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TIF100N-15-16E Low Dielectric Silicone Thermal Gap Filler Pads For 5G Base Station
Low Dielectric Silicone Thermal Gap Filler Pads For 5G Base Station
Product descriptions
TIF®100N-15-16E Series is alow-dielectric thermal pad, a flexible thermal insulation material developed for high-frequency, high-integration, and signal-sensitive electronic devices, provides excellent thermal conductivity. This balanced design combines good surface fit and excellent operational convenience, taking into account both good heat dissipation and low-dielectric electrical properties. It meets the dual requirements of thermal management and signal transmission for precision electronic devices, wth stable performance and strong practicality.
Features
Good thermal conductivity
Excellentsoftnessand fillability
Self-adhesive without the need for additional surface adhesive
Highly compressible,easy to install and operat
Low dielectricconstanteffectively reduces signal loss
Applications
Millimeter wave radar
Semiconductor Microwave Components
5G base station
RF power amplifier
High performance computing / server memory
| Typical Properties of TIF®100N-15-16E Series |
| Property |
Value |
Test method |
| Color |
Purple |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
- |
| Density(g/cm³) |
1.5 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010"~0.020" |
0.030"~0.200" |
ASTM D374 |
| 0.25~0.50 |
0.75~5.00 |
| Hardness( Shore 00) |
65 |
35 |
| Recommended Operating Temperature |
-40 to 200℃ |
- |
| Breakdown Strength(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
4.0 |
ASTM D150 |
| Volume Resistivity(Ohm·cm) |
＞1.0X1012 |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
1.5 W/m-K |
ASTM D5470 |
| 1.5 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25mm)
Standard Size:16"X16" (406 mmX406 mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Independent R&D team
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