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TIF700PUS Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers
TIF700PUS Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers
The TIF®700PUS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.
Features
> Excellent thermal conductivity:7.5 W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> High insulation performance
Applications
> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
| Typical Properties of TIF®700PUS Series |
| Property |
Value |
Test method |
| Color |
Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.2 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.020~0.030
(0.50~0.75)
|
0.040~0.200 (1.0~5.0) |
ASTM D374 |
| Hardness |
70 Shore 00 |
27 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
*** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @ 1MHz |
4.5 |
ASTM D150 |
| Volume Resistivity |
＞3.5X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
7.5 W/m-K |
ASTM D5470 |
| 7.5 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness:0.020" (0.50 mm)~0.20" (5.00 mm) with increments of 0.01" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)
Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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