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Home > products > Thermal Pad > TIF700HP Silicone Thermal Pad 7.5W/M-K Insulation Conductive Pads Thermal Gap Pad For Unmanned Aerial Vehicle(UAV)

TIF700HP Silicone Thermal Pad 7.5W/M-K Insulation Conductive Pads Thermal Gap Pad For Unmanned Aerial Vehicle(UAV)

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF700HP

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

Get Best Price
Highlight:
Products Name:
TIF700HP Silicone Thermal Pad 7.5W/M-K Insulation Conductive Pads Thermal Gap Pad For Unmanned Aerial Vehicle(UAV)
Keywords:
Thermal Gap Pad
Color:
Gray
Hardness:
45±5 Shore 00
Materials:
Ceramic Filled Silicone Elastomer
Thermal Conductivity:
7.5W/mK
Specific Gravity:
3.3g/cm³
Flame Rating:
94-V0
Sample:
Sample Free
Application:
Unmanned Aerial Vehicle(UAV)
Products Name:
TIF700HP Silicone Thermal Pad 7.5W/M-K Insulation Conductive Pads Thermal Gap Pad For Unmanned Aerial Vehicle(UAV)
Keywords:
Thermal Gap Pad
Color:
Gray
Hardness:
45±5 Shore 00
Materials:
Ceramic Filled Silicone Elastomer
Thermal Conductivity:
7.5W/mK
Specific Gravity:
3.3g/cm³
Flame Rating:
94-V0
Sample:
Sample Free
Application:
Unmanned Aerial Vehicle(UAV)
TIF700HP Silicone Thermal Pad 7.5W/M-K Insulation Conductive Pads Thermal Gap Pad For Unmanned Aerial Vehicle(UAV)

TIF700HP Silicone Thermal Pad 7.5W/M-K Insulation Conductive Pads Thermal Gap Pad For Unmanned Aerial Vehicle(UAV)

 

Product descriptions

 

TIFTM700HP Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features

> Good thermal conductive 7.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

 

Application

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> CPU
> Display card
> Mainboard/mother board
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)

Typical Properties of TIFTM700HP Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.3g/cc ASTM D297
thickness 0.020"(0.5mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness ≥1.0mm) 45±5 Shore 00 ASTM 2240
Hardness (thickness <1.0mm) 55±5 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 4.5MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 7.5W/m-K ASTM D5470

 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

Product Thicknesses:

Product Thicknesses:0.020-inch to 0.200-inch(0.5mm to 5.0mm)

Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming.
Safe disposal method does not require special protection. The storage condition is low temperature and dry , away from openfire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

TIF700HP Silicone Thermal Pad 7.5W/M-K Insulation Conductive Pads  Thermal Gap Pad For Unmanned Aerial Vehicle(UAV) 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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