CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
products
products
Home > products > Thermal Pad > TIF100-35-11UF High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

TIF100-35-11UF High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF100-35-11UF

Payment & Shipping Terms

Minimum Order Quantity: 1000pcs

Price: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

Get Best Price
Highlight:
PrHigh Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Padoducts Nam:
High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element
Thermal Conductivity:
2.0W/mK
Materials:
Ceramic Filled Silicone Elastomer
Hardness:
27 Shore 00
Keywords:
Thermal Pad
Application:
Pcb,LED, CPU & Electronic Component Gap Filling
Thickness Range:
0.020inch (0.5mmT)~0.200inch (5.0mm)
Color:
Dark Gray
Specific Gravity:
2.7g/cc
Flame Rating:
94-V0
PrHigh Quality Thickness 0.5mm To 5.0mm Insulated Thermal Pad Computer Cooling Thermal Padoducts Nam:
High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element
Thermal Conductivity:
2.0W/mK
Materials:
Ceramic Filled Silicone Elastomer
Hardness:
27 Shore 00
Keywords:
Thermal Pad
Application:
Pcb,LED, CPU & Electronic Component Gap Filling
Thickness Range:
0.020inch (0.5mmT)~0.200inch (5.0mm)
Color:
Dark Gray
Specific Gravity:
2.7g/cc
Flame Rating:
94-V0
TIF100-35-11UF High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

TIF100-35-11UF High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

 

Product descriptions

 

TIF®100-35-11UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features

 

> Good thermal conductive : 3.5W/mK
> Naturally tacky needing no further adhesive coating

> High compliance adapts to various pressure application environments
> Available in different thickness options

 

Applications
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED TV and lamps

Typical Properties of TIF®100-35-11UF Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer *******
Density 3.0g/cc ASTM D297
Thickness range 0.02~0.20inch / 0.5~5.0mmT ASTM C351
Hardness 75 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >5500 VAC ASTM D412
Operating Temp -40 ~200℃ *******
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 3.5W/mK ASTM D5470

 

Product Specifications
Standard Thickness:

0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).

 

Standard Size:

8"X16"(203 mm×406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.

For other thicknesses or moreinformation. please contact us.

TIF100-35-11UF High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Tags: