Highlight:
TIF060-16 Purple Silicone Thermal Gel For CPU
TIF060-16 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility.
Due to TIF060-16 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF060-16 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility.
TIF060-16 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component.
Feature
> Thermal conductivity: 6.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Mass storage devices
> Automotive electronics
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
| TIFTM060-16 Typical Properties |
| Property |
Value |
Test method |
| Color |
Violet |
Visual |
| Construction & Composition |
Ceramic filled silicon material |
***** |
| Flow rate(g/min) |
85 |
Ziitek Test Method |
| Density |
3.4g/cm³ |
ASTM D297 |
| Thermal conductivity |
6.0W/mK |
ASTM D5470 |
| Thermal resistance @10Psi(℃-in²/W) |
0.06 |
ASTM D5470 |
| Thermal resistance @50Psi(℃-in²/W) |
0.05 |
ASTM D5470 |
| Specific heat capacity |
0.74 (J/g℃) |
ASTM E1269 |
| Dielectric breakdown strength(V/mm) |
≥4000 |
ASTM D149 |
| Bond line Thickness |
0.2mm |
ASTM D374 |
| Recommended Operating temp |
-45 ~200°C |
Ziitek Test Method |
| Shelf Life @25℃；Original Packing |
6 months |
****** |
| Flame Rating |
V-0 |
UL 94 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Q&A
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Your message must be between 20-3,000 characters!
