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TIF100 5030-05 Thermal Conductive Pad Offering 5.0W/MK Heat Dissipation Performance Across Wide Temperature Range And Multiple Thickness Options
Thermal Conductive Pad Offering 5.0W/MK Heat Dissipation Performance Across Wide Temperature Range And Multiple Thickness Options
Product descriptions
TIF®100 5030-05 Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Features:
> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications:
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
| Typical Properties of TIF®100 5030-05 Series |
| Property |
Value |
Test method |
| Color |
Blue |
Visual |
| Construction |
Ceramic filled silicone elastomer |
- |
| Density(g/cm³) |
3.2 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020 |
0.030~0.200 |
ASTM D374 |
| 0.25~0.50 |
0.75~5.00 |
| Hardness (Shore 00) |
65 |
30 |
ASTM 2240 |
| Recommended Operating Temperature (℃) |
-40 to 200 |
- |
| Breakdown Strength (V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
9.0 |
ASTM D150 |
| Volume Resistivity (Ohm-cm) |
＞1.0X1012 |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity (W/m-K) |
5.0 |
ASTM D5470 |
| 5.0 |
ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
Thermal gap pad
Thermal graphite sheet/film
Thermal double-sided tape
Thermal insulation pad
Thermal grease
Phase change material
Thermal gel
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Independent R&D team
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