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TIF060-16 Purple Silicone Thermal Gel For CPU

Name: TIF060-16 Purple Silicone Thermal Gel For CPU
Brand: CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
SKU: TIF060-16
Price: 4.10 USD
Availability: InStock

Product Details

Place of Origin: Vietnam

Brand Name: Ziitek

Certification: RoHS

Model Number: TIF060-16

Payment & Shipping Terms

Minimum Order Quantity: 1000tube

Price: 0.1-10 USD/PCS

Packaging Details: 300cc/tube

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 1000000 tube/month

Get Best Price

Product Details

Product Description

Highlight:

Products Name:	TIF060-16 TIF060-16 Purple Silicone Thermal Gel For CPU	Materail:	Ceramic Filled Silicon Material
Color:	Purple	Application:	CPU Electronic Component Gap Filling
Specific Gravity:	3.4g/cm³	Continuous Use Temperature:	-45~200℃
Keywords:	Thermal Conductive Gel	Thermal Conductivity:	6.0W/mK

Products Name:	TIF060-16 TIF060-16 Purple Silicone Thermal Gel For CPU
Materail:	Ceramic Filled Silicon Material
Color:	Purple
Application:	CPU Electronic Component Gap Filling
Specific Gravity:	3.4g/cm³
Continuous Use Temperature:	-45~200℃
Keywords:	Thermal Conductive Gel
Thermal Conductivity:	6.0W/mK

TIF060-16 Purple Silicone Thermal Gel For CPU

TIF060-16 Purple Silicone Thermal Gel For CPU

Prodcuts description

TIF^®060-16 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF^®060-16 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronic components.

Feature

> Thermal conductivity: 6.0W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly
> Proven long-term reliability

Application

> Mass storage devices
> Automotive electronics
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes

TIF^®060-16 Typical Properties
Property	Value	Test method
Color	Purple	Visual
Construction & Composition	Ceramic filled silicon material	-
Flow Rate(g/min)	36	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Flow Rate(g/min)	36	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc)	3.40g/c	ASTM D297
Thermal conductivity	6.0W/mK	ASTM D5470
Thermal Impedance @10psi (℃.in²w)	0.071	ASTM D5470
Thermal Impedance @50psi (℃.in²w)	0.055	ASTM D5470
Recommended Operating Temp	-45 ~200°C	Ziitek Test Method
Dielectric Strength(V/mm)	≥4000	ASTM D149
Bond Line Thickness(mm)	0.2	Ziitek Test Mothod
Flame Rating	V-0	UL 94
Shelf Life	12 months	-

Product Specification:
30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

TIF060-16 Purple Silicone Thermal Gel For CPU 0

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Q&A

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

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