Product Details
Place of Origin: Vietnam
Brand Name: Ziitek
Certification: UL and RoHs
Model Number: TIG680-20AB
Payment & Shipping Terms
Minimum Order Quantity: 10KG
Price: 0.1-10 USD/kg
Packaging Details: 1kg/can
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 10000KG/month
Products Name: |
Good Thermal Conductive 2.0W/MK Two Component Silicone Potting Compound For Aerospace Electronic Components |
Keywords: |
Silicone Potting Compound |
Material: |
Ceramic-filled Silicone |
Density(g/cm³): |
2.9 |
Thermal Conductivity: |
2.0W/mk |
Application: |
Aerospace Electronic Components |
Color: |
Gray |
Hardness: |
20(Shore A) |
Dielectric Constant @1MHz: |
6.5 |
Products Name: |
Good Thermal Conductive 2.0W/MK Two Component Silicone Potting Compound For Aerospace Electronic Components |
Keywords: |
Silicone Potting Compound |
Material: |
Ceramic-filled Silicone |
Density(g/cm³): |
2.9 |
Thermal Conductivity: |
2.0W/mk |
Application: |
Aerospace Electronic Components |
Color: |
Gray |
Hardness: |
20(Shore A) |
Dielectric Constant @1MHz: |
6.5 |
Good Thermal Conductive 2.0W/MK Two Component Silicone Potting Compound For Aerospace Electronic Components
TIG®680-20AB is a two-component addition-curing silicone material. When the A and B components are mixed in a specific ratio, it can cure and form at room temperature or under heating conditions. After curing, it forms a dense elastomer with good thermal conductivity, electrical insulation, resistance to high and low temperatures, and anti-aging properties. The curing process produces no by-products and features low shrinkage, enabling tight adhesion to various substrates, effective filling of gaps in electronic components, and realization of thermal conduction, insulation, waterproofing, shock absorption, flame retardancy and mechanical protection for electronic assemblies..
Feature
>Good thermal conductive
>Good insulation performance
>Good elasticity
>Lower shrinkage
>Low viscosity, easy gas emissions
>Good solvent resistance and waterproof performance
>longer working hours
>Excellent high and low temperature resistance
>No odor release during the curing process
| Typical Properties of TIG®680-20AB | ||
| Uncured Material Properties | ||
| Property | Value | Test Method |
| Composition | Ceremic-filled silicone | - |
| Color/Part A | White | Visual |
| Color/Part B | Gray | Visual |
| Part A Viscosity (mPa.s) | 8200 | GB/T D2196 |
| Part B Viscosity (mPa.s) | 9600 | GB/T D2196 |
| Mix Ratio | 1:1 | - |
| Cure Schedule | ||
| Cure @25℃ (min) | 20~30 | ZKTM G010 |
| Cure @70℃ (min) | 10 | ZKTM G010 |
| Cure Material Properties | ||
| Color | Gray | Visual |
| Hardness (Shore A) | 20 | ASTM D2240 |
| Density (g/cm³) | 2.9 | ASTM D792 |
| Recommended Operating temperature (℃) | -45 ~200 | ZKTM J025 |
| Flame Rating | V-0 | UL 94 |
| Thermal Conductivity (W/mK) | 2.0 | ASTM D5470 |
| Breakdown Strength (V/mm) | ≥10000 | ASTM D149 |
| Dielectric Constant @1MHz | 6.5 | ASTM D150 |
| Volume Resistivity (Ohm·cm) | >1.0x1012 | ASTM D257 |
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Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Viet Nam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Q:What is a Thermal Interface Material (TIM)?
A:TIM (Thermal Interface Material) refers to a class of materials used to fill microscopic air gaps between a heat source and a heat sink. TIMs help reduce interface thermal resistance and improve heat transfer from the heat source to the cooling structure. Common TIMs include thermal pads, thermal gels, thermal greases, phase change materials (PCMs), and liquid metal.
Q:What is Thermal Conductivity?
A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m·K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.
Q:What is Thermal Resistance?
A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.
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