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TIF100L-3040-06 3.0W/MK Thermal Gap Filler Pads With Thermal Conductivity And Low Volatile For Precision Devices
3.0W/MK Thermal Gap Filler Pads With Thermal Conductivity And Low Volatile For Precision Devices
Product descriptions
The TIF®100L 3040-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits. And the material has excellent flexibility and elasticity, which can fully fill the micro gaps between the heating interface and the heat dissipation structure, significantly reduce the contact thermal resistance,improve the thermal conductivity efficiency, and ensure the reliability and service life of electronic components in long-term operation.
Features
> Ultra low volatility of siloxane
> Good thermal conductivity
> Excellent weather resistance and aging resistance
> Highly compressible, easy to install and operate
> Good insulation performance
Applications
> Motor Controller (MCU)
> Airborne computer
> Machine vision camera
> High performance ASIC chip
> Central control screen
| Typical Properties of TIF®100L 3040-06 Series |
| Property |
Value |
Test method |
| Color |
White |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.0 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020 |
0.030~0.200 |
ASTM D374 |
| 0.25~0.50 |
0.75~5.00 |
| Hardness (Shore 00) |
65 |
40 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Volume Resistivity(Ohm-meter) |
＞1.0X1012 |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| ∑D3-D10(PPM) |
<100 |
GC-MS |
| Thermal conductivity |
3.0W/m-K |
ASTM D5470 |
| 3.0W/m-K |
ISO22007 |
Product Specifications
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm),with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmx406 mm)
The TIF® series is available in custom shapes andvarious forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
VIETNAM ZITEK TECHNOLOGYCOMPANYLIMITD is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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