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TIF050-11-1 Thermal Conductive Silicone Gel For Electronic Components

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF050-11-1

Payment & Shipping Terms

Minimum Order Quantity: 1000tube

Price: 0.1-10 USD/PCS

Packaging Details: 300cc/tube

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 1000000 tube/month

Get Best Price
Highlight:
Products Name:
Thermal Conductive Silicone Gel For Electronic Components
Breakdown Voltage (V/mm):
≥6000
Color:
Dark Gray
Application:
Electronic Components
Specific Gravity:
3.25g/cm³
Thermal Conductivity:
5.0W/mK
Keywords:
Thermal Gel
Materail:
Ceramic Filled Silicon Material
Products Name:
Thermal Conductive Silicone Gel For Electronic Components
Breakdown Voltage (V/mm):
≥6000
Color:
Dark Gray
Application:
Electronic Components
Specific Gravity:
3.25g/cm³
Thermal Conductivity:
5.0W/mK
Keywords:
Thermal Gel
Materail:
Ceramic Filled Silicon Material
TIF050-11-1 Thermal Conductive Silicone Gel For Electronic Components

TIF®050-11-1 Thermal Conductive Silicone Gel For Electronic Components

 

Prodcuts Discription

 

TIF®050-11-1 is a thermally conductive paste with excellent interface thermal resistance characteristics and outstanding plasticity, capable of fully meeting the strict thermal management performance requirements of various designs; this material has extremely low hardness, possesses free-forming ability, and is easy to construct and assemble, demonstrating good stability in high-temperature environments. Its low-stress characteristics are particularly suitable for electronic devices that require high precision and high reliability,effectively reducing the mechanical stress on sensitive components during assembly and operation, ensuring the long-term stable operation of products in various application environments.

 

Feature

 

> Thermal conductivity: 5.0 W/mK
> Low stress, protect sensitive components.
> Strong plasticity. good stability
> Superior dielectric properties

 

Application

 

> Power module
> LED backlight module, LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment

 

TIF®050-11-1 Typical Properties
Property Value Test method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicon material -
Density(g/cm³) 3.25g/c ASTM D792
Thermal conductivity 5.0W/mK ASTM D5470
Breakdown Voltage (V/mm) ≥6000 ASTM D149
Dielectric constant @1MHz 7.7 ADTM D150
Flame Rating V-0 UL 94
Volume resistivity(Ohm.cm) 8.0 X 1013 ASTM D257

 

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

TIF050-11-1 Thermal Conductive Silicone Gel For Electronic Components 0

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Q&A

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

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