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TIF020-19 Silicone Putty Thermal Gap Filler Thermal Conductive Gel

Name: TIF020-19 Silicone Putty Thermal Gap Filler Thermal Conductive Gel
Brand: CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
SKU: TIF020-19
Price: 4.10 USD
Availability: InStock

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF020-19

Payment & Shipping Terms

Minimum Order Quantity: 1000tube

Price: 0.1-10 USD/PCS

Packaging Details: 300cc/tube

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 1000000 tube/month

Get Best Price

Product Details

Product Description

Highlight:

Products Name:	TIF020-19 Silicone Putty Thermal Gap Filler Thermal Conductive Gel	Materail:	Ceramic Filled Silicon Material
Color:	Yellow	Specific Gravity:	2.6g/cm³
Thermal Conductivity:	2.0W/mK	Continuous Use Temperature:	-45~200℃
Keywords:	Thermal Conductive Gel

Products Name:	TIF020-19 Silicone Putty Thermal Gap Filler Thermal Conductive Gel
Materail:	Ceramic Filled Silicon Material
Color:	Yellow
Specific Gravity:	2.6g/cm³
Thermal Conductivity:	2.0W/mK
Continuous Use Temperature:	-45~200℃
Keywords:	Thermal Conductive Gel

TIF020-19 Silicone Putty Thermal Gap Filler Thermal Conductive Gel

TIF020-19 Silicone Putty Thermal Gap Filler Thermal Conductive Gel

TIF020-19 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF020-19 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF020-19 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF020-19 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component.

Feature
> Thermal conductivity: 2.0W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly
> Proven long-term reliability

Application
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling

TIF^®020-19 Typical Properties
Property	Value	Test method
Color	Yellow	Visual
Construction & Composition	Ceramic filled silicon material	-
Flow Rate(g/min)	90	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Flow Rate(g/min)	90	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Specific Gravity	2.6g/c	ASTM D297
Thermal conductivity	2.0W/mK	ISO 22007-2
Impedance @10psi (℃.in²w)	0.143	ASTM D5470
Impedance @50psi (℃.in²w)	0.114	ASTM D5470
Continuous Use Temperature	-45 ~200°C	******
Dielectric Strength(V/mm)	≥4000	ISO 22007-2
Bond Line Thickness(mm)	0.1	Ziitek est Mothod
Flame Rating	V-0	UL 94
Shelf Life	12 months	-

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

TIF020-19 Silicone Putty Thermal Gap Filler Thermal Conductive Gel 1

Company Profile

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Q&A

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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