thermal resistance can signi
ficantly affect final cooling performance.
Your message must be between 20-3,000 characters!
