TIS680-28AB Silica Gel Thermal-Conducting Potting Compound Two Component Offering Flexibility Elasticity And Heat Transfer For Electronics

 TIS^®680-28AB is a two-component potting adhesive.When Component A and Component B are mixed in a specific ratio, the adhesive can cure and form into' shape either at room temperature or under heating conditions. After curing, it forms a dense elastomer with integrated performance characteristics: good thermal conductivity, electrical insulation, resistance to extreme temperatures, and anti-aging properties. It features low shrinkage rate, can closely adhere to various substrates, and effectively fills thegaps between electronic components. This product delivers comprehensive protection for electronic assemblies, including thermal conduction, insulation, waterproofing, shock absorption, flame retardancy, and mechanical safeguarding.

Company Profile

Vietnam Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Independent R&D team

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