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TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF040-12

Payment & Shipping Terms

Minimum Order Quantity: 1000tube

Price: 0.1-10 USD/PCS

Packaging Details: 300cc/tube

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 1000000 tube/month

Get Best Price
Highlight:
Products Name:
Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu​
Keywords:
Thermal Conductive Gel
Application:
Heat Sink Dissipate Heat
Color:
Blue
Specific Gravity:
2.5g/cm³
Thermal Conductivity:
4.0W/mK
Continuous Use Temperature:
-45~200℃
Materail:
Ceramic Filled Silicon Material
Products Name:
Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu​
Keywords:
Thermal Conductive Gel
Application:
Heat Sink Dissipate Heat
Color:
Blue
Specific Gravity:
2.5g/cm³
Thermal Conductivity:
4.0W/mK
Continuous Use Temperature:
-45~200℃
Materail:
Ceramic Filled Silicon Material
TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu

TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu​

 

TIF040-12 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility.

Due to TIF040-12 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.


TIF040-12  operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility.

TIF040-12 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component.

 

Feature
> Thermal conductivity: 4.0W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly

> Proven long-term reliability

 

Application
> Mass storage devices
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> vihicel enginee controler

> Telecom industry
> Semiconductor automaticlaboratory equipment.

TIFTM040-12 Typical Properties
Property Value Test method
Color blue Visual
Construction & Composition Ceramic filled silicon material *****
Viscosity 2000 mPa.s GB/T 10247
Density 2.5g/cm³ ASTM D297
Thermal conductivity 4.0W/mK ASTM D5470
Thermal diffusivity 0.93 mm²/s ISO 22007-2
Specific heat capacity 2.2MJ/m3K ISO 22007-2
Continuous Use Temperature -45 ~200°C Ziitek Test Method
Dielectric breakdown strength 200 V/mil ASTM D149
Flame Rating 94V0 UL E331100

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu 0

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

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