CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
products
products
Home > products > Thermal Pad > TIF700HU Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad

TIF700HU Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF700HU

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

Get Best Price
Highlight:
Products Name:
TIF700HU Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad
Keywords:
Thermal Gap Filler Pad
Color:
Gray
Materials:
Ceramic Filled Silicone Elastomer
Thermal Conductivity:
10.0W/mK
Specific Gravity:
3.55g/cm³
Flame Rating:
94-V0
Sample:
Sample Free
Hardness:
50±10 Shore 00
Application:
GPU CPU Heatsink Cooling
Products Name:
TIF700HU Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad
Keywords:
Thermal Gap Filler Pad
Color:
Gray
Materials:
Ceramic Filled Silicone Elastomer
Thermal Conductivity:
10.0W/mK
Specific Gravity:
3.55g/cm³
Flame Rating:
94-V0
Sample:
Sample Free
Hardness:
50±10 Shore 00
Application:
GPU CPU Heatsink Cooling
TIF700HU Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad

TIF700HU Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad

 

Product descriptions

 

TIFTM700HU Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features

> Good thermal conductive 10.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available

 

Application

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> CPU
> Display card
> Mainboard/mother board
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)

 

 

Typical Properties of TIFTM700HU Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.55g/cc ASTM D297
thickness 0.040"(1.0mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness>0.75mm) 50±10 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 4.5MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 10.0W/m-K ASTM D5470

 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

Product Thicknesses:

Product Thicknesses:0.020-inch to 0.200-inch(0.5mm to 5.0mm)

Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming.
Safe disposal method does not require special protection. The storage condition is low temperature and dry , away from openfire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

TIF700HU Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Tags: